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CN-224218740-U - Suction nozzle structure of chip mounter for packaging

CN224218740UCN 224218740 UCN224218740 UCN 224218740UCN-224218740-U

Abstract

The utility model belongs to the technical field of chip mounter suction nozzles, and provides a chip mounter suction nozzle structure for packaging, which comprises a chip mounter suction nozzle, a main body mechanism, a connecting mechanism and an adsorption mechanism, wherein the main body mechanism is arranged on the chip mounter suction nozzle and is used for assisting the chip mounter suction nozzle in completing the suction of components, the connecting mechanism is arranged on a bearing table and is used for connecting the adsorption mechanism, the adsorption mechanism is arranged on the connecting mechanism and is used for adsorbing the components, a plurality of adsorption pipes and sliding sleeves can be subjected to self-adaptive elastic adjustment according to different components when the chip mounter suction nozzle is used for sucking, transporting and placing the components, the adsorption pipes are attached to the surfaces of the components, and then the chip mounter suction nozzle is matched for sucking, transporting and placing the components, so that the purpose that the components can be tightly attached to the adsorption operation by the chip mounter suction nozzle is achieved.

Inventors

  • Shen Luman
  • Jia Xinzhong
  • LIU TIANSHENG

Assignees

  • 山西华耀亿嘉集成电路有限公司

Dates

Publication Date
20260508
Application Date
20250529

Claims (6)

  1. 1. The utility model provides a chip mounter suction nozzle structure for encapsulation which characterized in that includes: The suction nozzle (1) of the chip mounter is used for sucking, carrying and placing the mounted components; The main body mechanism is arranged on the suction nozzle (1) of the chip mounter and is used for assisting the suction nozzle (1) of the chip mounter to suck components; the connecting mechanism is arranged on the bearing table (3) and is used for connecting the adsorption mechanism; The adsorption mechanism is arranged on the connecting mechanism and is used for adsorbing components.
  2. 2. The suction nozzle structure of the chip mounter for packaging according to claim 1, wherein the main body mechanism comprises a negative pressure pipe (2) fixedly arranged on the suction nozzle (1) of the chip mounter, and the suction nozzle (1) of the chip mounter is fixedly provided with a receiving table (3) through the negative pressure pipe (2); And the bearing table (3) is communicated with the suction nozzle (1) of the chip mounter through the negative pressure pipe (2).
  3. 3. The suction nozzle structure of the chip mounter for packaging according to claim 1, wherein the connecting mechanism comprises a connecting cylinder (4) fixedly arranged at the top of the bearing table (3), and a centralized disc (7) is fixedly arranged in the connecting cylinder (4); A transmission pipe (8) is fixedly arranged between the centralized disc (7) and the bearing table (3).
  4. 4. The suction nozzle structure of the packaging chip mounter is characterized in that the suction mechanism comprises a plurality of sliding sleeves (5) fixedly arranged at the top of a connecting cylinder (4), and the connecting cylinder (4) is elastically and slidably provided with a plurality of suction pipes (6) through the plurality of sliding sleeves (5); And the adsorption tube (6) is communicated with the inside of the sliding sleeve (5).
  5. 5. The suction nozzle structure of the chip mounter for packaging as defined in claim 4, wherein the suction mechanism further comprises a sleeve joint hole (11) arranged at the top of the sliding sleeve (5), and the sliding sleeve (5) is arranged in a sliding manner with the suction pipe (6) through the sleeve joint hole (11); The bottom of the sliding sleeve (5) is fixedly provided with a guide pipe (12), and the adsorption pipe (6) is fixedly arranged on the collecting disc (7) through the guide pipe (12) and is communicated with the collecting disc (7).
  6. 6. The suction nozzle structure of the chip mounter for packaging as set forth in claim 5, wherein said suction mechanism further comprises a sealing corrugated hose (10) fixedly disposed at the bottom of the suction pipe (6), said suction pipe (6) being sealed with said guide pipe (12) by said sealing corrugated hose (10); The bottom of the adsorption tube (6) is positioned outside the sealing corrugated hose (10) and is fixedly provided with a spring (9), and the bottom of the spring (9) is fixedly arranged at the bottom side inside the sleeve joint hole (11).

Description

Suction nozzle structure of chip mounter for packaging Technical Field The utility model belongs to the technical field of chip mounter suction nozzles, and particularly relates to a suction nozzle structure of a chip mounter for packaging. Background The suction nozzle of the chip mounter is a critical component in the chip mounter and plays a core role in a Surface Mount Technology (SMT) production line, is a special tool for sucking, carrying and placing surface mount components (SMD) and is generally arranged on a mounting head of the chip mounter and is mainly used for accurately conveying the components from a feeding position to a position above a designated mounting position of a circuit board; However, in the process of adsorbing and moving different components, the surface of the components has different heights, so that the suction nozzle of the chip mounter is difficult to adsorb on the components tightly, and the problem that the components fall off when the suction nozzle of the chip mounter adsorbs the components is easily caused. Therefore, a chip mounter suction nozzle structure for packaging is proposed by those skilled in the art to solve the problems presented in the background art. Disclosure of utility model In order to solve the technical problems, the utility model provides a suction nozzle structure of a chip mounter for packaging, which aims to solve the problem that in the prior art, the suction nozzle of the chip mounter is difficult to tightly adsorb when adsorbing components with uneven surfaces. A suction nozzle structure of a chip mounter for packaging comprises a suction nozzle of the chip mounter, a main body mechanism, a connecting mechanism and an adsorption mechanism, wherein the suction nozzle of the chip mounter is used for sucking, carrying and placing a mounted component, the main body mechanism is arranged on the suction nozzle of the chip mounter and used for assisting the suction nozzle of the chip mounter in sucking the component, the connecting mechanism is arranged on a bearing table and used for connecting the adsorption mechanism, and the adsorption mechanism is arranged on the connecting mechanism and used for adsorbing the component. Preferably, the main body mechanism comprises a negative pressure pipe fixedly arranged on the suction nozzle of the chip mounter, a bearing table is fixedly arranged on the suction nozzle of the chip mounter through the negative pressure pipe, and the bearing table is communicated with the suction nozzle of the chip mounter through the negative pressure pipe. Preferably, the connecting mechanism comprises a connecting cylinder fixedly arranged at the top of the bearing table, a centralized disc is fixedly arranged in the connecting cylinder, and a transmission pipe is fixedly arranged between the centralized disc and the bearing table. Preferably, the adsorption mechanism comprises a plurality of sliding sleeves fixedly arranged at the top of the connecting cylinder, the connecting cylinder is elastically and slidably provided with a plurality of adsorption pipes through the sliding sleeves, and the adsorption pipes are communicated with the inside of the sliding sleeves. Preferably, the adsorption mechanism further comprises a sleeve joint hole formed in the top of the sliding sleeve, the sliding sleeve is slidably arranged with the adsorption tube through the sleeve joint hole, a guide tube is fixedly arranged at the bottom of the sliding sleeve, and the adsorption tube is fixedly arranged on the centralized disc through the guide tube and is communicated with the centralized disc. Preferably, the adsorption mechanism further comprises a sealing corrugated hose fixedly arranged at the bottom of the adsorption tube, the adsorption tube is in sealing arrangement with the guide tube through the sealing corrugated hose, a spring is fixedly arranged at the bottom of the adsorption tube outside the sealing corrugated hose, and the bottom of the spring is fixedly arranged at the bottom side inside the sleeving hole. Compared with the prior art, the utility model has the following beneficial effects: According to the utility model, the negative pressure pipe and the bearing table are communicated and fixedly connected with the connecting cylinder, and the plurality of adsorption pipes and the sliding sleeve are communicated and arranged on the suction nozzle of the chip mounter through the centralized disc and the transmission pipe in the connecting cylinder, so that when the suction nozzle of the chip mounter sucks, carries and places components, the plurality of adsorption pipes and the sliding sleeve can carry out self-adaptive elastic adjustment according to different components, the plurality of adsorption pipes are attached to the surfaces of the components, and then the suction nozzle of the chip mounter is matched for sucking, carrying and placing operations, so that the purpose that the components can be tightly attached to