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CN-224218784-U - Wafer processing expands brilliant anchor clamps self-adaptation pressure regulation structure

CN224218784UCN 224218784 UCN224218784 UCN 224218784UCN-224218784-U

Abstract

The utility model provides a self-adaptive pressure regulating structure of a wafer processing and crystal expanding clamp, which relates to the field of wafer processing clamps and comprises a base and a fixed plate, wherein a first driving piece and a second driving piece are arranged on the upper side of the base, a crystal expanding table is arranged between the first driving piece and the second driving piece, the lower end of the crystal expanding table is connected with a rotating table, the fixed plate is connected to the outer end of the base, the lower end of the fixed plate is provided with a motor, the upper end of the motor is connected with a rotating plate, the upper side of the outer end of the rotating plate is connected with a cylinder, the lower end of the cylinder is connected with a sucking disc, the bottom of the sucking disc is provided with a sucking hole, the lower side of the sucking disc is provided with a mounting groove, a pressure sensor is mounted in the mounting groove, and the lower end of the pressure sensor is connected with a buffer pad. The utility model has the advantages of stable clamping force application, stable clamping adaptability force effect and uniform negative pressure adsorption effect.

Inventors

  • MA ZHENGFANG
  • YU YANG

Assignees

  • 江苏众晶半导体有限公司

Dates

Publication Date
20260508
Application Date
20250508

Claims (7)

  1. 1. The wafer processing expands brilliant anchor clamps self-adaptation pressure regulation structure, including base (1) and fixed plate (5), the upside of base (1) is equipped with first driving piece (2) and second driving piece (4), and be equipped with between first driving piece (2) and second driving piece (4) and expand brilliant platform (3), and the lower extreme of expanding brilliant platform (3) is connected with the revolving stage, wherein fixed plate (5) are connected in the outer end of base (1), and fixed plate (5) lower extreme installs motor (6), and the upper end of motor (6) is connected with rotor plate (7), the outer end upside of rotor plate (7) is connected with cylinder (9), and the lower extreme of cylinder (9) is connected with sucking disc (10), and sucking hole (14) have been seted up to the bottom of sucking disc (10), mounting groove (101) have been seted up to the downside of sucking disc (10), and install pressure sensor (102) in mounting groove (101), and the lower extreme of pressure sensor (102) is connected with blotter (105).
  2. 2. The adaptive pressure adjusting structure of the wafer processing die-expanding clamp according to claim 1, wherein the output shaft end of the motor (6) rotates through the fixed plate (5), and the output shaft is fixedly connected with one end of the rotating plate (7).
  3. 3. The wafer processing wafer expanding fixture self-adaptive pressure adjusting structure according to claim 1, wherein the upper end of the rotating plate (7) is connected with a vacuum pump (8), and the air extraction end of the vacuum pump (8) is connected with a hose (81).
  4. 4. The self-adaptive pressure adjusting structure of the wafer processing wafer expanding clamp according to claim 1, wherein the upper end of the sucker (10) is connected with a guide rod (13), and the guide rod (13) is fixed at the lower end of the rotating plate (7).
  5. 5. The self-adaptive pressure adjusting structure of the wafer processing die-expanding clamp according to claim 1, wherein an air pipe (11) is arranged at the upper end of the sucker (10), the air pipe (11) is circumferentially and radially arranged at the upper side of the sucker (10), and a ring pipe (12) is connected to the upper end of the air pipe (11).
  6. 6. The wafer processing die-expanding fixture self-adaptive pressure adjusting structure according to claim 5, wherein the ring pipe (12) is communicated with each air pipe (11), the upper end of the ring pipe (12) is connected with the lower end of the hose (81), the lower pipe wall of the air pipe (11) is provided with a through hole, and the through hole is communicated with the suction hole (14).
  7. 7. The wafer processing wafer expanding clamp self-adaptive pressure adjusting structure according to claim 1, wherein a buffer groove (106) is formed in the lower side of the mounting groove (101), a sliding plate (103) is connected to the lower end of the pressure sensor (102), a telescopic rod (104) is connected to the lower end of the sliding plate (103), and meanwhile, the buffer pad (105) is rotatably connected to the lower end of the telescopic rod (104).

Description

Wafer processing expands brilliant anchor clamps self-adaptation pressure regulation structure Technical Field The utility model relates to the technical field of wafer processing clamps, in particular to a self-adaptive pressure adjusting structure of a wafer processing wafer expanding clamp. Background In order to facilitate dicing and mounting of the wafer, after the wafer assembly is lifted out, a wafer expanding process is required to be performed on the wafer assembly so as to expand the spacing between the plurality of wafer pieces on the wafer assembly. Through searching, the prior art (bulletin number: CN 210778500U) describes a wafer expanding device, which comprises a supporting plate and a wafer rotating table rotatably arranged on the supporting plate, wherein a second driving part comprises a plurality of screw rods rotatably arranged, a plurality of nut pieces sleeved on the screw rods in a screwed manner, a first gear arranged on one screw rod, a second gear arranged on a first motor of the supporting plate, a movable carrier gear, a driving unit and a first motor, wherein the driving unit drives the carrier gear to engage with the first gear and the second gear, the first motor drives the screw rods to rotate through the second gear, the carrier gear and the first gear so that the nut pieces drive the wafer expanding table to move close to the wafer rotating table to realize wafer expanding treatment, and when crystal expanding is not needed, the driving unit drives the carrier gear to disengage from the first gear and the second gear. The dual functions of crystal expansion and rotation are realized, the power transmission of the first motor is realized by utilizing the carrier gear during crystal expansion, the carrier gear is separated after crystal expansion, and the free rotation operation of the wafer rotating table is realized. " Although the wafer expanding device in the prior art realizes the effects of being convenient to use and improving the wafer expanding efficiency, the wafer expanding device still has the defects that the existing wafer expanding device needs a clamp to transfer the wafer when in use, the existing mechanical clamp possibly has the clamping damage phenomenon, the existing sucking disc type clamp possibly causes the concentrated suction force of a certain area to cause the local deformation of the wafer, and meanwhile, the force applied to the wafer cannot be detected in the clamping process. Disclosure of utility model In order to overcome the defects in the prior art, a self-adaptive pressure adjusting structure of a wafer processing and expanding clamp is provided to solve the problems in the prior art. In order to achieve the above purpose, the wafer processing crystal expanding clamp self-adaptive pressure adjusting structure comprises a base and a fixed plate, wherein a first driving piece and a second driving piece are arranged on the upper side of the base, a crystal expanding table is arranged between the first driving piece and the second driving piece, the lower end of the crystal expanding table is connected with a rotating table, the fixed plate is connected to the outer end of the base, a motor is arranged at the lower end of the fixed plate, the upper end of the motor is connected with a rotating plate, the upper side of the outer end of the rotating plate is connected with an air cylinder, the lower end of the air cylinder is connected with a sucking disc, a sucking hole is formed in the bottom of the sucking disc, a mounting groove is formed in the lower side of the sucking disc, a pressure sensor is arranged in the mounting groove, and the lower end of the pressure sensor is connected with a buffer pad. Further, the output shaft end of the motor rotates to pass through the fixed plate, and the output shaft is fixedly connected with one end of the rotating plate. Further, the upper end of the rotating plate is connected with a vacuum pump, and the air extraction end of the vacuum pump is connected with a hose. Further, the upper end of sucking disc is connected with the guide bar, and the guide bar is fixed in the lower extreme of rotor plate. Further, the upper end of the sucker is provided with an air pipe, the air pipe is arranged on the upper side of the sucker in a circumferential radial mode, and the upper end of the air pipe is connected with a ring pipe. Further, the circular pipe is communicated with each air pipe, the upper end of the circular pipe is connected with the lower end of the hose, the wall of the lower end of the air pipe is provided with a through hole, and meanwhile, the through hole is communicated with the suction hole. Further, the buffer tank has been seted up to the downside of mounting groove, and the pressure sensor lower extreme is connected with the slide to the lower extreme of slide is connected with the telescopic link, and the blotter rotates simultaneously and connects the lower extreme at the telescopic l