Search

CN-224218770-U - LED packaging structure and LED light-emitting device

CN224218770UCN 224218770 UCN224218770 UCN 224218770UCN-224218770-U

Abstract

The application provides an LED packaging structure and an LED light-emitting device, wherein the LED packaging structure comprises a substrate, at least two LED chips, at least one first groove and at least one second groove, wherein the upper surface of the substrate is provided with a die bonding area, the at least two LED chips are arranged in the die bonding area at intervals, each LED chip is bonded with the upper surface of the substrate through die bonding glue, and each first groove is arranged in the die bonding area, is recessed from the upper surface of the substrate to the lower surface of the substrate, and is positioned between two adjacent LED chips. The application can effectively improve the utilization rate of the die bonding area.

Inventors

  • YANG ZIHUA
  • MIN XIU
  • JIN XIN
  • WANG DAN
  • LI CHENYU
  • LI JINSONG

Assignees

  • 鸿利智汇集团股份有限公司

Dates

Publication Date
20260508
Application Date
20250610

Claims (10)

  1. 1. An LED package structure, comprising: A substrate (11), wherein a die bonding region (111 a) is provided on the upper surface (111) of the substrate (11); At least two LED chips (12) are arranged in the die bonding area (111 a) at intervals, and the LED chips (12) are bonded with the upper surface (111) of the substrate (11) through a die bonding adhesive (13); At least one first groove (111 b) is disposed in the die bonding region (111 a), and each first groove (111 b) is recessed from the upper surface (111) of the substrate (11) to the lower surface (112) of the substrate (11) and is located between two adjacent LED chips (12).
  2. 2. The LED package structure of claim 1, further comprising: A bowl cup (14) disposed on the upper surface (111) of the substrate (11), wherein the bowl cup (14) forms the die bonding region (111 a) in a region surrounded by the upper surface (111) of the substrate (11); At least one second groove (111 c) is disposed in the die bonding region (111 a), and each second groove (111 c) is recessed from the upper surface (111) of the substrate (11) to the lower surface (112) of the substrate (11) and is located between the bowl cup (14) and the LED chip (12) adjacent to the bowl cup (14).
  3. 3. The LED package structure according to claim 2, wherein the die bonding region (111 a) is rectangular, at least two LED chips (12) are arranged at intervals along a first direction (D1), the first groove (111 b) and the second groove (111 c) each extend along a second direction (D2), the first direction (D1) and the second direction (D2) are perpendicular to each other, the first direction (D1) is any one of a width direction and a length direction of the die bonding region (111 a), and the second direction (D2) is the other one of the width direction and the length direction of the die bonding region (111 a).
  4. 4. The LED package structure according to claim 2, wherein the substrate (11) includes a positive electrode plate (11 a), a negative electrode plate (11 b), and an insulating tape (11 c) between the positive electrode plate (11 a) and the negative electrode plate (11 b), the LED package structure further comprising: First metal column (15) and second metal column (16), all run through along vertical direction bowl cup (14) and be located outside solid brilliant region (111 a), top surface (151) of first metal column (15) are connected through first bonding wire (w 1) with one of them in LED chip (12) LED chip (121) positive pole, bottom surface (152) of first metal column (15) with positive plate (11 a) is connected, top surface (161) of second metal column (16) are connected through second bonding wire (w 2) with another one in at least two LED chip (12) LED chip (122) negative pole, bottom surface (162) of second metal column (16) with negative plate (11 b) is connected.
  5. 5. The LED package structure of claim 4, wherein the top surface (151) of said first metal pillar (15) and the top surface (161) of said second metal pillar (16) are both higher than the upper surface of said die attach adhesive (13).
  6. 6. The LED package structure of claim 4, wherein the top surface (151) of said first metal pillar (15) and the top surface (161) of said second metal pillar (16) are both parallel to the upper surface (111) of said substrate (11) such that the top surface (151) of said first metal pillar (15) constitutes a second solder joint location of said first solder wire (w 1) and such that the top surface (161) of said second metal pillar (16) constitutes a second solder joint location of said second solder wire (w 2).
  7. 7. The LED package structure according to claim 4, wherein the height of the inner side wall (141) of the bowl cup (14) decreases in the direction from outside to inside of the bowl cup (14), the top surface (151) of the first metal pillar (15) and the top surface (161) of the second metal pillar (16) each pass through the inner side wall (141) of the bowl cup (14), and the heights of the top surface (151) of the first metal pillar (15) and the top surface (161) of the second metal pillar (16) are each lower than the height of the top surface (142) of the bowl cup (14); And/or, the bottom surface (152) of the first metal pillar (15) does not protrude from the lower surface of the positive electrode plate (11 a), and the bottom surface (162) of the second metal pillar (16) does not protrude from the lower surface of the negative electrode plate (11 b).
  8. 8. The LED package structure of claim 2, further comprising: A white glue layer (17) filled at the bottom of the bowl cup (14) to cover the die bonding area (111 a), wherein the white glue layer (17) is positioned outside each LED chip (12); and the packaging adhesive layer (18) is filled in the bowl cup (14) to cover the white adhesive layer (17) and each LED chip (12).
  9. 9. The LED package structure according to claim 8, wherein the height of the upper surface of the white glue layer (17) decreases in the direction from outside to inside of the bowl cup (14).
  10. 10. An LED lighting device comprising the LED package structure of any one of claims 1 to 9.

Description

LED packaging structure and LED light-emitting device Technical Field The application relates to the technical field of LEDs, in particular to an LED packaging structure and an LED light-emitting device. Background Along with the increase of the high brightness and high integration demands of the LED packaging structure, the number of the LED chips arranged in the die bonding area is gradually increased, and the distance between two adjacent LED chips is also reduced, so that the die bonding glue of the two adjacent LED chips is easy to spread mutually in the die bonding process to cause the offset of the die bonding position, thereby being unfavorable for the tight arrangement of the LED chips in the die bonding area and causing lower utilization rate of the die bonding area. Disclosure of utility model The embodiment of the application provides an LED packaging structure and an LED light-emitting device, which are used for solving the problem of lower utilization rate of a die bonding area in the related technology. In one aspect, the present application provides an LED package structure, including: The upper surface of the substrate is provided with a die bonding area; At least two LED chips are arranged in the die bonding area at intervals, and each LED chip is bonded with the upper surface of the substrate through die bonding glue; At least one first groove is arranged in the die bonding area, and each first groove is recessed from the upper surface of the substrate to the lower surface of the substrate and is positioned between two adjacent LED chips. In one embodiment, the LED package structure further includes: The bowl cup is arranged on the upper surface of the base plate, and a die bonding area is formed in an area surrounded by the bowl cup on the upper surface of the base plate; At least one second groove is arranged in the die bonding area, and each second groove is recessed from the upper surface of the substrate to the lower surface of the substrate and is positioned between the bowl cup and the LED chip adjacent to the bowl cup. In one embodiment, the die bonding area is rectangular, at least two LED chips are arranged at intervals along a first direction, the first groove and the second groove extend along a second direction, the first direction is perpendicular to the second direction, the first direction is any one of the width direction and the length direction of the die bonding area, and the second direction is the other one of the width direction and the length direction of the die bonding area. In one embodiment, the substrate includes a positive plate, a negative plate, and an insulating tape between the positive plate and the negative plate, and the LED package structure further includes: The first metal column and the second metal column penetrate through the bowl cup in the vertical direction and are located outside the die bonding area, the top surface of the first metal column is connected with the positive electrode of one of the at least two LED chips through a first bonding wire, the bottom surface of the first metal column is connected with the positive electrode plate, the top surface of the second metal column is connected with the negative electrode of the other of the at least two LED chips through a second bonding wire, and the bottom surface of the second metal column is connected with the negative electrode plate. In one embodiment, the top surface of the first metal pillar and the top surface of the second metal pillar are both higher than the upper surface of the die attach adhesive. In one embodiment, the top surface of the first metal pillar and the top surface of the second metal pillar are both parallel to the upper surface of the substrate such that the top surface of the first metal pillar forms the second bond site of the first bond wire and the top surface of the second metal pillar forms the second bond site of the second bond wire. In one embodiment, the height of the inner side wall of the bowl decreases in the direction from outside to inside of the bowl, the top surface of the first metal post and the top surface of the second metal post both pass through the inner side wall of the bowl, and the height of the top surface of the first metal post and the top surface of the second metal post are both lower than the height of the top surface of the bowl; and/or the bottom surface of the first metal pillar does not protrude from the lower surface of the positive electrode plate, and the bottom surface of the second metal pillar does not protrude from the lower surface of the negative electrode plate. In one embodiment, the LED package structure further includes: The white glue layer is filled at the bottom of the bowl cup to cover the die bonding area, and is positioned outside each LED chip; And the packaging adhesive layer is filled in the bowl cup to cover the white adhesive layer and each LED chip. In one embodiment, the height of the upper surface of