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CN-224218799-U - Wafer transfer box processing system

CN224218799UCN 224218799 UCN224218799 UCN 224218799UCN-224218799-U

Abstract

The utility model discloses a wafer transfer box processing system, and relates to the field of semiconductors. The wafer conveying box processing system comprises a cover opening device, a conveying device and an adhesion detection module, wherein the cover opening device is configured to separate a cover body and a box body of a wafer conveying box which are positioned at a cover opening station and are in a cover closing state, the conveying device is configured to convey the separated box body to a processing station, and the adhesion detection module is used for detecting the adhesion condition of the box body and the cover body of the wafer conveying box in the process that the cover opening device separates the box body from the cover body. The wafer conveying box processing system provided by the utility model can detect whether the box body is adhered to the cover body or not in the process of uncovering the wafer conveying box, so that the subsequent processing process of the box body is ensured to be smoothly carried out.

Inventors

  • Request for anonymity
  • Request for anonymity
  • Request for anonymity

Assignees

  • 江苏芯梦半导体设备有限公司

Dates

Publication Date
20260508
Application Date
20250513

Claims (10)

  1. 1. Wafer transfer box processing system, characterized in that, wafer transfer box include box body (20) and with lid (10) of box body (20) lid and be located box body (20) with gasket on one of them of lid (10), when box body (20) with lid (10) lid, the gasket respectively with lid (10) with box body (20) support, processing system includes: A cover opening device (100) configured to separate the cover body (10) and the box body (20) of the wafer transfer box in a cover-closed state at a cover opening station; The adhesion detection module is used for detecting adhesion conditions of the box body (20) and the cover body (10) of the wafer conveying box in the process that the cover opening device (100) separates the box body (20) from the cover body (10).
  2. 2. The cassette handling system of claim 1, wherein the lid opening device (100) is configured to move the lid (10) in a vertical direction away from the cassette (20); the adhesion detection module comprises at least two first detection pieces (200), and the at least two first detection pieces (200) are used for simultaneously detecting the distance between the cover body (10) and the box body (20) within a first preset time.
  3. 3. The cassette handling system of claim 2, wherein at least two of said first detecting members (200) are mounted on said door opening device (100) and are disposed opposite to each other on both sides of said door opening device (100).
  4. 4. The cassette handling system of claim 2, wherein the adhesion detection module further comprises a second detection member disposed on the uncap station, the second detection member configured to detect the presence of the cassette (20) on the uncap station for a first predetermined time.
  5. 5. The cassette handling system of claim 4, further comprising an alarm device configured to alarm when a detected difference between the two first detecting members (200) within a first predetermined time is outside a predetermined range or the second detecting member within the first predetermined time detects that the cassette is not in place.
  6. 6. The cassette handling system of claim 5, wherein the predetermined range is 0-3mm.
  7. 7. The cassette handling system of claim 1, further comprising a gesture detection module comprising a third detection member disposed at the processing station (300) for detecting a status of the cassette (20) at the processing station (300).
  8. 8. The cassette handling system of claim 7, wherein the third detector is an correlation sensor.
  9. 9. The cassette handling system of claim 1, wherein the processing stations (300) are provided with a limiting structure (310) for limiting the cassette (20).
  10. 10. The cassette handling system of any of claims 1-9, further comprising a cleaning device and/or a drying device, the processing stations being located within the cleaning device and/or the drying device.

Description

Wafer transfer box processing system Technical Field The utility model relates to the field of semiconductors, in particular to a wafer transfer box processing system. Background Front opening unified pods (Front Opening Unified Pod, FOUPs) are a type of container used in semiconductor processing to protect, transport, and store wafers. In the process of cleaning and drying the wafer cassette, it is generally necessary to insert a cover opening device into a through hole in the cover of the wafer cassette, clamp and unlock the cover, and then transfer the cover to be separated from the cassette. After the wafer conveying box is used for a long time, the gasket in the cover body is easy to age, when the cover opening device clamps the unlocking cover body, the gasket is easy to adhere to the box body, so that the box body is driven by the cover body to shift in position, and even is transferred along with the cover body. Because the treatment process is automated, the adhesion between the cover body and the box body is difficult to be found in time, and the subsequent treatment processes such as cleaning or drying of the box body are adversely affected. Disclosure of utility model The utility model aims to provide a wafer conveying box processing system which can detect whether a box body is adhered to a cover body or not in the process of uncovering the wafer conveying box, and ensure that the subsequent processing process of the box body is smoothly carried out. The embodiment of the utility model provides a technical scheme that: Wafer transfer box processing system, wafer transfer box include the box body and with the lid of box body lid and be located the box body with gasket on one of them of lid, the box body with when the lid is covered, the gasket respectively with the lid with the box body supports and holds, processing system includes: the wafer conveying box comprises a cover opening device, a carrying device, a processing station and a control device, wherein the cover opening device is configured to separate a cover body of the wafer conveying box from the box body in a cover-closed state and is positioned at the cover opening station; The adhesion detection module is used for detecting adhesion conditions of the box body and the cover body of the wafer conveying box in the process that the cover opening device separates the box body from the cover body. In an alternative embodiment, the cover opening device is configured to drive the cover body to move in a vertical direction towards a direction away from the box body; the adhesion detection module comprises at least two first detection pieces, and the at least two first detection pieces are used for simultaneously detecting the distance between the cover body and the box body in a first preset time. In an alternative embodiment, at least two first detecting members are mounted on the cover opening device and are oppositely arranged at two sides of the cover opening device. In an alternative embodiment, the adhesion detection module further includes a second detection member disposed on the uncapping station, and the second detection member is configured to detect the in-place condition of the box body on the uncapping station within a first preset time. In an alternative embodiment, the processing system further comprises an alarm device configured to alarm when the detection difference between the two first detection pieces within a first preset time is out of a preset range or the second detection piece within the first preset time detects that the box body is not in place. In an alternative embodiment, the preset range is 0-3mm. In an alternative embodiment, the processing system further includes a gesture detection module, where the gesture detection module includes a third detection member, where the third detection member is disposed on the processing station and is configured to detect a state of the box body at the processing station. In an alternative embodiment, the third detecting member is an correlation sensor. In an alternative embodiment, the processing station is provided with a limiting structure for limiting the box. In an alternative embodiment, the treatment system further comprises a cleaning device and/or a drying device, the treatment station being located within the cleaning device and/or the drying device. Compared with the prior art, the wafer conveying box processing system provided by the utility model is provided with the adhesion detection module, and can detect the adhesion condition of the box body and the cover body in the process of separating the cover body of the wafer conveying box from the box body by the cover opening device, so that the system can respond in time under the condition of adhesion of the box body, for example, the position of the box body is adjusted, and the like, thereby ensuring that the subsequent processing process of the box body is smoothly carried out, for example, the cleaning or