CN-224218761-U - Structure-enhanced UV packaging ceramic substrate

CN224218761UCN 224218761 UCN224218761 UCN 224218761UCN-224218761-U

Abstract

The utility model discloses a structure-enhanced UV packaging ceramic substrate which comprises a ceramic base layer, a metal surrounding dam, a front bonding pad, a back bonding pad, a first heat dissipation layer, a second heat dissipation layer and a light-transmitting cover plate, wherein an annular dovetail groove is concavely arranged on the periphery of the upper surface of the ceramic base layer, an annular dovetail block of the metal surrounding dam is arranged in the annular dovetail groove and is matched with the annular dovetail groove, so that the metal surrounding dam and the ceramic base layer are firmly combined together, the stability of a connecting structure is effectively enhanced, the phenomenon of separation of the ceramic base layer and the metal surrounding dam is avoided, the overall performance of a product is ensured, the quality of the product is improved, the service life of the product is prolonged, the width of an intermediate layer of the metal surrounding dam is larger than that of a main body layer, and the main body layer of an inverted cone structure is matched, so that the ceramic substrate of the structure can effectively reduce the stress of the metal surrounding dam on the ceramic base layer, prevent cracking caused by stress concentration, and effectively improve the cold and hot impact resistance of the product, and meet the existing requirements.

Inventors

Kong Shijin
GUO XIAOQUAN
KANG WEI

Assignees

江西晶弘新材料科技有限责任公司

Dates

Publication Date: 20260508
Application Date: 20250523

Claims (8)

1. The structure-enhanced UV packaging ceramic substrate is characterized by comprising a ceramic base layer, a metal surrounding dam, a front bonding pad, a back bonding pad, a first heat dissipation layer, a second heat dissipation layer and a light-transmitting cover plate; The ceramic base layer is provided with a plurality of through holes and heat conducting holes, wherein the through holes are provided with a plurality of heat conducting columns, each heat conducting hole is internally provided with a heat conducting column, the periphery of the upper surface of the ceramic base layer is concavely provided with an annular dovetail groove, the metal box dam and the ceramic base layer are formed into an upward-opening packaging cavity in a surrounding mode, the packaging cavity is of a conical structure, the metal box dam comprises an annular dovetail block, a middle layer and a main body layer which are integrally connected in sequence, the annular dovetail block is arranged in the annular dovetail groove and is matched with the annular dovetail groove, the middle layer is arranged on the upper surface of the ceramic base layer, the main body layer extends upwards on the surface of the middle layer, the width of the middle layer is larger than that of the main body layer, and the main body layer is of an inverted cone structure; The front bonding pad is arranged on the upper surface of the ceramic base layer and is positioned in the packaging cavity, the front bonding pad is connected with the upper ends of the conductive columns, the back bonding pad is arranged on the lower surface of the ceramic base layer and is connected with the lower ends of the conductive columns, the first heat dissipation layer is arranged on the upper surface of the ceramic base layer and is positioned in the packaging cavity, the first heat dissipation layer is connected with the upper ends of the plurality of conductive columns, the second heat dissipation layer is arranged on the lower surface of the ceramic base layer and is connected with the lower ends of the plurality of conductive columns, the light-transmitting cover plate is arranged on the metal box dam and covers the opening of the packaging cavity, and the periphery bottom surface of the light-transmitting cover plate is fixed with the metal box dam in a sealing mode through sealing glue.
2. The UV-encapsulated ceramic substrate with enhanced structure according to claim 1, wherein the metal dam is provided with an annular caulking groove in the opening edge of the encapsulation cavity, the bottom surface of the transparent cover plate is provided with an annular protrusion, the annular protrusion is arranged in the annular caulking groove and is matched with the annular caulking groove, and the annular caulking groove and the annular protrusion are fixed by sealing and bonding through sealant.
3. The UV-encapsulated ceramic substrate of claim 2, wherein said annular recess has a cross-section with a plurality of V-shaped structures, and said annular protrusion has a cross-section with a plurality of V-shaped structures.
4. The UV-package ceramic substrate of claim 3, wherein said light-transmissive cover plate comprises a main body and an extension portion extending outward from the upper end of the main body, said annular protrusion is disposed on the bottom surface of the periphery of the main body, the top surface of the metal dam is provided with a first annular groove, said extension portion is disposed on the top surface of the metal dam, the bottom surface of said extension portion is provided with a second annular groove, and said second annular groove is communicated with the first annular groove and is filled with waterproof glue.
5. The UV-encapsulated ceramic substrate of claim 4, wherein said first annular recess has an arcuate configuration, and said second annular recess has an arcuate configuration.
6. The UV-encapsulated ceramic substrate of claim 1, wherein said ceramic base layer is aluminum nitride.
7. The UV-encapsulated ceramic substrate of claim 1, wherein said first and second heat dissipation layers are graphene.
8. The structure-enhanced UV-encapsulated ceramic substrate of claim 1, wherein said thermally conductive pillars are graphene.

Description

Structure-enhanced UV packaging ceramic substrate Technical Field The utility model relates to the technical field of ceramic substrates, in particular to a structure-enhanced UV packaging ceramic substrate. Background Ceramic substrates refer to special process plates in which copper foil is bonded directly to the surface (single or double sided) of an aluminum oxide (Al 2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultrathin composite substrate has excellent electrical insulation performance, high heat conduction property, excellent soldering property and high adhesion strength, can etch various patterns like a PCB, and has great current carrying capacity. Therefore, ceramic substrates have become a base material for high-power electronic circuit structure technology and interconnection technology. At present, the technology of the microelectronics industry is rapidly developed, electronic devices and electronic equipment are developed towards high integration and miniaturization, and the performance requirements on substrates are also higher and higher. The aluminum oxide ceramic substrate and the aluminum nitride ceramic substrate have remarkable characteristics of excellent insulating property, good heat conductivity, low thermal expansion coefficient, strong mechanical strength and the like, and are widely applied to the field of electronic industrial packaging such as thick film integrated circuits, LED packaging, UV packaging and the like. The existing UV packaging ceramic substrate is generally of a structure comprising a ceramic base layer and a metal surrounding dam, wherein the metal surrounding dam is arranged on the upper surface of the ceramic base layer, a front bonding pad and a back bonding pad are arranged on the upper surface and the lower surface of the ceramic base layer and are connected with a conductive column penetrating through the ceramic base layer; and, because the thermal expansion coefficient of metal and the thermal expansion coefficient of ceramic are very different, the problem that the ceramic base layer cracks due to too large stress of the ceramic base layer can occur in the packaging process, and the cold and hot impact resistance of the product is poor and can not meet the existing requirements. Therefore, a new technical solution is needed to be researched to improve the current UV packaging ceramic substrate. Disclosure of utility model In view of the above, the main object of the present utility model is to provide a structural enhanced UV-packaging ceramic substrate, which can effectively solve the problems of poor wettability between a ceramic base layer and a metal surrounding dam, poor bonding force between the surface of the metal surrounding dam and the ceramic base layer, and poor cold and hot impact resistance of the product caused by the fact that the ceramic base layer and the metal surrounding dam are easily separated after the ceramic substrate works for a long time, resulting in a great reduction in the overall performance of the product, damage to the product, unstable structure of the product, poor quality of the product, short service life, and large difference between the thermal expansion coefficient of the metal and the thermal expansion coefficient of the ceramic, and cracking of the ceramic base layer caused by excessive stress of the ceramic base layer during packaging. In order to achieve the above purpose, the present utility model adopts the following technical scheme: A structure-enhanced UV packaging ceramic substrate comprises a ceramic base layer, a metal dam, a front bonding pad, a back bonding pad, a first heat dissipation layer, a second heat dissipation layer and a light-transmitting cover plate; The ceramic base layer is provided with a plurality of through holes and heat conducting holes, wherein the through holes are provided with a plurality of heat conducting columns, each heat conducting hole is internally provided with a heat conducting column, the periphery of the upper surface of the ceramic base layer is concavely provided with an annular dovetail groove, the metal box dam and the ceramic base layer are formed into an upward-opening packaging cavity in a surrounding mode, the packaging cavity is of a conical structure, the metal box dam comprises an annular dovetail block, a middle layer and a main body layer which are integrally connected in sequence, the annular dovetail block is arranged in the annular dovetail groove and is matched with the annular dovetail groove, the middle layer is arranged on the upper surface of the ceramic base layer, the main body layer extends upwards on the surface of the middle layer, the width of the middle layer is larger than that of the main body layer, and the main body layer is of an inverted cone structure; The front bonding pad is arranged on the upper surface of the ceramic base layer and is positioned in the packaging cavity, the front bonding pad is conn