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CN-224218793-U - Mechanical arm control equipment for wafer conveying

CN224218793UCN 224218793 UCN224218793 UCN 224218793UCN-224218793-U

Abstract

The utility model discloses a manipulator control device for wafer conveying, which belongs to the field of wafer processing and comprises a base, wherein a mechanical arm is fixedly connected above the base, the end part of the mechanical arm is fixedly connected with a mounting frame, the lower part inside the mounting frame is fixedly connected with a motor, negative pressure generated by a negative pressure pump is accurately transmitted to suction cups through a guide pipe, a telescopic hose and a connecting pipe, so that the suction cups can firmly adsorb wafers, scratches, damages and the like of the wafers due to the action of external force in the conveying process can be effectively avoided, the quality and the integrity of the wafers are ensured, the flexible adjustment of the spacing between the four suction cups is realized by utilizing the linkage of parts such as arc grooves, sliding strips and sliding blocks, the wafer conveying with different sizes can be adapted, meanwhile, the telescopic hose correspondingly stretches along with the change of the spacing between the suction cups, the stable conveying of the negative pressure is ensured, the firm adsorption conveying of the wafers with different specifications is ensured, and the applicability and the conveying efficiency of the device are remarkably improved.

Inventors

  • Miao Zhigao
  • CHENG XIAO

Assignees

  • 南通腾翌精密科技有限公司

Dates

Publication Date
20260508
Application Date
20250613

Claims (8)

  1. 1. The manipulator control equipment for wafer conveying comprises a base (1) and is characterized in that a mechanical arm (16) is fixedly connected to the upper side of the base (1), a mounting frame (17) is fixedly connected to the end part of the mechanical arm (16), a motor (18) is fixedly connected to the lower side of the inside of the mounting frame (17), a turntable (19) is fixedly connected to the output end of the motor (18), the turntable (19) is rotationally connected to the lower side of the mounting frame (17), four arc-shaped grooves (2) are formed in one side of the turntable (19), four arc-shaped grooves (2) are in an equidistant circumferential array, four sliding strips (21) are fixedly connected to the lower side of the mounting frame (17), and the four sliding strips (21) are in an equidistant circumferential array by taking the center of the turntable (19) as the center.
  2. 2. The wafer handling robot control device according to claim 1, wherein the four sliders (22) are slidably connected to each other at lower ends of the four sliders (21), and the connecting plates (23) are fixedly connected to each other at lower ends of the four sliders (22).
  3. 3. The wafer handling robot control device according to claim 2, wherein bumps (24) are fixedly connected to the upper sides of the four connecting plates (23), and the four bumps (24) are slidably connected to the inside of the four arc-shaped grooves (2), respectively.
  4. 4. The wafer handling robot control device according to claim 3, wherein suction cups (25) are fixedly connected to the lower sides of the four connection plates (23), connection pipes (26) are fixedly connected to the upper sides of the four suction cups (25), and flexible hoses (27) are fixedly connected to the ends, away from the suction cups (25), of the four connection pipes (26).
  5. 5. The wafer handling robot control device according to claim 4, wherein the four flexible tubes (27) are fixedly connected with a conduit (28) at one end far away from the connecting tube (26), a negative pressure pump (29) is fixedly connected to the upper part inside the mounting frame (17), and the output end of the negative pressure pump (29) is fixedly connected with one end far away from the flexible tubes (27) of the four conduits (28).
  6. 6. The manipulator control device for wafer handling according to claim 1, wherein the two sides of the base (1) are fixedly connected with fixing plates (11), and reinforcing ribs (12) are fixedly connected between the two fixing plates (11) and one side of the base (1).
  7. 7. The wafer handling robot control device according to claim 6, wherein the hydraulic cylinders (13) are fixedly connected to the upper sides of the two fixing plates (11), and the output ends of the two hydraulic cylinders (13) penetrate through the fixing plates (11) and are fixedly connected with the supporting plates (14).
  8. 8. The wafer handling robot control apparatus according to claim 1, wherein universal wheels (15) are fixedly connected to four corners below the base (1).

Description

Mechanical arm control equipment for wafer conveying Technical Field The utility model relates to the field of manipulators, in particular to manipulator control equipment for wafer conveying. Background Wafers are thin sheets of semiconductor, such as crystalline silicon, used in the manufacture of integrated circuits, and require handling and transfer during production. CN220856551U provides a manipulator for carrying wafers, the manipulator comprises an X-axis driving unit, a Z-axis driving unit disposed on the X-axis driving unit, a Y-axis driving unit disposed on the Z-axis driving unit, and a wafer picking and placing unit disposed on the Y-axis driving unit, wherein a steering unit is disposed between the Y-axis driving unit and the Z-axis driving unit, the wafer picking and placing unit comprises a wafer fork and a wafer positioning sensor, and an angle distance between the wafer fork and the wafer positioning sensor is 180 degrees. However, in the above patent, since the wafer is carried by the wafer fork, the wafer fork is carried and inserted into the gap of the edge of the wafer by the fork structure, and the wafer is lifted or pushed to be carried by the lever principle, the wafer fork has a plurality of defects that firstly, the wafer fork is easy to rub and collide with the edge of the wafer during the process of inserting and lifting the wafer, so that the edge of the wafer is cracked, the surface is scratched and the like, the integrity of the edge and the surface of the wafer is critical to the subsequent precision processing procedures such as photoetching, etching and the like, and the yield of the wafer is greatly reduced due to the damage. Therefore, in order to solve the above-described problems, a wafer transfer robot control apparatus is proposed. Disclosure of utility model In view of the problems in the prior art, an object of the present utility model is to provide a wafer handling robot control apparatus that can realize functions. In order to solve the problems, the utility model adopts the following technical scheme. The utility model provides a wafer is manipulator control equipment for transport, includes the base, the top fixedly connected with arm of base, the tip fixedly connected with mounting bracket of arm, the inside below fixedly connected with motor of mounting bracket, the output fixedly connected with carousel of motor, the carousel rotates the below of connecting at the mounting bracket, four arc grooves have been seted up to one side of carousel, four the arc groove is equidistant circumference array, the below fixedly connected with four slides of mounting bracket, four slides are equidistant circumference array with the centre of a circle department of carousel as the center. Furthermore, the sliding blocks are connected to the bottoms of the four sliding strips in a sliding mode, and the connecting plates are connected to the bottoms of the four sliding blocks in a fixed mode. Further, the upper parts of the four connecting plates are fixedly connected with lugs, and the four lugs are respectively and slidably connected in the four arc grooves. Further, four the equal fixedly connected with sucking disc of below of connecting plate, four the equal fixedly connected with connecting pipe of top of sucking disc, four the equal fixedly connected with flexible hose of one end that the sucking disc was kept away from to the connecting pipe. Further, four the one end that flexible hose kept away from the connecting pipe is all fixedly connected with pipe, the inside top fixedly connected with negative pressure pump of mounting bracket, the one end fixedly connected with that flexible hose was kept away from to output and four pipes of negative pressure pump. Further, both sides of base all fixedly connected with fixed plate, two equal fixedly connected with strengthening rib between fixed plate and the base one side. Further, the hydraulic cylinders are fixedly connected to the upper portions of the two fixing plates, and the output ends of the two hydraulic cylinders penetrate through the fixing plates and are fixedly connected with the supporting plates. Furthermore, universal wheels are fixedly connected to four corners below the base. Compared with the prior art, the utility model has the advantages that: (1) In this scheme, through motor drive carousel rotation, utilize the linkage of parts such as arc wall, draw runner, slider, realize the nimble adjustment of interval between four sucking discs, but the wafer transport of not unidimensional adaptation, simultaneously, flexible hose is corresponding flexible along with sucking disc interval change, guarantees the stable transmission of negative pressure, guarantees to all can firmly adsorb the transport to different specification wafers, is showing the suitability and the conveying efficiency of lifting means. (2) In this scheme, the backup pad that pneumatic cylinder output links to each other, and its main e