CN-224218789-U - Unloading equipment on wafer

Abstract

The utility model relates to the technical field of semiconductor testing, in particular to wafer blanking equipment which comprises an installation table for installing a wafer, wherein the wafer can be fixedly arranged on the installation table through a locking piece, a dismounting device comprises a dismounting assembly, a temperature detection assembly, a height detection assembly and a prompting assembly, the temperature detection assembly is electrically connected with the dismounting assembly and used for acquiring a temperature value of the installation table, the dismounting assembly is rotationally connected with the locking piece, the height detection assembly is electrically connected with the prompting assembly and used for acquiring a height value of the locking piece relative to the installation table, and the prompting assembly sends out warning information.

Inventors

• WANG YONG
• TANG RENWEI
• XIE ZHIYIN

Assignees

• 苏州联讯仪器股份有限公司

Dates

Publication Date

20260508

Application Date

20250331

Claims (10)

1. 1. Unloading equipment on wafer, its characterized in that includes: The wafer mounting device comprises a mounting table, wherein a locking piece is arranged on the mounting table, and the wafer can be fixedly arranged on the mounting table through the locking piece; The dismounting device comprises a dismounting assembly, a temperature detection assembly, a height detection assembly and a prompt assembly; The temperature detection assembly is electrically connected with the disassembly assembly, the temperature detection assembly is used for acquiring the temperature value of the mounting table, and the disassembly assembly is rotationally connected with the locking piece; The height detection assembly is electrically connected with the prompt assembly, the height detection assembly is used for acquiring the height value of the locking piece relative to the mounting table, and the prompt assembly is used for sending out warning information.
2. 2. The wafer blanking apparatus of claim 1, wherein the dismounting assembly includes a dismounting member and an adsorption sleeve sleeved outside the dismounting member; An adsorption channel is formed between the side wall of the dismounting piece and the side wall of the adsorption sleeve, and an inlet of the adsorption channel is arranged above the wafer.
3. 3. The apparatus of claim 2, wherein the dismounting member is disposed at an end of the suction sleeve adjacent to the wafer.
4. 4. The wafer blanking apparatus of claim 2, wherein the detaching member has a clamping groove near an end of the wafer, the clamping groove is clamped with an end of the locking member, and the detaching member can drive the locking member to rotate.
5. 5. The wafer blanking apparatus of claim 4, wherein at least one adsorption hole is provided on a sidewall of the clamping groove, and the adsorption hole is communicated with the adsorption channel.
6. 6. The wafer blanking apparatus of claim 2, wherein the disassembling assembly further includes a vacuum adsorbing assembly in communication with the adsorbing channel, the vacuum adsorbing assembly for adsorbing air in the adsorbing channel to form a negative pressure in the adsorbing channel.
7. 7. The apparatus of any of claims 1-6, wherein the temperature sensing assembly and the height sensing assembly are both disposed on the removal assembly, the temperature sensing assembly, the height sensing assembly, and the removal assembly cooperatively moving.
8. 8. The apparatus of claim 7, wherein the dismounting device further comprises a drive assembly, the dismounting assembly being drivingly connected to the drive assembly, the drive assembly being capable of driving the dismounting assembly toward or away from the wafer.
9. 9. The apparatus of any of claims 1-6, further comprising a data acquisition device configured to acquire the wafer code information, the data acquisition device being disposed above the mounting table and the data acquisition device being fixedly coupled to the detachment assembly.
10. 10. The wafer blanking apparatus of any of claims 1-6, wherein an axis of the locking member is parallel to an axis of the dismounting member.

Description

Unloading equipment on wafer Technical Field The utility model relates to the technical field of semiconductor testing, in particular to wafer blanking equipment. Background As electronic products require electronic devices with good performance and reliability, electrical performance testing of wafers is required. The existing test equipment mainly comprises blanking equipment and wafer test equipment on a wafer, so that automatic test of chips is realized. After the tested wafer enters the wafer blanking equipment, the tested wafer needs to be conveyed from the wafer blanking equipment to the wafer testing equipment so as to perform performance test on the tested wafer, and in order to ensure that the wafer does not shift in the testing process, the wafer needs to be fixed on the wafer testing equipment, namely the wafer needs to be fixed or detached in the wafer loading and blanking process; In the prior art, manual installation or disassembly is generally adopted in the process of disassembling the wafer, so that the installation or disassembly efficiency is low, and the influence of environmental factors on the disassembly of the wafer is not considered in the process of disassembling the wafer, so that the wafer is easy to deform, and the wafer test result is influenced. Disclosure of utility model In order to solve the technical problems, the utility model can ensure the mounting precision of the wafer and the mounting table, and simultaneously control the prompt component to send out warning information to prompt the manual intervention of operators under the condition that the locking piece is not mounted in place or is not dismounted in place, thereby ensuring the mounting stability of the wafer and avoiding influencing the test result of the wafer. The utility model provides a wafer blanking device, which comprises: The wafer mounting device comprises a mounting table, wherein a locking piece is arranged on the mounting table, and the wafer can be fixedly arranged on the mounting table through the locking piece; The dismounting device comprises a dismounting assembly, a temperature detection assembly, a height detection assembly and a prompt assembly; The temperature detection assembly is electrically connected with the disassembly assembly, the temperature detection assembly is used for acquiring the temperature value of the mounting table, and the disassembly assembly is rotationally connected with the locking piece; The height detection assembly is electrically connected with the prompt assembly, the height detection assembly is used for acquiring the height value of the locking piece relative to the mounting table, and the prompt assembly is used for sending out warning information. Further, the disassembly component comprises a disassembly piece and an adsorption sleeve sleeved on the outer side of the disassembly piece; An adsorption channel is formed between the side wall of the dismounting piece and the side wall of the adsorption sleeve, and an inlet of the adsorption channel is arranged above the wafer. Further, the dismounting piece is convexly arranged at one end, close to the wafer, of the adsorption sleeve. Further, the dismounting piece is close to one end of the wafer is provided with a clamping groove, the clamping groove is clamped with one end of the locking piece, and the dismounting piece can drive the locking piece to rotate. Further, at least one adsorption hole is formed in the side wall of the clamping groove, and the adsorption hole is communicated with the adsorption channel. Further, the disassembling assembly further comprises a vacuum adsorption assembly, wherein the vacuum adsorption assembly is communicated with the adsorption channel and is used for adsorbing air in the adsorption channel so as to form negative pressure in the adsorption channel. Further, the temperature detection assembly and the height detection assembly are both arranged on the disassembly assembly, and the temperature detection assembly, the height detection assembly and the disassembly assembly move cooperatively. Further, the dismounting device further comprises a driving assembly, the dismounting assembly is in driving connection with the driving assembly, and the driving assembly can drive the dismounting assembly to move towards or away from the wafer. Further, the wafer processing device further comprises a data acquisition device for acquiring the wafer coding information, wherein the data acquisition device is arranged above the mounting table and is fixedly connected with the dismounting assembly. Further, the axis of the locking piece is parallel to the axis of the dismounting piece. The embodiment of the utility model has the following beneficial effects: According to the utility model, the temperature value of the mounting table can be detected through the temperature detection assembly by arranging the temperature detection assembly, the locking piece fixed on the wafer is detache