CN-224218715-U - Liquid cooling heat radiation module and electronic expansion device with same

CN224218715UCN 224218715 UCN224218715 UCN 224218715UCN-224218715-U

Abstract

A liquid cooling heat radiation module is used for solving the problem of poor heat radiation efficiency of the existing liquid cooling heat radiation module. The heat dissipation device comprises a shell, a heat dissipation component and a heat dissipation component, wherein the shell is provided with a first runner and a second runner, a first heat conduction part pair is positioned in the first runner, a second heat conduction part pair is positioned in the second runner, the first runner is communicated with the second runner, the heat dissipation component is provided with a first heat dissipation piece in thermal contact with the first heat conduction part, the heat dissipation component is provided with a second heat dissipation piece in thermal contact with the second heat conduction part, and the first heat dissipation piece and the second heat dissipation piece form non-contact. The utility model also provides an electronic expansion device with the liquid cooling heat radiation module. Therefore, the heat dissipation efficiency can be improved.

Inventors

ZHANG YUCHENG
WU BAOSHENG

Assignees

建准电机工业股份有限公司

Dates

Publication Date: 20260508
Application Date: 20250520
Priority Date: 20250507

Claims (10)

1. The utility model provides a liquid cooling heat dissipation module which characterized in that includes: A housing having a first flow path and a second flow path, a first heat transfer part pair disposed in the first flow path, a second heat transfer part pair disposed in the second flow path, the first flow path communicating with the second flow path, and The heat dissipation component is provided with a first heat dissipation piece and a second heat dissipation piece, wherein the first heat dissipation piece is in thermal contact with the first heat conduction part, the second heat dissipation piece is in thermal contact with the second heat conduction part, and the first heat dissipation piece and the second heat dissipation piece form non-contact.
2. The liquid cooling module of claim 1, wherein the first flow channel has a liquid inlet and a first connection end, the second flow channel has a second connection end and a liquid outlet, and the second connection end is connected to the first connection end.
3. The liquid cooling module of claim 1, wherein the cross section of the second flow channel has a width dimension and a thickness dimension in perpendicular directions, the width dimension being greater than the thickness dimension.
4. The liquid-cooled heat sink module of claim 1, wherein the first heat sink is a fin.
5. The liquid cooling module of claim 1, wherein the second heat sink has a cooling die coupled to the second heat conducting portion.
6. The liquid cooling heat sink module as claimed in claim 5, wherein the second heat sink has a fin, the fin of the second heat sink thermally contacting the cooling die.
7. The liquid cooling module according to any one of claims 1-6, further comprising at least one cooling fan, wherein the pair of air flow paths of the at least one cooling fan is located in the cooling module.
8. The liquid cooling module of claim 7, wherein the at least one cooling fan is two, and air flow paths of the two cooling fans are opposite to the first cooling member and the second cooling member, respectively.
9. An electronic expansion device, comprising: a main body having a liquid inlet and a liquid outlet, and The liquid cooling heat dissipation module according to any one of claims 1-8, wherein the first flow channel is connected to the liquid inlet and the second flow channel is connected to the liquid outlet.
10. The electronic expansion device of claim 9, wherein the body has a pump for driving a working fluid to flow in the first flow channel and the second flow channel.

Description

Liquid cooling heat radiation module and electronic expansion device with same Technical Field The present utility model relates to a heat dissipation module, and more particularly to a liquid cooling heat dissipation module for supporting an electronic device at a proper operating temperature. An electronic expansion device with the liquid cooling heat radiation module. Background The product development of the modern technology industry tends to be precise, the operation speed is greatly increased, so the heat generated by the heat source such as a chip is considerable, especially the chip for performing the AI operation is easier to generate high-efficiency operation so as to instantaneously generate a large amount of heat, and therefore, the heat generated by the heat source such as the chip is generally introduced into the liquid cooling heat dissipation module with better heat dissipation efficiency. However, for the high-power electronic heating element, the existing liquid cooling heat dissipation module is located in the electronic device, so that the internal space of the electronic device is excessively occupied, and is hindered by other components in the electronic device, so that the heat dissipation effect of the existing liquid cooling heat dissipation module is limited, and the heat dissipation efficiency is poor. In view of this, there is a need for improvement in the conventional liquid cooling heat dissipation module. Disclosure of utility model In order to solve the above problems, an objective of the present utility model is to provide a liquid cooling heat dissipation module and an electronic expansion device having the same, which can improve heat dissipation efficiency. Throughout this disclosure, directional or approximate terms, such as "front", "back", "left", "right", "upper (top)", "lower (bottom)", "inner", "outer", "side", etc., refer primarily to the directions of the attached drawings, and are merely used to aid in the description and understanding of various embodiments of the present utility model, and are not intended to limit the present utility model. The use of the terms "a" or "an" for the elements and components described throughout this specification is for convenience only and to provide a general meaning for the scope of the utility model, as should be construed in the present specification to include one or at least one and the singular concept also includes the plural unless it is obvious that it is meant otherwise. The terms "first," "second," "third," and "nth" as used throughout this disclosure are mainly used for distinguishing between different elements or features (e.g., elements, directions, or steps), and do not denote a maximum or minimum number of such elements or features, nor do they necessarily denote any order of sequential order. The terms "coupled," "assembled," or "assembled" as used throughout this disclosure, generally include those that are separated without damaging the components after connection, or that are not separated after connection, and may be selected by one of ordinary skill in the art based on the materials or assembly requirements of the components to be connected. The liquid cooling heat radiation module comprises a shell provided with a first runner and a second runner, a first heat conduction part pair is positioned in the first runner, a second heat conduction part pair is positioned in the second runner, the first runner is communicated with the second runner, and a heat radiation component provided with a first heat radiation piece in thermal contact with the first heat conduction part, wherein the heat radiation component is provided with a second heat radiation piece in thermal contact with the second heat conduction part, and the first heat radiation piece and the second heat radiation piece form non-contact. Therefore, the liquid cooling heat dissipation module forms alignment with the first heat conduction part through the first flow channel, the second flow channel forms alignment with the second heat conduction part, and the working liquid can sequentially flow through the first flow channel and the second flow channel, so that the heat energy of the working liquid is respectively transferred to the heat dissipation assembly through the first heat conduction part and the second heat conduction part, and the heat dissipation assembly forms the effects of pre-cooling the working liquid and then rapidly cooling the working liquid, so that the working liquid can achieve better heat dissipation efficiency through two-stage heat dissipation. The first runner is provided with a liquid inlet and a first connecting end, the second runner is provided with a second connecting end and a liquid outlet, and the second connecting end is connected with the first connecting end. Therefore, the working liquid can sequentially pass through the first flow channel and the second flow channel. The section of the second flow channel has a