CN-224218796-U - Suction head for semiconductor materials

CN224218796UCN 224218796 UCN224218796 UCN 224218796UCN-224218796-U

Abstract

The utility model relates to the technical field of semiconductor manufacturing, in particular to a suction head for semiconductor materials, which comprises a mounting plate, wherein a motor is embedded in the top of the mounting plate, an output shaft of the motor is fixedly connected with a pressing cam, an upper limiting block is sleeved on the surface of the pressing cam, and a guide rod is fixedly connected to the bottom of the upper limiting block. The utility model has the advantages of compact structure, good compatibility and convenient maintenance, and in the actual use process, the motor, the cam, the guide rod, the precise guide sleeve, the guide mechanism, the adjusting mechanism, the limiting mechanism and other parts are integrated on one mounting plate, thereby realizing the compactness of the structure, reducing the occupied area of the whole equipment, enabling the suction head to adapt to smaller working space, flexibly adjusting the position of the lower limiting block through the arrangement of the adjusting mechanism, further realizing the precise adjustment of the lifting stroke of the suction head, enabling the suction head to adapt to semiconductor materials with different sizes and shapes and improving the compatibility of the equipment.

Inventors

YANG XI
TAN XIANJUN
Gu Xilan
LIAO XIN
CAO JINLONG

Assignees

乐安博特半导体有限公司

Dates

Publication Date: 20260508
Application Date: 20250522

Claims (5)

1. The suction head for semiconductor materials comprises a mounting plate (1), and is characterized in that a motor (2) is embedded in the top of the mounting plate (1), an output shaft of the motor (2) is fixedly connected with a pressing cam (3), an upper limit block (4) is sleeved on the surface of the pressing cam (3), a guide rod (5) is fixedly connected to the bottom of the upper limit block (4), the bottom of the guide rod (5) penetrates through the bottom of the mounting plate (1) and is fixedly connected with a suction head (15), a vacuum connecting hole (6) is formed in the bottom of the surface of the guide rod (5), a precise guide sleeve (7) is sleeved on the surface of the guide rod (5), the precise guide sleeve (7) is located in an inner cavity of the mounting plate (1), a compression spring (8) is sleeved on the surface of the guide rod (5), two ends of the compression spring (8) are respectively contacted with the upper limit block (4) and the precise guide sleeve (7), limit grooves (9) are formed in two sides of the surface of the guide rod (5), a moving block (10) is connected to the inner cavity of the guide sleeve (9) in a sliding mode, a moving block (10) is arranged on one side of the inner cavity (11) is fixedly connected with the inner cavity (11), the bottom of mounting panel (1) is provided with adjustment mechanism (13), the inside of adjustment mechanism (13) is provided with stop gear (14).
2. The semiconductor material suction head as set forth in claim 1, wherein the guiding mechanism (12) comprises a guiding rod (121) fixedly connected to the cavity (11), a guiding block (122) and a tension spring (123) are sleeved on the surface of the guiding rod (121), two ends of the tension spring (123) are respectively fixedly connected with the guiding block (122) and the mounting plate (1), and the top of the guiding block (122) penetrates through the cavity of the mounting plate (1) and is fixedly connected with a buffer block (124).
3. The semiconductor material suction head as set forth in claim 2, wherein the adjusting mechanism (13) comprises two protruding blocks (131) fixedly connected to the bottom of the mounting plate (1), one sides of the two protruding blocks (131) are respectively and rotatably connected with an adjusting block (132), the top of the adjusting block (132) extends to the inner cavity of the cavity (11), a guide groove (133) is formed in one side of the adjusting block (132), a movable block (134) is slidably connected to the inner cavity of the guide groove (133), one side of the opposite side of the two movable blocks (134) is fixedly connected with the guide block (122), and a lower limiting block (135) is fixedly connected to one side of the adjusting block (132).
4. The semiconductor material suction head as set forth in claim 3, wherein the limiting mechanism (14) comprises a sleeve block (141) disposed in the inner cavity of the lower limiting block (135), sliding grooves (142) are formed in two sides of the inner cavity of the lower limiting block (135), sliding blocks (143) are slidably connected to the inner cavity of the sliding grooves (142), and two opposite sides of the two sliding blocks (143) are fixedly connected with the sleeve block (141).
5. A semiconductor material suction head as claimed in claim 1, characterized in that a telescopic structure is formed between the upper limit block (4) and the compression spring (8), and the maximum movement distance of the upper limit block (4) is equal to the deformation amount of the compression spring (8).

Description

Suction head for semiconductor materials Technical Field The utility model relates to the technical field of semiconductor manufacturing, in particular to a suction head for semiconductor materials. Background The material taking device of the semiconductor sorting tester is a core component in equipment and is mainly used for accurately grabbing, carrying and positioning chips, stability and efficiency of procedures such as testing, sorting and marking are guaranteed, the material taking device technology of the semiconductor sorting tester is developing towards the directions of high speed, modularization and intellectualization, and the design of the material taking device needs to be compatible with precision, compatibility and maintenance convenience. The traditional extracting device mostly adopts the lead screw to lift, because screw thread engagement exists between the lead screw and the nut, the transmission mode has inertia delay when starting and stopping, and the pitch of the lead screw and the rotating speed of a motor limit the lifting speed of the lead screw, in the scene of needing to rapidly take and put materials, the response speed of the lead screw lifting can not meet the requirement of efficient production, the lead screw lifting mechanism usually needs longer lead screw and larger nut seat, and parts such as a bearing seat and a motor for supporting the lead screw, the combination of the parts makes the whole extracting device occupy larger space in the vertical direction, the arrangement in compact production environment is not facilitated, the lifting stroke and the loading capacity of the lead screw lifting mechanism are usually determined when designing, flexible adjustment is difficult to carry out according to actual production requirements, the lead screw and the nut with different specifications can be needed to be replaced for materials with different sizes and weights, the improvement cost and the difficulty of equipment are increased, the lead screw lifting mechanism is easy to generate dust accumulation and the lead screw in the long-term use process, the transmission efficiency is reduced and the noise is increased, the lead screw and the nut is required to be replaced regularly, the lead screw and the nut is required to be cleaned, the nut is required to be replaced and the screw is required to be worn and replaced regularly, the complex, the like, the work and the lifting mechanism is time is complicated and the maintenance mechanism is required to be maintained due to the complicated and complicated work. Disclosure of utility model The utility model aims to provide a suction head for semiconductor materials, which has the advantages of compact structure, good compatibility and convenient maintenance, and solves the problems presented by the background technology. The technical scheme includes that the semiconductor material suction head comprises a mounting plate, a motor is embedded in the top of the mounting plate, an output shaft of the motor is fixedly connected with a pressing cam, an upper limit block is sleeved on the surface of the pressing cam, a guide rod is fixedly connected to the bottom of the upper limit block, the bottom end of the guide rod penetrates through the bottom of the mounting plate and is fixedly connected with the suction head, a vacuum connecting hole is formed in the bottom of the surface of the guide rod, a precise guide sleeve is sleeved on the surface of the guide rod, the precise guide sleeve is located in an inner cavity of the mounting plate, a compression spring is sleeved on the surface of the guide rod, two ends of the compression spring are respectively contacted with the upper limit block and the precise guide sleeve, limit grooves are formed in two sides of the surface of the guide rod, a moving block is connected with the inner cavity of the limit groove in a sliding mode, a cavity is formed in the bottom of the mounting plate, a guide mechanism is arranged in the inner cavity of the cavity, an adjusting mechanism is arranged at the bottom of the mounting plate, and a limit mechanism is arranged in the adjusting mechanism. Further, as one preferable mode of the utility model, the guide mechanism comprises a guide rod fixedly connected to the inner cavity of the cavity, a guide block and a tension spring are sleeved on the surface of the guide rod, two ends of the tension spring are respectively fixedly connected with the guide block and the mounting plate, and the top of the guide block penetrates through the inner cavity of the mounting plate and is fixedly connected with a buffer block. Further, as one preferable mode of the utility model, the adjusting mechanism comprises two protruding blocks fixedly connected to the bottom of the mounting plate, one sides of the two protruding blocks are respectively and rotatably connected with an adjusting block, the top of the adjusting block extends to the inner cavity of the cavity,