CN-224218792-U - DIP encapsulation gold wire pressure welding matrix anchor clamps

Abstract

The utility model relates to a pressure welding fixture, in particular to a DIP packaging gold wire pressure welding matrix fixture, which comprises a base, wherein a plurality of mounting grooves which are uniformly distributed along the width direction of the base are formed in the upper surface of the base, a pull rod is slidably arranged on the base along the width direction of the base, one end of the pull rod is provided with a gear block, a reset piece is arranged between the gear block and the base, the other end of the pull rod is provided with a pull block, one side of the mounting groove is provided with a strip-shaped through hole, a positioning plate is arranged in the strip-shaped through hole and is connected with the pull rod, and a clamping area is formed between the side wall of the positioning plate and the side wall of the mounting groove. Compared with the prior clamp which clamps the substrate by driving the fastening block to slide in the mounting groove through the threaded rod, the clamping speed is higher, and the bonding efficiency of the bonding machine is improved.

Inventors

• ZHUO FAN
• JING YIFAN
• LI BAIWAN

Assignees

• 西安天光半导体有限公司

Dates

Publication Date

20260508

Application Date

20250523

Claims (5)

1. 1. The DIP packaging golden wire pressure welding matrix fixture is characterized by comprising a base (1), wherein a plurality of mounting grooves (2) which are uniformly distributed along the width direction of the base are formed in the upper surface of the base (1); A pull rod (3) is slidably arranged on the base (1) along the width direction of the base (1), one end of the pull rod (3) is provided with a gear block (4), a reset piece is arranged between the gear block (4) and the base (1), and the other end of the pull rod (3) is provided with a pull block (6); a strip-shaped through hole (7) is formed in one side of the mounting groove (2), a positioning plate (8) is arranged in the strip-shaped through hole (7), and the positioning plate (8) is connected with the pull rod (3); and a clamping area is formed between the side wall of the positioning plate (8) and the side wall of the mounting groove (2).
2. 2. The DIP encapsulated gold wire pressure welding matrix fixture of claim 1, wherein the reset member is a compression spring (5), the compression spring (5) is sleeved on the pull rod (3), and two ends of the compression spring (5) are respectively connected with the gear block (4) and the base (1).
3. 3. The DIP encapsulated gold wire bonding matrix fixture of claim 1, wherein the lower surface of the base (1) is provided with a buckle (9).
4. 4. The DIP encapsulated gold wire bonding matrix fixture of claim 1, wherein the tie bar (3) is a threaded rod; the locating plate (8) and the gear block (4) are arranged on the pull rod (3) in a threaded manner.
5. 5. The DIP encapsulated gold wire bonding matrix fixture of claim 1, wherein the upper surface of the base (1) is provided with threaded holes (10).

Description

DIP encapsulation gold wire pressure welding matrix anchor clamps Technical Field The utility model relates to a pressure welding fixture, in particular to a DIP packaging gold wire pressure welding matrix fixture. Background The bonding machine uses thin metal wires to tightly weld the metal leads and bonding pads on the substrate or the frame, so as to realize the electrical interconnection between the chips and the substrate and the information intercommunication between the chips. When the full-automatic aluminum wire bonding machine is used for bonding, the substrate is clamped by the clamp, the upper pressing plate and the lower pressing plate are closed by the pneumatic device, so that bonding between the substrate and the chip is realized, however, the existing clamp can only clamp one substrate at a time, the bonding efficiency of the bonding machine is affected, and the existing clamp clamps clamp the substrate by driving the fastening block to slide in the mounting groove by the threaded rod, so that the mounting efficiency is low, and the bonding processing efficiency is not facilitated. Disclosure of utility model The utility model aims to solve the technical problems that the existing clamp is low in installation efficiency and is not beneficial to improving bonding processing efficiency, and provides a DIP packaging golden wire pressure welding matrix clamp. In order to solve the technical problems, the technical solution provided by the utility model is as follows: a DIP packaging gold wire pressure welding matrix fixture comprises a base, wherein a plurality of mounting grooves which are uniformly distributed along the width direction of the base are formed in the upper surface of the base; the base is provided with a pull rod in a sliding manner along the width direction of the base, one end of the pull rod is provided with a gear block, and a reset piece is arranged between the gear block and the base; a strip-shaped through hole is formed in one side of the mounting groove, a positioning plate is arranged in the strip-shaped through hole, and the positioning plate is connected with the pull rod; And a clamping area is formed between the side wall of the positioning plate and the side wall of the mounting groove. Further, the reset piece is a compression spring, the compression spring is sleeved on the pull rod, and two ends of the compression spring are respectively connected with the gear block and the base. Further, a buckle is arranged on the lower surface of the base. The positioning plate and the gear block are arranged on the pull rod in a threaded manner. Further, a threaded hole is formed in the upper surface of the base. Compared with the prior art, the utility model has the beneficial effects that: 1. According to the DIP packaging golden wire pressure welding matrix clamp, the pull rod, the positioning plate and the reset piece are arranged, when the DIP packaging circuit is installed, the DIP packaging circuit can be contained between the positioning plate and the installation groove only by pulling the pull rod, the DIP packaging circuit is placed between the positioning plate and the installation groove, the DIP packaging circuit can be clamped in the installation groove under the action of the reset piece by loosening the pull rod, the DIP packaging circuit can be clamped quickly by the positioning plate, and compared with the conventional clamp which clamps clamp a substrate in a clamping mode by driving the fastening block to slide in the installation groove through the threaded rod, the clamping speed is higher, and the bonding efficiency of the bonding machine is improved. 2. According to the DIP packaging golden wire pressure welding matrix clamp, the plurality of mounting grooves are formed, and the pull rod penetrates through each mounting groove, so that a plurality of DIP packaging circuits can be mounted for bonding, and bonding efficiency is improved. Drawings Fig. 1 is a schematic structural diagram of an embodiment of the present utility model. The reference numerals indicate that the device comprises a 1-base, a 2-mounting groove, a 3-pull rod, a 4-gear block, a 5-compression spring, a 6-pull block, a 7-strip-shaped through hole, an 8-positioning plate, a 9-buckle and a 10-threaded hole. Detailed Description The following description of the embodiments of the present utility model will be made more apparent and fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model. As shown in FIG. 1, the DIP packaging golden wire pressure welding matrix fixture comprises a base 1, wherein a plurality of mounting grooves 2 uniformly distributed along the width direction of the base 1 are fo