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CN-224218688-U - Energy storage radiator

CN224218688UCN 224218688 UCN224218688 UCN 224218688UCN-224218688-U

Abstract

The application relates to an energy storage radiator. The energy storage radiator comprises a heat conduction shell and a semiconductor refrigerator. The heat-conducting shell is internally provided with a heat-radiating cavity, graphene modified paraffin is filled in the heat-radiating cavity, a first end of the semiconductor refrigerator is used for being connected with the heat-conducting shell, and a second end of the semiconductor refrigerator is used for being connected with a piece to be heat-radiated. The semiconductor refrigerator can rapidly start refrigerating after being electrified, the graphene modified paraffin can rapidly absorb heat, the whole radiator can respond to heat change in a short time, and the heat dissipation part to be cooled can be guaranteed to be capable of timely and effectively dissipating heat during starting operation. The energy storage radiator can be stored for a long time, and can radiate heat in a narrow space.

Inventors

  • ZHANG HAIPING
  • SUN QINGZE
  • SUN SHUAILING
  • HUO YUJIA
  • LI JIONGLI
  • WANG XUDONG

Assignees

  • 北京石墨烯技术研究院有限公司

Dates

Publication Date
20260508
Application Date
20250401

Claims (10)

  1. 1. An energy storage heat sink, the energy storage heat sink comprising: a heat-conducting shell (1000) and a semiconductor refrigerator (2000), A heat dissipation chamber (1001) is arranged in the heat conduction shell (1000), and graphene modified paraffin is filled in the heat dissipation chamber (1001); The first end of the semiconductor refrigerator (2000) is used for being connected with the heat conducting shell (1000), and the second end of the semiconductor refrigerator (2000) is used for being connected with a heat dissipation part (3000).
  2. 2. The energy storage radiator according to claim 1, characterized in that the interior of the heat dissipation chamber (1001) comprises a thermally conductive inner side wall (1002), the thermally conductive inner side wall (1002) being arranged close to the first end of the semiconductor refrigerator (2000), a plurality of thermally conductive fins (4000) extending into the graphene-modified paraffin being arranged on the thermally conductive inner side wall (1002).
  3. 3. The energy storage radiator according to claim 2, characterized in that the first end of the semiconductor cooler (2000) is connected to the heat conducting outer side wall (1003) of the heat conducting housing (1000), a temperature equalizing plate (5000) being sandwiched between the heat conducting inner side wall (1002) and the heat conducting outer side wall (1003).
  4. 4. The energy storage radiator according to claim 2, characterized in that a heat transfer connection (6000) is provided on the second end of the semiconductor cooler (2000), the heat transfer connection (6000) being adapted to be connected between the piece to be cooled (3000) and the second end of the semiconductor cooler (2000), the heat transfer connection (6000) being in a contoured fit with the surface of the piece to be cooled (3000).
  5. 5. A heat storage radiator according to claim 3, characterized in that the area of the first end of the semiconductor cooler (2000) is smaller than the area of the thermally conductive outer side wall (1003).
  6. 6. A heat storage radiator according to claim 3, characterized in that the temperature equalization plates (5000) are evenly distributed on the thermally conductive inner side wall (1002).
  7. 7. The energy storage radiator according to claim 2, characterized in that the thermally conductive sheet (4000) is integrally formed with the thermally conductive housing (1000).
  8. 8. The energy storage radiator according to claim 3, wherein the temperature equalizing plate (5000) is one of a pure diamond plate, a graphene-aluminum composite plate, a diamond-aluminum composite plate or a graphene plate; and/or the number of the groups of groups, The heat conducting sheet (4000) is one of an aluminum alloy sheet, a diamond sheet, a graphene aluminum composite sheet and a diamond aluminum composite sheet.
  9. 9. The energy storage radiator according to claim 1, characterized in that the heat dissipation chamber (1001) is provided in a sealed manner.
  10. 10. The energy storage radiator of claim 1, further comprising a power supply system electrically connected to the semiconductor refrigerator (2000).

Description

Energy storage radiator Technical Field The application relates to the technical field of new material heat dissipation, in particular to an energy storage heat radiator. Background Some electronic components have very severe requirements on working temperature, need to operate in a precise temperature range, and can continuously generate heat during working. Under the conventional environment, the radiator can meet the temperature control requirement of the radiator by matching with an air conditioner, but the conventional heat dissipation combination cannot be implemented due to space limitation in a narrow closed space. At present, low-temperature liquid cooling modes such as liquid nitrogen, liquid CO 2 and the like adopted for a narrow closed space also have a plurality of defects. These low-temperature liquids are volatile, difficult to store and difficult to preserve for a long time, and the operation of filling the refrigerating fluid before use is complicated, the preparation time is long, and the heat dissipation requirement of the electronic device cannot be responded quickly. In other cases, long-term storage is required, but the actual use time is short. The adopted fan and other similar heat dissipation devices are easy to age in long-term storage due to parts such as bearings and the like, and short-term stable operation of only a few minutes is difficult to ensure. In summary, it is urgent to develop a heat dissipation technology that can efficiently dissipate heat in a narrow enclosed space, does not require complex preparation work, can be stored reliably for a long period of time, and can respond quickly, which is important to ensure stable operation of various electronic device chips and improve overall performance of electronic equipment. Disclosure of utility model Based on this, it is necessary to provide an energy storage radiator against the shortcomings of the current radiator. An energy storage heat sink comprising: a heat-conducting shell and a semiconductor refrigerator, A heat dissipation cavity is arranged in the heat conduction shell, and graphene modified paraffin is filled in the heat dissipation cavity; The first end of the semiconductor refrigerator is used for being connected with the heat conducting shell, and the second end of the semiconductor refrigerator is used for being connected with the heat dissipation piece. In one embodiment, the heat dissipation chamber comprises a heat conduction inner side wall, the heat conduction inner side wall is arranged close to the first end of the semiconductor refrigerator, and a plurality of heat conducting fins extending into the graphene modified paraffin are arranged on the heat conduction inner side wall. In one embodiment, the first end of the semiconductor refrigerator is connected to the heat conducting outer side wall of the heat conducting shell, and a temperature equalizing plate is arranged between the heat conducting inner side wall and the heat conducting outer side wall. In one embodiment, a heat transfer connector is disposed on the second end of the semiconductor refrigerator, and the heat transfer connector is used for being connected between the to-be-cooled member and the second end of the semiconductor refrigerator, and the heat transfer connector is in profiling fit with the surface of the to-be-cooled member. In one embodiment, the area of the first end of the semiconductor refrigerator is smaller than the area of the thermally conductive outer side wall. In one embodiment, the temperature uniformity plates are uniformly distributed on the thermally conductive inner side wall. In one embodiment, the thermally conductive sheet is integrally formed with the thermally conductive housing. In one embodiment, the temperature equalizing plate is one of a pure diamond plate, a graphene-aluminum composite plate, a diamond-aluminum composite plate or a graphene plate; and/or the number of the groups of groups, The heat conducting sheet is one of an aluminum alloy sheet, a diamond sheet, a graphene aluminum composite sheet and a diamond aluminum composite sheet. In one embodiment, the heat dissipation chamber is hermetically sealed. In one embodiment, the semiconductor refrigerator further comprises a power supply system, and the power supply system is electrically connected with the semiconductor refrigerator. The energy storage radiator comprises a heat conduction shell and a semiconductor refrigerator. The heat-conducting shell is internally provided with a heat-radiating cavity, graphene modified paraffin is filled in the heat-radiating cavity, a first end of the semiconductor refrigerator is used for being connected with the heat-conducting shell, and a second end of the semiconductor refrigerator is used for being connected with a piece to be heat-radiated. The heat conduction shell is internally provided with a heat dissipation cavity, and graphene modified paraffin is filled in the heat dissipation cavity. The