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CN-224218704-U - Liquid cooling system

CN224218704UCN 224218704 UCN224218704 UCN 224218704UCN-224218704-U

Abstract

The utility model discloses a liquid cooling system, which comprises a direct liquid cooling loop, a system board and a cooling distribution unit. The direct liquid cooling loop comprises a flexible pipe section, a proximal connector, a distal connector and a cold plate. The proximal connection end of the flexible tube segment is coupled to the proximal joint engagement end of the proximal joint by a proximal overlap joint. The distal connection end of the flexible tube segment is coupled to the distal joint engagement end of the distal joint by a distal lap joint. The flexible tube segment is in fluid communication with at least one of the inlet and the outlet of the cold plate. The first integrated circuit element of the system board is physically and thermally coupled to the direct liquid cooling loop through the cold plate. The cooling distribution unit is in fluid communication with the direct liquid cooling loop to provide the working fluid to the direct liquid cooling loop.

Inventors

  • SHI HONGYI
  • Lin Genghan
  • LIAN GUOZHEN

Assignees

  • 讯凯国际股份有限公司

Dates

Publication Date
20260508
Application Date
20250509
Priority Date
20240626

Claims (15)

  1. 1. A liquid cooling system comprising: at least one direct liquid cooling loop, each of the at least one direct liquid cooling loops comprising: at least one flexible tube section having a proximal connection end and a distal connection end; at least one proximal joint having a proximal joint engagement end, the proximal joint end being coupled to the proximal joint engagement end by a proximal overlap joint, and At least one distal joint having a distal joint engagement end, the distal connection end being coupled to the distal joint engagement end by a distal lap joint; At least one system board, each of the at least one system board comprising: At least one first integrated circuit element physically and thermally coupled to the at least one direct liquid cooling loop, and At least one second integrated circuit element not physically and thermally coupled to the at least one direct liquid cooling loop, and A cooling distribution unit is in fluid communication with the at least one direct liquid cooling loop to provide a working fluid to the at least one direct liquid cooling loop.
  2. 2. The liquid cooling system of claim 1, wherein the proximal landing joint is defined by at least one of a proximal joint socket of the proximal joint engagement end and a proximal connection socket of the proximal connection end, the proximal joint socket overlapping the proximal connection end and the proximal connection socket overlapping the proximal joint engagement end.
  3. 3. The liquid cooling system of claim 2, wherein a proximal socket depth of the proximal socket is within 3 mm to 5mm and a proximal socket depth of the proximal socket is within 3 mm to 5mm.
  4. 4. The liquid cooling system of claim 2, wherein a thickness of the proximal connector receptacle is 5 millimeters and a thickness of the proximal connector receptacle is 5 millimeters.
  5. 5. The liquid cooling system of claim 1, wherein the distal landing joint is defined by at least one of a distal joint socket of the distal joint engagement end and a distal connection socket of the distal connection end, the distal joint socket overlapping the distal connection end and the distal connection socket overlapping the distal joint engagement end.
  6. 6. The liquid cooling system of claim 1, further comprising a proximal filler metal and a distal filler metal, the proximal filler metal defining a proximal capillary space of the proximal overlap joint between the proximal connection end and the proximal joint end, the distal filler metal defining a distal capillary space of the distal overlap joint between the distal connection end and the distal joint end.
  7. 7. The liquid cooling system of claim 1, further comprising a supply manifold and a return manifold, the cooling distribution unit being fluidly coupled to the supply manifold and the return manifold, the supply manifold being further fluidly coupled to the at least one direct liquid cooling loop and the return manifold being further fluidly coupled to the at least one direct liquid cooling loop.
  8. 8. The liquid cooling system of claim 1, wherein each of the at least one direct liquid cooling loop further comprises at least one cold plate, and the at least one first integrated circuit element is thermally coupled to the at least one cold plate.
  9. 9. The liquid cooling system of claim 8, wherein the at least one cold plate comprises an inlet and an outlet, and the at least one flexible tube section is in fluid communication with at least one of the inlet and the outlet.
  10. 10. The liquid cooling system of claim 9, wherein the at least one flexible tube segment comprises a first flexible tube segment and a second flexible tube segment, the first flexible tube segment being in fluid communication with the outlet and the second flexible tube segment being in fluid communication with the inlet.
  11. 11. The liquid cooling system of claim 9, wherein the at least one cold plate comprises a first cold plate and a second cold plate and the at least one first integrated circuit element comprises two first integrated circuit elements, wherein one first integrated circuit element is thermally coupled to the second cold plate.
  12. 12. The liquid cooling system of claim 11, wherein the at least one flexible tube segment comprises a first flexible tube segment, a second flexible tube segment, and a third flexible tube segment, the first flexible tube segment being in fluid communication with the outlet of the first cold plate, the second flexible tube segment being in fluid communication with the inlet of the second cold plate, and the third flexible tube segment being in fluid communication with the inlet of the first cold plate and the outlet of the second cold plate.
  13. 13. The liquid cooling system of claim 1, wherein the at least one proximal fitting comprises at least one of a straight rigid tube segment, a bent rigid tube segment, a barb fitting, a fluid fitting, a sleeve, a push-in adapter, an angle adapter, and a spacer fitting.
  14. 14. The liquid cooling system of claim 1, wherein the at least one distal joint comprises at least one of a straight rigid tube segment, a bent rigid tube segment, a barb joint, a fluid joint, a sleeve, a push-in adapter, an angle adapter joint, and a spacer joint.
  15. 15. The liquid cooling system of claim 1, wherein the at least one flexible tube section is made of corrugated stainless steel tubing.

Description

Liquid cooling system Technical Field The present utility model relates to thermal management of electronic systems, and in particular, but not exclusively, to liquid cooling systems. Background Liquid cooling systems are used in electronic systems for industries such as computing, data centers, electric vehicles (ELECTRIC VEHICLE, EV) fast charging, telecommunications, lasers, and medical equipment for thermal management. In data centers, servers use two liquid cooling techniques, in addition to air cooling, cold plate cooling (or direct-to-chip cooling (DTC) or direct liquid cooling (direct liquid cooling)) and submerged cooling. Cold plate cooling is to mount the cold plate directly on a heat source such as a CPU and GPU. The working fluid within the cold plate chamber absorbs and conducts heat away from the integrated circuit components. Immersion cooling submerges the integrated circuit element in a dielectric immersion fluid, allowing heat to dissipate into the immersion fluid through direct contact. The fundamental component of a liquid cooling system is the cooling circuit (or line or pipe) because leakage of working fluid can cause server failure, and downtime for the data center. As the heat generated by increasingly faster integrated circuit elements increases, so does the pressure and flow requirements for the working fluid, thereby exacerbating the risk. To meet the increasing heat dissipation demands, larger and more durable cooling circuits, such as rigid copper tubing or reinforced rubber tubing, may be used. However, when the servers are disposed in close proximity in the server racks, the larger cooling lines may obstruct airflow, thereby reducing the heat dissipation efficiency of the server racks. In addition, the heavier and bulkier joints and connectors can further block airflow and interfere with server access and maintenance. Dedicated servers are costly and rigid cooling lines make it extremely difficult to upgrade components and rewire the cooling lines. Disclosure of utility model The utility model provides a high-efficiency and extensible liquid cooling system, which comprises at least one direct liquid cooling loop, at least one system board and a cooling distribution unit. The cooling distribution unit is in fluid communication with the at least one direct liquid cooling loop to provide working fluid to the at least one direct liquid cooling loop. The at least one direct liquid cooling loop comprises at least one section of flexible pipe, at least one proximal connector and at least one distal connector. The at least one flexible tube segment is made of stainless steel and is coupled to the at least one proximal joint by a proximal overlap joint and to the at least one distal joint by a distal overlap joint. The footprint (footprint) of the cooling circuit is reduced by the stronger and lighter stainless steel and the overlap and joining of the at least one flexible pipe section. A variety of rigid and flexible cooling circuit variations may be used that make component upgrades and re-routing of the cooling circuit simpler and more feasible. In at least one embodiment, the liquid cooling system comprises at least one direct liquid cooling loop, at least one system board, and a cooling distribution unit. The at least one direct liquid cooling loop comprises at least one flexible pipe section, at least one proximal connector and at least one distal connector. The proximal connection end of the at least one flexible tube segment is coupled to the proximal joint engagement end of the at least one proximal joint by a proximal overlap joint. The distal connection end of the at least one flexible tube segment is coupled to the distal joint engagement end of the at least one distal joint by a distal lap joint. At least one first integrated circuit element of the at least one system board is physically and thermally coupled to the at least one direct liquid cooling loop. The at least one second integrated circuit element of the at least one system board is not physically and thermally coupled to the at least one direct liquid cooling loop. The cooling distribution unit is in fluid communication with the at least one direct liquid cooling loop to provide working fluid to the at least one direct liquid cooling loop. In at least one embodiment, the liquid cooling system further comprises a supply manifold and a return manifold. The cooling distribution unit is fluidly coupled to the supply manifold and the return manifold, and the supply manifold is more fluidly coupled to the at least one direct liquid cooling loop and the return manifold is more fluidly coupled to the at least one direct liquid cooling loop. In at least one embodiment, the at least one flexible tube segment is made of corrugated stainless steel. In at least one embodiment, the at least one flexible tube segment has an outer diameter between 12 millimeters (inclusive) and 16 millimeters (inclusive). In at least one embodi