CN-224218790-U - Wafer transfer mechanism and automatic alignment transfer system

Abstract

The application relates to a wafer transfer mechanism and an automatic alignment transfer system, which comprises a substrate, an alignment plate and an annular turntable, wherein the substrate is used for being in sliding connection with a bottom frame along a first direction, the alignment plate is arranged above the substrate and is in relative sliding connection with the substrate along a second direction, the annular turntable is arranged in the middle of the alignment plate and is in relative rotation connection with the alignment plate, an adsorption assembly used for adsorbing a wafer is arranged on the annular turntable, and the adsorption assembly comprises a plurality of suction nozzles, wherein at least the suction nozzles corresponding to the trimming positions of the wafer can be independently controlled to be opened and closed. The wafer transfer mechanism and the automatic alignment transfer system realize flexible adjustment of the positions of the wafers in multiple directions, can flexibly adapt to the wafers with different trimming directions, can meet the complex alignment requirements of the wafers in the feeding and transferring processes, and improve the accuracy of wafer transfer.

Inventors

• WANG YONG
• TANG RENWEI
• XIE ZHIYIN

Assignees

• 苏州联讯仪器股份有限公司

Dates

Publication Date

20260508

Application Date

20250331

Claims (10)

1. 1. The wafer transfer mechanism is characterized by comprising a base plate, an alignment plate and an annular rotary table; the base plate is used for being in sliding connection with the bottom frame along a first direction, the alignment plate is arranged above the base plate and is in relative sliding connection with the base plate along a second direction, and the annular turntable is arranged in the middle of the alignment plate and is in relative rotation connection with the alignment plate; The wafer sucking device comprises an annular turntable, wherein an adsorbing component for adsorbing wafers is arranged on the annular turntable, the adsorbing component comprises a plurality of sucking nozzles, and at least the sucking nozzles corresponding to the trimming positions of the wafers can be independently controlled to be opened and closed.
2. 2. The wafer transfer mechanism of claim 1, wherein the plurality of suction nozzles are uniformly distributed on an inner wall of the annular turntable, and a suction direction of the suction nozzles faces to a lower side of the annular turntable for sucking an upper surface of the wafer.
3. 3. The wafer transfer mechanism of claim 2, wherein the suction assembly comprises six suction nozzles and is divided into three groups, each group comprises two suction nozzles which are arranged corresponding to each other in the circumferential direction of the annular turntable, and the group of suction nozzles corresponding to the trimming position of the wafer can be independently controlled to be opened and closed.
4. 4. A wafer relay mechanism according to claim 3, wherein the three sets of said suction nozzles are respectively a pair of horizontal axes, a pair of 45 ° axes inclined at an angle of 45 ° to the horizontal, and a pair of 135 ° axes inclined.
5. 5. The wafer relay mechanism of claim 1, comprising a drive assembly and an arcuate toothed plate, the arcuate toothed plate coupled to the annular turntable, the drive assembly configured to drive the arcuate toothed plate to rotate the annular turntable.
6. 6. The wafer transfer mechanism of claim 5, wherein a first slider group is disposed below the substrate, and the first slider group is configured to cooperate with a first guide rail (51) on the bottom frame to drive the transfer mechanism to move along the first guide rail between the alignment point and the clamping point.
7. 7. The wafer transfer mechanism of claim 6, wherein two second guide rails are symmetrically arranged above the substrate, and the second guide rails are matched with a second slider group (19) arranged below the alignment plate so that the alignment plate can slide along the second guide rails.
8. 8. The wafer relay mechanism of claim 1, wherein a blowing mechanism is disposed above the annular turntable for blowing air toward the upper surface of the wafer.
9. 9. An automatic wafer alignment transfer system, comprising an alignment mechanism and the transfer mechanism of any one of claims 1-8, wherein the alignment mechanism is electrically connected with the transfer mechanism; the alignment mechanism comprises an alignment camera which is used for being connected with the top rack, and the alignment camera is used for acquiring the position information of the wafer when the transfer mechanism moves to an alignment point along the bottom rack.
10. 10. The automated wafer alignment transfer system of claim 9, comprising a rechecking mechanism electrically connected to the transfer mechanism; The rechecking mechanism comprises a rechecking camera which is arranged on one side of the transfer mechanism, and the rechecking camera is used for acquiring position information of the wafer which is moved to a clamping point and placed behind the heat sink.

Description

Wafer transfer mechanism and automatic alignment transfer system Technical Field The application relates to the technical field of wafer testing, in particular to a wafer transfer mechanism and an automatic alignment transfer system. Background In the aging test process of the wafer, feeding is an important link. In order to ensure that the wafer can be accurately and stably transferred from the jacking position to clamping and then loaded into the ageing fixture, a special wafer transfer device is required. The wafer transfer device in the prior art is difficult to stably and accurately transfer the wafer, cannot accurately align the wafer, affects the clamping precision of the wafer, and is easy to damage the wafer. Disclosure of utility model In order to solve the problem that the positioning device in the prior art is difficult to realize stable and accurate transfer of the wafer, the follow-up clamping precision of the wafer is affected, and the wafer is possibly damaged. The application provides a wafer transfer mechanism, which comprises a base plate, an alignment plate and an annular rotary table, wherein the base plate is arranged on the alignment plate; the base plate is used for being in sliding connection with the bottom frame along a first direction, the alignment plate is arranged above the base plate and is in relative sliding connection with the base plate along a second direction, and the annular turntable is arranged in the middle of the alignment plate and is in relative rotation connection with the alignment plate; The wafer sucking device comprises an annular turntable, wherein an adsorbing component for adsorbing wafers is arranged on the annular turntable, the adsorbing component comprises a plurality of sucking nozzles, and at least the sucking nozzles corresponding to the trimming positions of the wafers can be independently controlled to be opened and closed. Further, the plurality of suction nozzles are uniformly distributed on the inner wall of the annular rotary table, and the suction direction of the suction nozzles faces to the lower side of the annular rotary table and is used for sucking the upper surface of the wafer. Further, the suction assembly comprises six suction nozzles and is divided into three groups, each group comprises two suction nozzles which are arranged correspondingly to each other in the circumferential direction of the annular rotary table, and the group of suction nozzles corresponding to the trimming position of the wafer can be independently controlled to be switched on and off. Further, the three groups of the suction nozzles are respectively a horizontal axis pair, a 45-degree inclined axis pair and a 135-degree inclined axis pair which form an angle of 45 degrees with the horizontal line. Further, the rotary table comprises a driving assembly and an arc toothed plate, wherein the arc toothed plate is connected with the annular rotary table, and the driving assembly is used for driving the arc toothed plate to drive the annular rotary table to rotate. Further, a first sliding block set is arranged below the base plate and is used for being matched with a first guide rail on the bottom frame to drive the transfer mechanism to move between the alignment point and the clamping point along the first guide rail. Further, two second guide rails are symmetrically arranged above the base plate, and the second guide rails are matched with a second sliding block set arranged below the alignment plate, so that the alignment plate can slide along the second guide rails. Further, a blowing mechanism is arranged above the annular turntable and used for blowing air towards the upper surface of the wafer. The application also provides an automatic wafer alignment transfer system, which comprises an alignment mechanism and the transfer mechanism, wherein the alignment mechanism is electrically connected with the transfer mechanism; the alignment mechanism comprises an alignment camera which is used for being connected with the top rack, and the alignment camera is used for acquiring the position information of the wafer when the transfer mechanism moves to an alignment point along the bottom rack. Further, the device comprises a rechecking mechanism, wherein the rechecking mechanism is electrically connected with the transfer mechanism; The rechecking mechanism comprises a rechecking camera which is arranged on one side of the transfer mechanism, and the rechecking camera is used for acquiring position information of the wafer which is moved to a clamping point and placed behind the heat sink. The embodiment of the application has the following beneficial effects: According to the wafer transfer mechanism, the flexible adjustment of the wafer position in multiple directions is realized through the sliding connection of the base plate and the bottom frame along the first direction, the sliding connection of the alignment plate relative to the base plate along the seco