CN-224218795-U - Ball planting device

Abstract

The utility model provides a ball planting device which comprises a vacuum platform, an independent moving module and a first control unit. The vacuum platform is used for fixing the chip, the independent moving module is provided with a ball groove, a nozzle and a moving mechanism, the nozzle is fixed on the moving mechanism through the ball groove, the moving mechanism consists of an X-axis driving device, a Y-axis driving device and a Z-axis driving device, multi-axis linkage control is supported, solder balls with different ball diameters and materials can be loaded, and the ball is precisely sprayed through gas pressure. The second control unit cooperatively adjusts the air pressure of the nozzle to realize one-time backflow to finish the ball planting operation of various solder balls. The device integrates the safe distance calculation module, ensures that all modules are not interfered with each other, and improves stability and safety. The plurality of independent mobile modules are distributed in various forms and jointly cover the upper part of the whole chip. The device is compatible with large-size, high-warpage, small balls and small-space packaged products, effectively avoids the influence of repeated backflow on the performance and structure of the products, and improves the packaging efficiency and quality.

Inventors

• LI FENG
• SHI LEI
• SUN HAO

Assignees

• 盛合晶微半导体(江阴)有限公司

Dates

Publication Date

20260508

Application Date

20250409

Claims (10)

1. 1. A ball placement device, comprising: the vacuum platform is used for adsorbing the chip; The device comprises a vacuum platform, a plurality of independent moving modules, a plurality of spray nozzles and a moving mechanism, wherein the number N of the independent moving modules is more than or equal to 2, the independent moving modules are positioned above the vacuum platform and comprise ball grooves, the spray nozzles and the moving mechanism, the spray nozzles are connected with the ball grooves, positioned below the ball grooves and fixed on the moving mechanism through the ball grooves, and the moving mechanism comprises an X-axis driving device, a Y-axis driving device and a Z-axis driving device; and the first control unit is communicated with the independent moving modules and used for controlling the displacement of the independent moving modules.
2. 2. The ball mounting device of claim 1, wherein the ball groove and the nozzle are provided with a detachable mechanism, and the detachable mechanism is connected by a buckle or a thread to realize quick detachment.
3. 3. The ball mounting device of claim 1, wherein the nozzle has a plurality of different sizes and the angle of the nozzle is adjustable.
4. 4. The ball mounting device of claim 1, wherein the distribution of the working areas of the plurality of independent moving modules comprises one or a combination of symmetrical distribution, annular distribution and fan-shaped distribution, and jointly covers the upper part of the whole chip.
5. 5. The ball planting device according to claim 1, further comprising a second control unit, wherein the second control unit comprises a valve connected with the ball groove and a pneumatic control mechanism, the pneumatic control mechanism is connected with the nozzle and used for adjusting ball spraying air pressure at the nozzle through the valve, and the second control unit is connected with the first control unit and used for cooperatively controlling air pressure of the nozzle and movement of the independent moving module.
6. 6. The ball planting device according to claim 1, wherein the X-axis driving device, the Y-axis driving device and the Z-axis driving device are connected with the ball groove through a screw transmission mechanism or a belt transmission mechanism.
7. 7. The ball mounting device of claim 1, wherein the movement mechanism supports multi-axis coordinated control and is capable of simultaneously controlling movement of the X-axis drive device, the Y-axis drive device and the Z-axis drive device.
8. 8. The ball placement device as in claim 1, wherein the drive means comprises one or more of a motor, a linear motor, a piezoelectric drive, a stepper motor, a servo motor, or an electromagnetic drive.
9. 9. The ball planting device according to claim 1, wherein the first control unit further comprises a safe distance calculating module for calculating position coordinates and actual safe distances of the plurality of independent moving modules, and ensuring that the independent moving modules do not interfere with each other.
10. 10. The ball planting device according to claim 1, wherein the plurality of independent moving modules can work simultaneously, and cooperation is realized through the first control unit, so that mutual interference is avoided.

Description

Ball planting device Technical Field The utility model belongs to the field of wafer processing equipment, and relates to a ball mounting device. Background With the high-speed development of electronic technology, the packaging requirements of higher density, miniaturization, higher integration and higher performance provide new challenges for the semiconductor manufacturing industry, which also promotes the continuous breakthrough development of advanced packaging technology, meanwhile, the requirements of 2.5D/3D package are more and more strong under the addition of emerging industries such as artificial intelligence, automatic driving, 5G network, internet of things and the like, however, with the diversification and complicating of the packaging requirements, the situation that the same substrate needs to be welded with solder balls with different ball diameters and different materials is more and more common, and the traditional ball planting mode has significant limitations in facing the requirements that the same substrate needs to undergo multiple reflow processes due to the need to be respectively reflow-welded with the solder balls with different ball diameters and materials. Multiple reflows not only can cause product stress to change again, increase the risk of ring-off, but also can cause unpredictable thermal damage to critical components such as High Bandwidth Memory (HBM). Therefore, the packaging process generally limits the number of reflows, resulting in a number of abnormal solder ball products having to be scrapped, which not only increases the difficulty of the packaging operation, but also brings about serious economic loss to customers. In view of the above, there is a need for a ball mounting device capable of simultaneously soldering solder balls with different ball diameters and different materials on the same substrate, so as to solve the technical bottleneck and economic loss problems caused by the conventional ball mounting method. It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present application and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the application section. Disclosure of utility model In view of the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide a ball placement device, which is used for solving the problems of product abnormality and economic loss caused by multiple backflow in the prior art, and simultaneously reducing packaging difficulty and improving working efficiency. In order to achieve the above object, the present utility model provides a ball planting device, including: The vacuum platform is used for adsorbing the chip; The device comprises a vacuum platform, a plurality of independent moving modules, a plurality of spray nozzles and a moving mechanism, wherein the number N of the independent moving modules is more than or equal to 2, the independent moving modules are positioned above the vacuum platform and comprise ball grooves, the spray nozzles and the moving mechanism, the spray nozzles are connected with the ball grooves, positioned below the ball grooves and fixed on the moving mechanism through the ball grooves, and the moving mechanism comprises an X-axis driving device, a Y-axis driving device and a Z-axis driving device; And the first control unit is communicated with the independent moving module and used for controlling the displacement of the independent moving module. Optionally, the ball groove and the nozzle are both provided with a detachable mechanism, and the detachable mechanism realizes quick detachment through a buckle or threaded connection. Optionally, the nozzle has a plurality of different sizes and the angle of the nozzle is adjustable. Optionally, the distribution form of the working areas of the plurality of independent mobile modules comprises one or a combination of symmetrical distribution, annular distribution, fan-shaped distribution or irregular distribution, and collectively covers the whole upper part of the chip. Optionally, the ball planting device further comprises a second control unit, wherein the second control unit comprises a valve connected with the ball groove and a pneumatic control mechanism, the pneumatic control mechanism is connected with the nozzle and used for adjusting ball spraying air pressure at the nozzle through the valve, and the second control unit is connected with the first control unit and used for cooperatively controlling air pressure of the nozzle and movement of the independent moving module. Optionally, the X-axis driving device, the Y-axis driving device and the Z-axis driving device are connected with the ball groove through