CN-224218751-U - Optical sensor and electronic device

Abstract

The utility model discloses an optical sensor and electronic equipment, wherein the optical sensor comprises a substrate, a first optical sensing chip, a light homogenizing structure, a first light-transmitting layer and a shading packaging layer, the first optical sensing chip is arranged on the substrate and is electrically connected with the substrate, the light homogenizing structure is arranged above the first optical sensing chip, the vertical projection of the light homogenizing structure at least covers an effective photosensitive area of the first optical sensing chip, the first light-transmitting layer is arranged above the light homogenizing structure, the vertical projection of the first light-transmitting layer at least covers the effective photosensitive area of the first optical sensing chip, and the shading packaging layer is arranged on the substrate and encapsulates the first optical sensing chip, the light homogenizing structure and the side part of the first light-transmitting layer. The electronic device comprises the optical sensor. The utility model enlarges the half power angle of the light above the first optical sensing chip, thereby improving the application performance of the optical sensor, and the dodging structure is embedded in the packaging structure, thereby realizing the miniaturization design of the optical sensor.

Inventors

• WEI YA
• WU BAOQUAN

Assignees

• 深圳市汇顶科技股份有限公司

Dates

Publication Date

20260508

Application Date

20250421

Claims (20)

1. 1. An optical sensor is characterized by comprising a substrate (1), a first optical sensing chip (2) 、 light-homogenizing structure (3), a first light-transmitting layer (4) and a shading packaging layer (5), The first optical sensing chip (2) is arranged on the substrate (1) and is electrically connected with the substrate (1), The light homogenizing structure (3) is arranged above the first optical sensing chip (2), the vertical projection of the light homogenizing structure (3) at least covers the effective photosensitive area of the first optical sensing chip (2), The first light-transmitting layer (4) is arranged above the light-homogenizing structure (3), the vertical projection of the first light-transmitting layer (4) at least covers the effective photosensitive area of the first optical sensing chip (2), The shading packaging layer (5) is arranged on the substrate (1) and encapsulates the side parts of the first optical sensing chip (2), the light homogenizing structure (3) and the first light-transmitting layer (4).
2. 2. The optical sensor according to claim 1, wherein the light homogenizing structure (3) has a structure with a flat upper surface and a plurality of first protrusions on a lower surface, a first light-transmitting adhesive layer (6) is arranged below the light homogenizing structure (3), the refractive index of the first light-transmitting adhesive layer (6) is smaller than that of the light homogenizing structure (3), the light homogenizing structure (3) is attached to the first optical sensing chip (2) or attached to a first transparent layer (7) arranged on the first optical sensing chip (2) through the first light-transmitting adhesive layer (6), and the vertical projection of the first transparent layer (7) at least covers an effective photosensitive area of the first optical sensing chip (2).
3. 3. Optical sensor according to claim 2, characterized in that the refractive index difference of the light homogenizing structure (3) and the first light transmissive glue layer (6) is larger than 0.25.
4. 4. Optical sensor according to claim 2, characterized in that the refractive index difference of the light homogenizing structure (3) and the first light transmissive glue layer (6) is larger than 0.4.
5. 5. The optical sensor according to claim 1, wherein the light homogenizing structure (3) has a structure with a flat upper surface and a plurality of first protrusions on a lower surface, a filling layer (8) is arranged below the light homogenizing structure (3), a plurality of second protrusions are arranged on the upper surface of the filling layer (8), the plurality of second protrusions are filled in gaps among the first protrusions on the lower surface of the light homogenizing structure (3), the lower surface of the filling layer (8) is a flat plane, the refractive index of the filling layer (8) is smaller than that of the light homogenizing structure (3), the lower surface of the filling layer (8) is attached to the first optical sensor chip (2) or attached to a second transparent layer (9) arranged on the first optical sensor chip (2), and the vertical projection of the second transparent layer (9) at least covers an effective photosensitive area of the first optical sensor chip (2).
6. 6. Optical sensor according to claim 5, characterized in that the refractive index difference between the light homogenizing structure (3) and the filling layer (8) is larger than 0.25.
7. 7. Optical sensor according to claim 5, characterized in that the refractive index difference between the light homogenizing structure (3) and the filling layer (8) is larger than 0.4.
8. 8. The optical sensor according to claim 1, wherein the light homogenizing structure (3) has a structure with a flat upper surface and a plurality of first protrusions on a lower surface, a cofferdam (10) is arranged around the lower side of the light homogenizing structure (3), the cofferdam (10) is attached to the first optical sensing chip (2) so that an air interlayer (11) is formed between the light homogenizing structure (3) and the first optical sensing chip (2), or the cofferdam (10) is attached to a third transparent layer (12) arranged on the first optical sensing chip (2) so that an air interlayer (11) is formed between the light homogenizing structure (3) and the third transparent layer (12), and the vertical projection of the air interlayer (11) at least covers the effective photosensitive area of the first optical sensing chip (2), and the vertical projection of the third transparent layer (12) at least covers the effective photosensitive area of the first optical sensing chip (2).
9. 9. The optical sensor according to any one of claims 2-8, further comprising a first filter layer (13), wherein the first filter layer (13) is attached to the first light transmissive layer (4) or is arranged between the first light transmissive layer (4) and the light homogenizing structure (3).
10. 10. The optical sensor according to claim 1, wherein the dodging structure (3) comprises at least one light condensing unit (31) and at least one light blocking unit (32), at least one light blocking unit (32) is correspondingly arranged below each light condensing unit (31), the at least one light condensing unit (31) at least covers an effective photosensitive area of the first optical sensor chip (2), the light blocking unit (32) corresponding to the light condensing unit (31) is located between the light condensing unit (31) and the effective photosensitive area of the first optical sensor chip (2), and the light blocking unit (32) is used for blocking the collected light from reaching the effective photosensitive area of the first optical sensor chip (2) after the first incident light in the incident light is collected by the light condensing unit (31) corresponding to the light blocking unit (32), wherein an angle between the first incident light and a plane of the effective photosensitive area of the first optical sensor chip (2) is smaller than a normal of 90 degrees.
11. 11. The optical sensor according to claim 10, wherein one light blocking unit (32) corresponds to a position below each light condensing unit (31), a central axis of the light condensing unit (31) is perpendicular to an effective photosensitive area plane of the first optical sensor chip (2), the light blocking unit (32) corresponding to the light condensing unit (31) intersects with the central axis of the light condensing unit (31), and a projection of the light blocking unit (32) corresponding to the light condensing unit (31) on the first optical sensor chip (2) is located in a projection of the light condensing unit (31) on the first optical sensor chip (2).
12. 12. The optical sensor according to claim 10, wherein the dodging structure (3) further comprises a dielectric layer (33), the dielectric layer (33) being arranged between the light condensing unit (31) and the first optical sensor chip (2), the at least one light blocking unit (32) being arranged in the dielectric layer (33).
13. 13. The optical sensor according to claim 12, wherein the light homogenizing structure (3) further comprises a light transmissive encapsulation layer (34), the light transmissive encapsulation layer (34) being arranged on the upper surface of the dielectric layer (33), the at least one light condensing unit (31) being located within the light transmissive encapsulation layer (34).
14. 14. The optical sensor according to claim 12 or 13, further comprising a second filter layer (14), wherein the second filter layer (14) is attached to the first light-transmitting layer (4), or is arranged between the first light-transmitting layer (4) and the light-homogenizing structure (3), or is arranged between the dielectric layer (33) and the first optical sensor chip (2).
15. 15. The optical sensor according to claim 12, wherein the dielectric layer (33) comprises a first sub-dielectric layer (331) and a second sub-dielectric layer (332) arranged one above the other, the optical sensor further comprising a third filter layer (15), the third filter layer (15) being arranged between the first sub-dielectric layer (331) and the second sub-dielectric layer (332).
16. 16. Optical sensor according to claim 13, characterized in that the refractive index of the light gathering unit (31) is larger than the refractive index of the light transmissive encapsulation layer (34).
17. 17. The optical sensor according to claim 16, characterized in that the refractive index difference of the light condensing unit (31) and the light transmissive encapsulation layer (34) is larger than 0.25.
18. 18. The optical sensor according to claim 16, characterized in that the refractive index difference of the light condensing unit (31) and the light transmissive encapsulation layer (34) is larger than 0.4.
19. 19. The optical sensor according to claim 11, wherein the light blocking unit (32) comprises a circular light blocking unit, and the central axis of the light blocking unit (32) corresponding to the light condensing unit (31) coincides with the central axis of the light condensing unit (31) in a direction perpendicular to the first optical sensor chip (2).
20. 20. The optical sensor according to claim 10, characterized in that the optical sensor comprises a plurality of light gathering units (31), the plurality of light gathering units (31) being arranged in an array.

Description

Optical sensor and electronic device Technical Field The utility model relates to the technical field of sensors, in particular to an optical sensor and electronic equipment. Background With the development of high-end consumer electronics, there is an increasing need to mount optical sensors or integrate multiple optical sensors under the screen of an electronic device. Typically, in natural environments, light rays exhibit a lambertian distribution, and after passing through the screen of an electronic device, the screen attenuates light rays at large angles. The optical sensor mainly detects light above the optical sensor chip, and the attenuation of the screen to large-angle light leads to the reduction of the angle of effective light received by the optical sensor chip, so that the application performance of the optical sensor is reduced. Disclosure of utility model Aiming at the defects of the prior art, the utility model innovatively provides the optical sensor and the electronic equipment, wherein the light homogenizing structure is arranged above the effective photosensitive area of the first optical sensing chip, so that the half power angle of the light above the first optical sensing chip is enlarged, the angle of the effective light received by the effective photosensitive area of the first optical sensing chip is enlarged, the application performance of the optical sensor is improved, the light homogenizing structure is embedded in the packaging structure, the length and the width of the optical sensor are not enlarged, the size of the light homogenizing structure in the height direction is small, and the miniaturized design of the optical sensor can be realized. In order to achieve the technical purpose, the first aspect of the utility model discloses an optical sensor, which comprises a substrate, a first optical sensing chip 、 light-homogenizing structure, a first light-transmitting layer and a light-shielding packaging layer, The first optical sensing chip is arranged on the substrate and is electrically connected with the substrate, The light homogenizing structure is arranged above the first optical sensing chip, the vertical projection of the light homogenizing structure at least covers the effective photosensitive area of the first optical sensing chip, The first light-transmitting layer is arranged above the light-homogenizing structure, the vertical projection of the first light-transmitting layer at least covers the effective photosensitive area of the first optical sensing chip, The shading packaging layer is arranged on the substrate and encapsulates the first optical sensing chip, the light homogenizing structure and the side part of the first light-transmitting layer. Further, the light homogenizing structure is of a structure with a flat upper surface and a plurality of first protrusions on the lower surface, a first light-transmitting adhesive layer is arranged below the light homogenizing structure, the refractive index of the first light-transmitting adhesive layer is smaller than that of the light homogenizing structure, the light homogenizing structure is attached to the first optical sensing chip or attached to a first transparent layer arranged on the first optical sensing chip through the first light-transmitting adhesive layer, and the vertical projection of the first transparent layer at least covers an effective photosensitive area of the first optical sensing chip. Further, the refractive index difference between the light homogenizing structure and the first light-transmitting adhesive layer is greater than 0.25. Further, the refractive index difference between the light homogenizing structure and the first light-transmitting adhesive layer is greater than 0.4. Further, the light homogenizing structure is of a structure with a flat upper surface and a plurality of first protrusions on a lower surface, a filling layer is arranged below the light homogenizing structure, a plurality of second protrusions are arranged on the upper surface of the filling layer, the second protrusions are filled in gaps among the first protrusions on the lower surface of the light homogenizing structure, the lower surface of the filling layer is a flat plane, the refractive index of the filling layer is smaller than that of the light homogenizing structure, the lower surface of the filling layer is attached to the first optical sensing chip or attached to a second transparent layer arranged on the first optical sensing chip, and the vertical projection of the second transparent layer at least covers the effective photosensitive area of the first optical sensing chip. Further, the refractive index difference between the light homogenizing structure and the filling layer is greater than 0.25. Further, the refractive index difference between the light homogenizing structure and the filling layer is greater than 0.4. Further, the dodging structure is a structure with a flat upper surface and