CN-224218774-U - Packaging structure

Abstract

The application relates to the technical field of solar cells, in particular to a packaging structure, which comprises a flexible substrate, a flexible cover plate, a perovskite component and packaging glue, wherein the perovskite component is arranged between the flexible substrate and the flexible cover plate, the flexible substrate, the perovskite component and the flexible cover plate are arranged in a stacked mode along a first direction, the projection of the perovskite component on the flexible substrate along the first direction is completely positioned in the outer contour of the flexible substrate, the projection of the perovskite component on the flexible cover plate along the first direction is completely positioned in the outer contour of the flexible cover plate, the packaging glue is filled between the flexible substrate and the flexible cover plate, and the minimum width of the packaging glue which surrounds the periphery of the perovskite component and continuously extends along a second direction is A, wherein A is more than or equal to 3mm. The packaging structure can enhance the sealing effect, improve the problem that water vapor is easy to invade the perovskite component, and improve the wet-heat stability of the perovskite component.

Inventors

• Request for anonymity
• Request for anonymity
• Request for anonymity

Assignees

• 深圳市光因科技有限公司
• 光因(江苏)新能源有限公司

Dates

Publication Date

20260508

Application Date

20250617

Claims (10)

1. 1. A package structure, comprising: a flexible substrate; A flexible cover plate; The perovskite component is arranged between the flexible substrate and the flexible cover plate, and is arranged in a stacked manner along a first direction, and is used for converting light energy into electric energy; wherein a projection of the perovskite assembly onto the flexible substrate along a first direction is entirely within an outer contour of the flexible substrate, and a projection of the perovskite assembly onto the flexible cover plate along the first direction is entirely within an outer contour of the flexible cover plate; The perovskite assembly is filled between the flexible substrate and the flexible cover plate, the perovskite assembly is provided with a first surface facing the flexible cover plate, the first surface comprises a first central part and a first edge part surrounding the first central part, and the first edge part is covered by the first part of the encapsulation adhesive; the minimum width of the second part of the packaging adhesive, which extends continuously along the second direction, is A, and A is more than or equal to 3mm.
2. 2. The package structure of claim 1, wherein A satisfies A≤50 mm.
3. 3. The package structure of claim 1, further comprising a first light-transmitting layer sandwiched between the flexible cover plate and the first central portion, wherein the encapsulation glue surrounds a periphery of the first light-transmitting layer.
4. 4. The package structure according to claim 3, the packaging structure is characterized by further comprising: The second light-transmitting layer is clamped between the perovskite component and the flexible substrate, and the packaging adhesive is arranged on the periphery of the second light-transmitting layer in a surrounding mode.
5. 5. The package structure of claim 4, wherein the second light transmissive layer and the perovskite assembly have the same area on opposite surfaces, and the second light transmissive layer and the perovskite assembly are disposed in a coincident arrangement.
6. 6. The package structure of claim 4, wherein the perovskite assembly has a second surface facing the flexible substrate, the second surface including a second center portion and a second edge portion surrounding the second center portion, the second light-transmitting layer being sandwiched between the second center portion and the flexible substrate, the encapsulation glue being filled between the second edge portion and the flexible substrate.
7. 7. The package structure of claim 4, wherein the encapsulation compound comprises one of butyl compound, epoxy resin, and polysiloxane, and/or, The first light-transmitting layer and/or the second light-transmitting layer comprises one of polyolefin elastomer, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polyvinyl butyral, polyoxyethylene, polyurethane, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, fluorinated polyacrylate, polyacrylic acid, polyimide, polycarbonate, polystyrene, parylene, polylactic acid, polyethylene, polypropylene, fluorinated polymer, silicon oxide, tin oxide, aluminum oxide, zirconium oxide, nickel oxide, zinc oxide, titanium oxide, silicon nitride and titanium nitride.
8. 8. The package structure of claim 1, wherein the encapsulation glue is filled between the first central portion and the flexible cover plate.
9. 9. The encapsulation structure of claim 8, wherein the encapsulation glue completely encapsulates the perovskite assembly.
10. 10. The package structure according to claim 8, the packaging structure is characterized by further comprising: The second light-transmitting layer is clamped between the perovskite component and the flexible substrate, the packaging adhesive is arranged on the periphery of the second light-transmitting layer in a surrounding mode, and the second light-transmitting layer is formed by coating a layer of polymethyl methacrylate on the flexible substrate through a slit.

Description

Packaging structure Technical Field The application relates to the technical field of perovskite solar cells, in particular to a packaging structure. Background The packaging structure of the flexible perovskite solar cell generally adopts a sandwich structure, namely the packaging structure comprises a substrate, a cover plate and a perovskite assembly, and the substrate layer, the cover plate layer and the perovskite assembly layer are bonded into a whole by using bonding materials. In the mode, gaps between each two layers are all paths of water vapor invasion, in the actual use process, the bending parts of the flexible perovskite solar cell are easy to glue and delaminate, so that the sealing effect is poor, water vapor is easy to invade, and water vapor contacts with the perovskite component, so that the perovskite component is easy to degrade. Disclosure of utility model In order to solve the technical problems, the embodiment of the application provides a packaging structure which can enhance the sealing effect, improve the problem that water vapor is easy to invade into a perovskite component and improve the wet and heat stability of the perovskite component. In a first aspect, a package structure is provided, including: a flexible substrate; A flexible cover plate; The perovskite component is arranged between the flexible substrate and the flexible cover plate, and is arranged in a stacked manner along a first direction, and is used for converting light energy into electric energy; wherein a projection of the perovskite assembly onto the flexible substrate along a first direction is entirely within an outer contour of the flexible substrate, and a projection of the perovskite assembly onto the flexible cover plate along the first direction is entirely within an outer contour of the flexible cover plate; The perovskite assembly is filled between the flexible substrate and the flexible cover plate, the perovskite assembly is provided with a first surface facing the flexible cover plate, the first surface comprises a first central part and a first edge part surrounding the first central part, and the first edge part is covered by the first part of the encapsulation adhesive; The minimum width of the second part of the packaging adhesive, which extends continuously along the second direction, is A, and A is more than or equal to 3mm. According to a first aspect of the application, the A satisfies that A≤50 mm. According to the first aspect of the application, the packaging structure further comprises a first light-transmitting layer, the first light-transmitting layer is sandwiched between the flexible cover plate and the first central portion, and the packaging adhesive is enclosed on the periphery of the first light-transmitting layer. According to a first aspect of the present application, the package structure further includes: The second light-transmitting layer is clamped between the perovskite component and the flexible substrate, and the packaging adhesive is arranged on the periphery of the second light-transmitting layer in a surrounding mode. According to the first aspect of the application, the areas of the two opposite surfaces of the second light-transmitting layer and the perovskite component are the same, and the two opposite surfaces of the second light-transmitting layer and the perovskite component are arranged in a superposition mode. According to a first aspect of the application, the perovskite assembly has a second surface facing the flexible substrate, the second surface comprising a second central portion and a second edge portion surrounding the second central portion, the second light-transmitting layer being sandwiched between the second central portion and the flexible substrate, the second edge portion being filled with the encapsulation glue with the flexible substrate. According to a first aspect of the application, the encapsulation glue comprises one of butyl glue, epoxy resin, polysiloxane, and/or, The first light-transmitting layer and/or the second light-transmitting layer comprises one of polyolefin elastomer, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polyvinyl butyral, polyoxyethylene, polyurethane, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, fluorinated polyacrylate, polyacrylic acid, polyimide, polycarbonate, polystyrene, parylene, polylactic acid, polyethylene, polypropylene, fluorinated polymer, silicon oxide, tin oxide, aluminum oxide, zirconium oxide, nickel oxide, zinc oxide, titanium oxide, silicon nitride and titanium nitride. According to a first aspect of the application, the encapsulation glue is filled between the first central part and the flexible cover plate. According to a first aspect of the application, the encapsulation cement completely encapsulates the perovskite assembly. According to a first aspect of the present application, the package structure further includes: The second light-transmitting