CN-224218781-U - Miniature thermoelectric generation chip packaging structure

CN224218781UCN 224218781 UCN224218781 UCN 224218781UCN-224218781-U

Abstract

The application relates to the technical field of chip packaging equipment, in particular to a miniature thermoelectric power generation chip packaging structure which comprises a base, an upright post and a cross beam, wherein the upright post is vertically assembled on one side of the base, the cross beam is horizontally assembled on the top of the upright post, an XY axis moving mechanism is arranged on the base, a rotating mechanism is arranged on the XY axis moving mechanism, a die for placing a heat conducting plate is arranged on the rotating mechanism, the XY axis moving mechanism is used for driving the die to horizontally move along an X axis or a Y axis, the rotating mechanism is used for driving the die to horizontally rotate, a lifting mechanism is arranged at the bottom of the cross beam, an electric heating plate is arranged at the bottom of the lifting mechanism, the lifting mechanism is used for driving the electric heating plate to be close to or far away from the die, and a heat dissipation mechanism is further arranged on the cross beam and/or the base. The miniature thermoelectric power generation chip packaging structure disclosed by the application has the advantages that the labor participation is less, the packaging effect on the miniature thermoelectric power generation chip is good, the packaging efficiency is higher, and the product quality is indirectly improved.

Inventors

LI WENZHENG
ZHANG YANG
WANG ZHIBIN
XIONG TONGQIANG
QUAN ANLONG
TANG TONG
HUO RAN
She Xinqi
LUO XINYU
WANG YU
HUANG BEIBEI
FENG BO
LI MEIYING

Assignees

湖北科技学院
湖北香城维波科技有限公司

Dates

Publication Date: 20260508
Application Date: 20250423

Claims (8)

1. The utility model provides a miniature difference in temperature power generation chip packaging structure, its characterized in that, is in including base (1), stand (2) and crossbeam (3), the vertical assembly of stand (2) is in one side of base (1), crossbeam (3) horizontal assembly is in the top of stand (2), be provided with XY axle moving mechanism (4) on base (1), be provided with slewing mechanism (5) on XY axle moving mechanism (4), be provided with on slewing mechanism (5) mould (6) that are used for placing the heat-conducting plate, XY axle moving mechanism (4) are used for driving mould (6) are along X axle or Y axle horizontal movement, slewing mechanism (5) are used for driving mould (6) horizontal rotation, the bottom of crossbeam (3) is provided with elevating system (7), the bottom of elevating system (7) is provided with electrical heating board (8), elevating system (7) are used for driving electrical heating board (8) are close to or keep away from mould (6), crossbeam (3) and/or still be provided with cooling machanism (9) on base (1).
2. The micro thermoelectric generation chip packaging structure according to claim 1, wherein the XY axis moving mechanism (4) comprises a first linear sliding table module (41) and a second linear sliding table module (42) which are driven by a servo motor, the first linear sliding table module (41) is arranged along the X axis direction, the second linear sliding table module (42) is arranged along the Y axis direction, the rotating mechanism (5) is mounted on the first linear sliding table module (41) and is driven to slide by the first linear sliding table module (41), and the first linear sliding table module (41) is mounted on the second linear sliding table module (42) and is driven to slide by the second linear sliding table module (42).
3. The packaging structure of the micro thermoelectric power generation chip according to claim 2, wherein the XY axis moving mechanism (4) further comprises a guide rod sliding block module (43), the guide rod sliding block module (43) and the second linear sliding block module (42) are arranged in parallel, and the guide rod sliding block module and the second linear sliding block module are respectively located at two sides of the bottom of the first linear sliding block module (41).
4. The packaging structure of the micro thermoelectric generation chip according to claim 1, wherein the rotating mechanism (5) comprises a rotating motor (51) and a connecting flange plate (52), the connecting flange plate (52) is horizontally arranged and connected to an output shaft of the rotating motor (51), and the connecting flange plate (52) is attached to the bottom surface of the die (6) and fixedly connected through a plurality of groups of screws.
5. The packaging structure of the micro thermoelectric generation chip according to claim 1, wherein a groove (61) adapted to a heat conducting plate is formed in the upper surface of the die (6), and the die (6) is a stainless steel piece.
6. The micro thermoelectric power generation chip packaging structure according to claim 1, wherein the lifting mechanism (7) comprises two groups of lifting cylinders (71) and a bearing plate (72) which is horizontally arranged, the top of the body of the lifting cylinders (71) is fixed on the lower surface of the cross beam (3), the bearing plate (72) is fixed on the bottom of an output shaft of the lifting cylinders (71), and the electric heating plate (8) is fixed on the lower surface of the bearing plate (72).
7. The micro thermoelectric power generation chip packaging structure according to claim 6, wherein the bearing plate (72) is a stainless steel mesh plate, and the projection area of the bearing plate (72) from top to bottom completely covers the movement range of the die (6).
8. The micro thermoelectric power generation chip packaging structure according to claim 1, wherein the heat dissipation mechanism (9) comprises a first industrial fan (91), a support (92) and a plurality of second industrial fans (93), the first industrial fan (91) is installed on the lower surface of the cross beam (3) and used for cooling the electric heating plate (8) from top to bottom, the support (92) is vertically installed on the other side of the base (1), the second industrial fan (93) is installed on the support (92), and the second industrial fan (93) is used for cooling the electric heating plate (8) and the die (6) from side portions.

Description

Miniature thermoelectric generation chip packaging structure Technical Field The application relates to the technical field of chip packaging equipment, in particular to a miniature thermoelectric power generation chip packaging structure. Background The thermoelectric effect is a phenomenon in which current or charge is accumulated when electrons in a heated object move from a high temperature region to a low temperature region with a temperature gradient. Thermoelectric effects have been widely used in various fields such as thermocouples, thermoelectric generators, refrigeration chips, and the like. Thermoelectric power generation is to directly convert heat energy into electric energy, and the moving heat energy is converted into electric energy by heat generated by the temperature difference between high temperature and low temperature so as to generate power. The temperature difference exists in any place on the earth, so that the method has infinite utilization prospect, the application field can be from families to the whole earth, and the available heat source temperature range is wider. For packaging of thermoelectric power generation chips, in traditional production, a plurality of N-type thermoelectric elements and P-type thermoelectric elements are manually placed on designated positions of a heat conducting plate by workers, and then a heating device is manually placed on the heat conducting plate to thermally press the N-type thermoelectric elements and the P-type thermoelectric elements to complete packaging, so that time and labor are wasted, the working efficiency is low, and the product quality is affected. Disclosure of utility model The application provides a packaging structure of a miniature thermoelectric power generation chip, which aims to improve the following technical problems: For packaging of thermoelectric power generation chips, in traditional production, a plurality of N-type thermoelectric elements and P-type thermoelectric elements are manually placed on designated positions of a heat conducting plate by workers, and then a heating device is manually placed on the heat conducting plate to thermally press the N-type thermoelectric elements and the P-type thermoelectric elements to complete packaging, so that time and labor are wasted, the working efficiency is low, and the product quality is affected. The application provides a miniature thermoelectric generation chip packaging structure, which adopts the following technical scheme: A packaging structure of a miniature thermoelectric generation chip comprises a base, an upright post and a cross beam, wherein the upright post is vertical The assembly is in one side of base, the crossbeam level assembly is in the top of stand, be provided with XY axle moving mechanism on the base, be provided with slewing mechanism on the XY axle moving mechanism, be provided with the mould that is used for placing the heat-conducting plate on the slewing mechanism, XY axle moving mechanism is used for driving the mould is along X axle or Y axle horizontal movement, slewing mechanism is used for driving the mould horizontal rotation, the bottom of crossbeam is provided with elevating system, elevating system's bottom is provided with the electrical heating board, elevating system is used for driving the electrical heating board is close to or keeps away from the mould, the crossbeam and/or still be provided with cooling machanism on the base. In one implementation technical scheme of the application, the XY axis moving mechanism comprises a first linear sliding table module and a second linear sliding table module which are driven by a servo motor, wherein the first linear sliding table module is arranged along the X axis direction, the second linear sliding table module is arranged along the Y axis direction, the rotating mechanism is arranged on the first linear sliding table module and is driven to slide by the first linear sliding table module, and the first linear sliding table module is arranged on the second linear sliding table module and is driven to slide by the second linear sliding table module. In one technical scheme of the application, the XY axis moving mechanism further comprises a guide rod sliding block module, wherein the guide rod sliding block module and the second linear sliding table module are arranged in parallel and are respectively positioned at two sides of the bottom of the first linear sliding table module. In one technical scheme of the application, the rotating mechanism comprises a rotating motor and a connecting flange, wherein the connecting flange is horizontally arranged and connected to an output shaft of the rotating motor, and the connecting flange is attached to the bottom surface of the die and fixedly connected through a plurality of groups of screws. In one technical scheme of the application, the upper surface of the die is provided with a groove matched with the heat-conducting plate, and the di