CN-224218768-U - Micro light-emitting diode device packaging module and display device

Abstract

The application provides a miniature light-emitting diode device packaging module and a display device, wherein a miniature light-emitting diode chip of the packaging module comprises a plurality of pixel units which are arranged at intervals, a plurality of light-transmitting units are arranged on the light-emitting surface sides of the pixel units, the light-transmitting units are in one-to-one correspondence with the pixel units and are arranged at intervals, and part of light rays transmitted by the pixel units through the light-emitting surface pass through the light-transmitting units. A gap area is formed between two adjacent light-transmitting units, a plurality of light-absorbing units are arranged on the light-emitting surface sides of a plurality of pixel units, and each light-absorbing unit is arranged in one gap area and absorbs another part of light transmitted through the light-emitting surface and emitted by the pixel unit. Therefore, the packaging module can reduce the light crosstalk phenomenon formed by reflecting light emitted by different pixel units at the light-emitting surface.

Inventors

• CHEN DINGFU
• QIU CHENGFENG
• HUANG BINGQUAN

Assignees

• 深圳市思坦科技有限公司

Dates

Publication Date

20260508

Application Date

20250427

Claims (10)

1. 1. A miniature light emitting diode device package module, comprising: The miniature light-emitting diode chip comprises a plurality of pixel units which are arranged at intervals; A plurality of light transmission units arranged on the light emitting surface side of the pixel units, the light transmission units being spaced from each other and arranged in one-to-one correspondence with the pixel units, wherein a gap area is formed between two adjacent light transmission units, part of light transmitted by the light emitting surface from the pixel units passes through the light transmission units, and The light absorption units are arranged on the light emitting surface sides of the pixel units, each light absorption unit is arranged in one gap area, and each light absorption unit is used for absorbing another part of light transmitted by the light emitting surface and emitted by the pixel unit.
2. 2. The micro light emitting diode device package as set forth in claim 1, further comprising: The light-transmitting cover plate is arranged and connected to one surface of the light-transmitting unit, which is away from the miniature light-emitting diode chip, and bears the light-transmitting unit and the light-absorbing unit.
3. 3. The package module of claim 1, further comprising an adhesive structure, wherein at least one of the light transmitting units and the light absorbing units is connected to the micro LED chip via the adhesive structure, or wherein the light transmitting units and the light absorbing units are connected to the micro LED chip via the adhesive structure The light-transmitting units and the light-absorbing units form a package whole, the light-absorbing units comprise bonding structures, and the package whole is connected with the miniature light-emitting diode chip through the light-absorbing units.
4. 4. The micro light emitting diode device package as set forth in claim 1, wherein each of the light transmitting units includes a top surface connected to the light emitting surface and a side surface perpendicular to the top surface.
5. 5. The micro light emitting diode device package as set forth in claim 1, wherein each of the light transmitting units includes a top surface connected to the light emitting surface and side surfaces inclined with respect to the top surface.
6. 6. The micro light emitting diode device package module of claim 4 or 5, wherein an absolute value of a difference between refractive indexes of the light emitting surface and the top surface is smaller than an absolute value of a difference between refractive indexes of the light emitting surface and air.
7. 7. The micro light emitting diode device package module of any one of claims 1 to 5, wherein the package structure further comprises: and each side wall unit surrounds and is attached to the side face of one light-transmitting unit, and the side wall units form a reflecting structure.
8. 8. The micro light emitting diode device package module of any one of claims 1 to 5, wherein a plurality of the light transmitting units form a microlens array structure.
9. 9. The micro light emitting diode device package as claimed in any one of claims 1 to 5, wherein at least part of the light transmissive units comprise quantum dot structures.
10. 10. A display apparatus comprising a micro light emitting diode device package module according to any one of claims 1 to 9.

Description

Micro light-emitting diode device packaging module and display device Technical Field The application relates to the technical field of semiconductor light emitting, in particular to a miniature light emitting diode device packaging module and a display device. Background Micro-LED (Micro-LIGHT EMITTING Diode) display technology is a display technology in which a conventional LED (LIGHT EMITTING Diode) structure is miniaturized and arrayed, and a CMOS (Complementary Metal Oxide Semiconductor ) or TFT (Thin Film Transistor, thin film transistor) is used to fabricate a driving circuit to realize addressing control and individual driving of each pixel structure. The Micro-LED display module of the related art has poor display effect and has room for improvement. Disclosure of utility model The application aims to provide a miniature light-emitting diode device packaging module and a display device. In order to solve the above problems, in a first aspect, the present application provides a micro light emitting diode device package module, including: The miniature light-emitting diode chip comprises a plurality of pixel units which are arranged at intervals; A plurality of light transmission units arranged on the light emitting surface side of the pixel units, the light transmission units being spaced from each other and arranged in one-to-one correspondence with the pixel units, wherein a gap area is formed between two adjacent light transmission units, part of light transmitted by the light emitting surface from the pixel units passes through the light transmission units, and The light absorption units are arranged on the light emitting surface sides of the pixel units, each light absorption unit is arranged in one gap area, and each light absorption unit is used for absorbing another part of light transmitted by the light emitting surface and emitted by the pixel unit. Optionally, the packaging module further includes: The light-transmitting cover plate is arranged and connected to one surface of the light-transmitting unit, which is away from the miniature light-emitting diode chip, and bears the light-transmitting unit and the light-absorbing unit. Optionally, the packaging module further comprises an adhesive structure, at least one of the light transmitting units and the light absorbing units is connected with the micro light emitting diode chip through the adhesive structure, or The light-transmitting units and the light-absorbing units form a package whole, the light-absorbing units comprise bonding structures, and the package whole is connected with the miniature light-emitting diode chip through the light-absorbing units. Optionally, each light-transmitting unit includes a top surface and a side surface, the top surface is connected with the light-emitting surface, and the side surface is perpendicular to the top surface. Optionally, each light-transmitting unit includes a top surface and a side surface, the top surface is connected with the light-emitting surface, and the side surface is inclined relative to the top surface. Optionally, the absolute value of the difference between the refractive indexes of the light-emitting surface and the top surface is smaller than the absolute value of the difference between the refractive indexes of the light-emitting surface and air. Optionally, the package structure further includes: and each side wall unit surrounds and is attached to the side face of one light-transmitting unit, and the side wall units form a reflecting structure. Optionally, a plurality of the light transmitting units form a microlens array structure. Optionally, at least part of the light transmitting unit comprises a quantum dot structure. In a second aspect, the present application further provides a display apparatus, including the micro light emitting diode device package module as described above. According to the technical scheme, in the micro light emitting diode device packaging module and the display device, part of light emitted by the pixel unit of the micro light emitting diode chip of the packaging module is incident into the light transmitting unit through the interface between the light emitting surface and the light transmitting unit and passes through the light transmitting unit after one or more reflections and is emitted out of the packaging module, and the other part of light emitted by the pixel unit is absorbed by the light absorbing unit through the interface between the light emitting surface and the light absorbing unit, and the part of light cannot be reflected on the light emitting surface and enters the micro light emitting diode chip, so that the light absorbing unit can avoid light crosstalk phenomenon formed by reflection of light emitted by different pixel units at the light emitting surface, and the display effect of the packaging module is ensured. Drawings In order to more clearly illustrate the technical solutions of the present application, the drawings