CN-224218786-U - Manual adhesive sheet plate with positioning structure

CN224218786UCN 224218786 UCN224218786 UCN 224218786UCN-224218786-U

Abstract

The utility model belongs to the technical field of semiconductor manufacturing, and particularly relates to a manual wafer bonding plate with a positioning structure, which comprises a limiting strip, a label, positioning edges, a wafer bonding plate and a notch, wherein the wafer bonding plate is provided with a fixed limiting edge for limiting the placement direction of a wafer ring, the bottom edge of the wafer bonding plate is provided with a circular arc-shaped notch which is convenient for taking the wafer ring and a blue film after bonding, the wafer bonding area of the wafer bonding plate is provided with two positioning edges for limiting the placement position of the wafer ring on the wafer bonding plate, the central area of the wafer bonding plate is provided with a positioning plate which is manufactured in advance according to the wafer size and the label position, the front end of the wafer bonding plate is provided with a position for placing a wafer basket, and the front end of the wafer bonding plate, which is close to the opening end of the wafer basket, is provided with a protruding limiting strip for filling one end of the wafer basket so as to facilitate checking laser mark information on the wafer.

Inventors

WANG JIUFENG
ZHAO YANQI
LIU SHUANG
QIAN CHENG
LI QIANG

Assignees

吉林华耀半导体有限公司

Dates

Publication Date: 20260508
Application Date: 20250520

Claims (6)

1. The adhesive sheet plate is characterized by comprising an adhesive sheet plate body, limiting strips, positioning edges, positioning sheets and notches, wherein the center of the bottom edge of the adhesive sheet plate body is provided with a circular arc-shaped notch, the upper end of the adhesive sheet plate body is provided with a protruding limiting strip, the upper surface of the limiting strip is higher than the upper surface of the adhesive sheet plate body, the surface of the adhesive sheet plate body is provided with two positioning edges side by side along the length direction, a rectangular accommodating area is formed between the positioning edges, the positioning sheets are detachably assembled in the accommodating area and are attached to the two positioning edges, and the upper end of the adhesive sheet plate body also forms a step area.
2. The adhesive sheet according to claim 1, wherein the circular arc-shaped opening is semicircular, and the center of the opening is located at the midpoint of the bottom edge of the adhesive sheet body.
3. The adhesive sheet according to claim 1, wherein the limit strips and the adhesive sheet body are integrally formed by a single piece of material, and the cross section of the limit strips is trapezoidal.
4. The adhesive sheet according to claim 1, wherein the two positioning edges are parallel to each other and to the side edges of the adhesive sheet body.
5. The adhesive sheet according to claim 1, wherein the periphery of the locating tab forms an interference fit with the two locating edges, and wherein the upper surface of the locating tab is coplanar with the upper surface of the adhesive sheet body.
6. The adhesive sheet according to claim 1, wherein a rectangular label attachment groove is provided in the middle of the positioning sheet, and the center of the groove is located above the geometric center line of the adhesive sheet body.

Description

Manual adhesive sheet plate with positioning structure Technical Field The utility model belongs to the technical field of semiconductor manufacturing, but is not limited to the technical field of semiconductor manufacturing, and particularly relates to a manual adhesive plate with a positioning structure. Background After the semiconductor wafer is subjected to the CP test, a precise dicing saw is required to cut the whole wafer pattern into single dies according to the preset interval, and then the single dies are subjected to packaging. The wafer needs to be subjected to die bonding operation by using an electronic blue film before dicing. Specifically, the wafer is pasted on an electronic blue film with a wafer ring, and a label of detailed information of the wafer is pasted, such as a product name, a product batch number, a product jump number, the number of qualified core particles of the product and the like. Currently, some customers of this pre-dicing die bonding operation are done using a specialized die bonder, and some customers are done manually with a die bonder blade. The relative positions of the wafer, the wafer ring and the label are fixed by using a die bonder, but the relative positions of the wafer, the wafer ring and the label are not fixed by using a manual die bonder, and the unfixed positions have influence on subsequent packaging operation. The prior art discloses a sticking sheet plate, which comprises a sticking sheet plate body, a limiting strip, positioning edges, positioning sheets and a notch, wherein the center of the bottom edge of the sticking sheet plate body is provided with a circular arc notch, the upper end of the sticking sheet plate body is provided with a convex limiting strip, the upper surface of the limiting strip is higher than the upper surface of the sticking sheet plate body, the surface of the sticking sheet plate body is provided with two positioning edges side by side along the length direction, a rectangular accommodating area is formed between the positioning edges, the positioning sheets are detachably assembled in the accommodating area and are attached to the two positioning edges, and the upper end of the sticking sheet plate body also forms a step area. In the prior art, although the structure level comprises basic elements such as a limit strip, a locating edge, a locating plate and the like, three technical problems still exist, namely firstly, the limit strip and the adhesive plate body are usually fixedly connected through secondary assembly or screws, high mismatch of 0.1mm level is easy to generate after assembly tolerance accumulation, stable double-sided reference cannot be provided at the initial stage of mounting, micro-drifting of a substrate is caused, secondly, the locating plate and the locating edge are mostly designed in a clearance fit or flush way, an interference compaction and coplanar locking mechanism is lacked, micro-vibration is easy to generate under the heat-mechanical coupling load of reflow soldering and drop test, and patch offset and solder joint virtual soldering are caused. In the prior art, the upper surfaces of the limit strips, the step areas and the adhesive sheet plates are processed on the same plane, the stepped thickness abrupt change is lacked to buffer expansion caused by heat and contraction caused by cold, the bottom edge is provided with an arc opening, but the stress gradient optimization is not carried out on the edge of the opening, and after continuous 85 ℃ accelerated aging or multiple clamping-disassembling cycles, stress concentration cracks still occur on the bottom edge, so that the service life of the jig is shortened, and the reliability of products is reduced. In addition, the locating plate lacks label recess and vision-touch dual location guide, makes the operator need rely on secondary visual inspection, reduces clamping beat, can not satisfy high beat SMT production line to the demand of efficiency and uniformity. Disclosure of Invention Aiming at the problems existing in the prior art, the utility model provides a manual adhesive plate with a positioning structure. The manual wafer bonding plate with the positioning structure comprises a limiting strip, a label, positioning edges, a wafer bonding plate and a notch, wherein the wafer bonding plate is provided with a fixed limiting edge used for limiting the placement direction of a wafer ring, the bottom edge of the wafer bonding plate is provided with a circular arc notch which is convenient for taking the wafer ring and a blue film after bonding, the wafer bonding area of the wafer bonding plate is provided with two positioning edges used for limiting the placement position of the wafer ring on the wafer bonding plate, the center area of the wafer bonding plate is provided with a positioning plate which is manufactured in advance according to the size of the wafer and the position of the label, the front end of the wafer bonding plate i