CN-224218691-U - Heat radiation structure of beauty instrument

Abstract

The application relates to a radiating structure of a beauty instrument, which comprises a shell, a contact cover, a refrigeration structure and at least one first radiating structure, wherein one end of the shell is of an opening structure, the contact cover is connected with the opening structure of the shell and seals the opening structure, the shell and the contact cover form a containing space, the refrigeration structure is arranged in the containing space and is attached to the contact cover, one surface of the refrigeration structure, which is close to the contact cover, is a cold surface, one surface of the refrigeration structure, which is far away from the contact cover, is a hot surface, the first radiating structure is connected with the hot surface of the refrigeration structure, and the refrigeration structure cools down on the cold surface and is transmitted through the contact cover when in operation, heats up on the hot surface and conducts heat to the first radiating structure. According to the application, the first heat dissipation structure is arranged to absorb and dissipate heat generated by the refrigeration structure, so that the temperature of the refrigeration structure is not too high after the refrigeration structure works for a period of time, and the product endurance time is improved.

Inventors

• WANG NIANOU
• LI KE
• LIANG HUAN
• Chu Wenjin
• SHAO CHEN
• CHEN XINYU

Assignees

• 深圳市宗匠科技有限公司

Dates

Publication Date

20260508

Application Date

20250408

Claims (11)

1. 1. The heat dissipation structure of the beauty instrument is characterized by comprising a shell, a contact cover, a refrigeration structure and at least one first heat dissipation structure, wherein one end of the shell is of an opening structure, the contact cover is connected with the opening structure of the shell and seals the opening structure, the shell and the contact cover form a containing space, the refrigeration structure is arranged in the containing space and is attached to the contact cover, one surface of the refrigeration structure, which is close to the contact cover, is a cold surface, one surface of the refrigeration structure, which is far away from the contact cover, is a hot surface, the first heat dissipation structure is connected with the hot surface of the refrigeration structure, and the refrigeration structure is cooled on the cold surface and is transmitted through the contact cover during operation, and the hot surface is heated and conducts heat to the first heat dissipation structure.
2. 2. The heat dissipation structure of a cosmetic instrument of claim 1, further comprising a PCBA main board, wherein the PCBA main board is fixedly arranged in the accommodating space, and the refrigeration structure is electrically connected with the PCBA main board.
3. 3. The heat dissipating structure of claim 2 further comprising at least one second heat dissipating structure coupled to said PCBA motherboard, said PCBA motherboard operative to conduct a portion of heat generated to said second heat dissipating structure.
4. 4. The heat radiation structure of the cosmetic instrument of claim 1, wherein a first flexible heat conducting material is arranged between the refrigeration structure and the first heat radiation structure, and the first flexible heat conducting material is closely attached to the hot surface of the refrigeration structure and the first heat radiation structure respectively.
5. 5. The heat radiation structure of the cosmetic instrument of claim 3, wherein a second flexible heat conducting material is arranged between the second heat radiation structure and the PCBA main board, and the second flexible heat conducting material is respectively and tightly attached to the second heat radiation structure and the PCBA main board.
6. 6. The heat radiation structure of the cosmetic instrument of claim 3 further comprising a temperature detection sensor, wherein the temperature detection sensor is arranged on the PCBA main board and is close to the second heat radiation structure, the temperature detection sensor is electrically connected with the PCBA main board, the temperature detection sensor detects the temperature of the second heat radiation structure and sends a detection signal to the PCBA main board when working, a temperature threshold is arranged in the PCBA main board, the PCBA main board converts the detection signal into an actual temperature value and compares the actual temperature value with the temperature threshold, and when the actual temperature value is larger than the temperature threshold, the PCBA main board performs shutdown and gives an alarm operation.
7. 7. The heat dissipating structure of the cosmetic instrument of claim 3 wherein the first heat dissipating structure and the second heat dissipating structure are made of aluminum alloy or magnesium alloy.
8. 8. The heat dissipating structure of the cosmetic instrument of claim 3 wherein the first heat dissipating structure and the second heat dissipating structure are integrally formed or separately configured.
9. 9. The heat dissipating structure of the cosmetic instrument of claim 1 wherein said housing comprises a left shell and a right shell, said left shell being detachably connected to said right shell, said left shell, said right shell, and said contact cover forming said receiving space.
10. 10. The heat dissipating structure of claim 2 further comprising a battery and a charging interface, wherein the battery is fixedly disposed in the accommodating space, the charging interface is partially disposed in the accommodating space, and partially exposed from a housing end away from the contact cover, and the battery and the charging interface are respectively electrically connected to the PCBA motherboard.
11. 11. The heat radiation structure of the cosmetic instrument of claim 3 wherein at least one protruding heat radiation structure is disposed on a side of the second heat radiation structure near the PCBA motherboard, and the protruding heat radiation structure is connected with the PCBA motherboard.

Description

Heat radiation structure of beauty instrument Technical Field The application relates to the technical field of heat dissipation of beauty treatment instruments, in particular to a heat dissipation structure of a beauty treatment instrument. Background The beauty instrument is generally designed into a small and exquisite structure, and simultaneously, in order to avoid that water and cosmetic liquid enter the beauty instrument to influence the performance of a product and influence user experience, the appearance surface is inconvenient to be provided with ventilation holes for heat dissipation of the inside of the product. Especially to the beauty instrument with cold compress function, because the inside piece that generates heat that is provided with of product, like semiconductor refrigeration piece and PCBA etc. all can generate heat after working a period, the inside high temperature of product influences the performance of device, leads to the product to be unable to work even, and partial component work under long-term high temperature environment simultaneously also can increase the attenuation degree of component performance, and then reduces the life of product. Accordingly, the prior art has drawbacks and needs improvement. Disclosure of Invention The application provides a radiating structure of a beauty instrument, which aims to solve the problems that the performance of a device is influenced and even the product cannot work due to the fact that the semiconductor refrigerating sheet, the PCBA and other elements which can generate heat during working are arranged in the beauty instrument with a cold compress function, and the semiconductor refrigerating sheet and the PCBA are heated to be higher after a period of working, and meanwhile, the attenuation degree of the performance of the elements is increased due to the fact that part of elements work in a long-term high-temperature environment, so that the service life of the product is reduced. In a first aspect, the application provides a heat dissipation structure of a cosmetic instrument, which comprises a shell, a contact cover, a refrigeration structure and at least one first heat dissipation structure, wherein one end of the shell is an opening structure, the contact cover is connected with the opening structure of the shell and seals the opening structure, the shell and the contact cover form a containing space, the refrigeration structure is arranged in the containing space and is attached to the contact cover, one surface of the refrigeration structure, which is close to the contact cover, is a cold surface, one surface, which is far away from the contact cover, is a hot surface, the first heat dissipation structure is connected with the hot surface of the refrigeration structure, and the refrigeration structure cools down on the cold surface and is transmitted through the contact cover when working, heats up on the hot surface and conducts heat to the first heat dissipation structure. Optionally, the refrigerator further comprises a PCBA main board, wherein the PCBA main board is fixedly arranged in the accommodating space, and the refrigerating structure is electrically connected with the PCBA main board. Optionally, the device further comprises at least one second heat dissipation structure, wherein the second heat dissipation structure is connected with the PCBA main board, and part of heat generated by the PCBA main board during operation is conducted to the second heat dissipation structure. Optionally, a first flexible heat conducting material is arranged between the refrigeration structure and the first heat dissipation structure, and the first flexible heat conducting material is respectively and tightly attached to the hot surface of the refrigeration structure and the first heat dissipation structure. Optionally, a second flexible heat conducting material is arranged between the second heat dissipation structure and the PCBA motherboard, and the second flexible heat conducting material is respectively and tightly attached to the second heat dissipation structure and the PCBA motherboard. Optionally, the device further comprises a temperature detection sensor, the temperature detection sensor is arranged on the PCBA motherboard and is close to the second heat dissipation structure, the temperature detection sensor is electrically connected with the PCBA motherboard, the temperature detection sensor detects the temperature of the second heat dissipation structure and sends detection signals to the PCBA motherboard during operation, a temperature threshold is arranged in the PCBA motherboard, the PCBA motherboard converts the detection signals into an actual temperature value and compares the actual temperature value with the temperature threshold, and when the actual temperature value is larger than the temperature threshold, the PCBA motherboard performs shutdown and sends out alarm operation. Optionally, the materials of th