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CN-224218794-U - Wafer mounting machine

CN224218794UCN 224218794 UCN224218794 UCN 224218794UCN-224218794-U

Abstract

The utility model provides a wafer mounter, which comprises a longitudinal driving mechanism, a first motor and a suction nozzle, wherein the longitudinal driving mechanism is connected with the first motor and is used for driving the first motor to longitudinally move, an output shaft of the first motor is connected with the suction nozzle, and the suction nozzle is driven to rotate by the rotation of the output shaft of the first motor. The utility model has the beneficial effects that the suction nozzle is driven to rotate by the first motor, and the die bonding angle can be flexibly adjusted during die bonding, so that the requirements of users are met.

Inventors

  • CHEN GUANHAI
  • XIE WEIFENG

Assignees

  • 深圳市卓兴先进封装技术有限公司

Dates

Publication Date
20260508
Application Date
20250106

Claims (8)

  1. 1. The wafer mounter is characterized by comprising a longitudinal driving mechanism, a first motor (7) and a suction nozzle (10), wherein the longitudinal driving mechanism is connected with the first motor (7) and is used for driving the first motor (7) to longitudinally move, an output shaft of the first motor (7) is connected with the suction nozzle (10), and the suction nozzle (10) is driven to rotate through rotation of the output shaft of the first motor (7); The wafer mounter further comprises a second motor (6) for pressure control, the longitudinal driving mechanism is connected with the second motor (6) and is used for driving the second motor (6) and the first motor (7) to longitudinally move, and the second motor (6) drives the first motor (7) to longitudinally move through a transmission mechanism; The wafer mounter further comprises an adjusting mechanism for adjusting the mounting angle of the first motor (7), the adjusting mechanism is mounted on the first motor (7), and the adjusting mechanism is used for adjusting the first motor (7) to a position parallel to the wafer.
  2. 2. The wafer mounter according to claim 1, wherein said wafer mounter further comprises a mounting member (1), said longitudinal driving mechanism comprises a third motor (2) and a first guiding module (3), said third motor (2) and said first guiding module (3) are mounted on said mounting member (1), and said third motor (2) drives said second motor (6) to longitudinally move through said first guiding module (3).
  3. 3. The wafer mounter according to claim 2, wherein said first guide module (3) includes a first guide rail and a first slider sliding on said first guide rail, said third motor (2) and said first guide rail are mounted on said mounting member (1), an output shaft of said third motor (2) is connected with said first slider through a transmission mechanism, said third motor (2) drives said first slider to move through a transmission mechanism, said second motor (6) is connected with said first slider, and said first slider moves to drive said second motor (6) to move.
  4. 4. The wafer mounter according to claim 3, wherein said wafer mounter further includes a second guide module (5), said second guide module (5) includes a second guide rail, and a second slider that slides on said second guide rail, the second guide rail is mounted on said first slider, said second motor (6) is mounted on said second guide rail, an output shaft of said second motor (6) is connected to said second slider, and said second slider is connected to said first motor (7).
  5. 5. The wafer mounter according to claim 2, wherein said wafer mounter further includes an encoder (4), said encoder (4) including a grating scale and a reading head, said grating scale and said reading head being mounted on the first sliders of the mounting member (1) and the first guide module (3), respectively.
  6. 6. The wafer mounter according to claim 4, wherein the adjusting mechanism comprises a left-right inclination angle adjusting piece (8), a pitching inclination angle adjusting piece (9), a left-right horizontal adjusting screw (11) and a pitching inclination angle adjusting screw (12), the left-right inclination angle adjusting piece (8) and the pitching inclination angle adjusting piece (9) are mounted on the first motor (7), a first mounting hole is formed in the second sliding block, a second mounting hole (13) corresponding to the first mounting hole is formed in one end of the left-right inclination angle adjusting piece (8), a gap is formed between the second mounting hole (13) and a screw of the left-right horizontal adjusting screw (11), a third mounting hole (14) is formed in the other end of the left-right inclination angle adjusting piece (8), and a gap is formed between the third mounting hole (14) and the pitching inclination angle adjusting screw (12), and the gap between the screw of the left-right horizontal adjusting screw (11) and the second mounting hole (13) and/or the gap between the pitching adjusting screw (12) and the third motor (7) is/are/is realized.
  7. 7. The wafer mounter according to claim 6, wherein the adjusting mechanism comprises a mounting block and a first adjusting screw, the mounting block is mounted on the first motor (7), a threaded hole is formed below the mounting block, the first adjusting screw is mounted in the threaded hole, a gap is formed between the threaded hole and a screw rod of the first adjusting screw, and the inclination angle of the first motor (7) is adjusted by adjusting the gap between the first adjusting screw and the threaded hole.
  8. 8. The wafer mounter according to claim 7, wherein the number of said first adjusting screws and said threaded holes is four.

Description

Wafer mounting machine Technical Field The utility model relates to the technical field of die bonding, in particular to a wafer mounting machine. Background The existing die bonder generally comprises a swing arm, and a rotating or translating and swing arm up-down mechanism connected with the swing arm, wherein the wafer mounter comprises a suction nozzle, when the swing arm swings to a die-taking position, the suction nozzle moves downwards to suck a wafer, then the suction nozzle is lifted upwards again, and when the swing arm swings to the die-bonding position, the suction nozzle moves downwards to bond the die. In the process of die bonding, sometimes the die bonding angle of the wafer needs to be adjusted, but the existing suction nozzle can only move up and down and suck and bond the wafer, the die bonding angle cannot be adjusted, and the requirement of a user cannot be met. Disclosure of Invention In order to solve the technical problem that the existing suction nozzle cannot adjust the die bonding angle, the utility model provides a wafer mounter, which comprises a longitudinal driving mechanism, a first motor and a suction nozzle, wherein the longitudinal driving mechanism is connected with the first motor and is used for driving the first motor to longitudinally move, an output shaft of the first motor is connected with the suction nozzle, and the suction nozzle is driven to rotate by the rotation of the output shaft of the first motor. As a further improvement of the present utility model, the wafer mounter further includes a second motor for pressure control, the longitudinal driving mechanism is connected to the second motor, the longitudinal driving mechanism is used for driving the second motor and the first motor to perform longitudinal movement, and the second motor drives the first motor to perform longitudinal movement through a transmission mechanism. As a further improvement of the utility model, the wafer mounter further comprises a mounting piece, the longitudinal driving mechanism comprises a third motor and a first guiding module, the third motor and the first guiding module are mounted on the mounting piece, and the third motor drives the second motor to longitudinally move through the first guiding module. As a further improvement of the utility model, the first guide module comprises a first guide rail and a first sliding block sliding on the first guide rail, the third motor and the first guide rail are arranged on the mounting piece, an output shaft of the third motor is connected with the first sliding block through a transmission mechanism, the third motor drives the first sliding block to move through the transmission mechanism, the second motor is connected with the first sliding block, and the second motor is driven to move when the first sliding block moves. As a further improvement of the present utility model, the wafer mounter further includes a second guide module including a second rail mounted on the first slider, and a second slider sliding on the second rail, the second motor being mounted on the second rail, an output shaft of the second motor being connected to the second slider, the second slider being connected to the first motor. As a further improvement of the utility model, the wafer mounter further comprises an encoder including a grating ruler and a reading head, which are respectively mounted on the mounting member and the first slider of the first guide module. As a further improvement of the utility model, the wafer mounter further comprises an adjusting mechanism for adjusting the mounting angle of the first motor, the adjusting mechanism is arranged on the first motor, and the adjusting mechanism is used for adjusting the first motor to a position parallel to the wafer, so that the suction nozzle is in seamless contact with the wafer, and the wafer is sucked more firmly. As a further improvement of the utility model, the adjusting mechanism comprises a left-right inclination angle adjusting piece, a pitching inclination angle adjusting piece, a left-right horizontal adjusting screw and a pitching inclination angle adjusting screw, wherein the left-right inclination angle adjusting piece and the pitching inclination angle adjusting piece are arranged on the first motor, a first mounting hole is arranged on the second sliding block, a second mounting hole corresponding to the first mounting hole is arranged at one end of the left-right inclination angle adjusting piece, a gap is arranged between the second mounting hole and the left-right horizontal adjusting screw, a third mounting hole is arranged at the other end of the left-right inclination angle adjusting piece, a gap is arranged between the third mounting hole and the pitching inclination angle adjusting screw, and the first motor inclination angle is adjusted by adjusting the gap between the left-right horizontal adjusting screw and the second mounting hole and/or the gap between the pitchin