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CN-224218802-U - Wafer bonding force testing device

CN224218802UCN 224218802 UCN224218802 UCN 224218802UCN-224218802-U

Abstract

The application discloses a wafer bonding force testing device, and relates to the technical field of semiconductors. The wafer bonding force testing device comprises a wafer clamp and a feeding mechanism arranged on one side of the wafer clamp, wherein bonding wafers are horizontally arranged on the wafer clamp, the feeding mechanism comprises a blade clamped and fixed by a feeding clamping piece and a cleaning structure arranged in front of the wafer clamp in the feeding direction of the blade, the cleaning structure comprises an upper elastic cleaning part and a lower metal cleaning part which are oppositely arranged in the vertical direction, a horizontal gap is formed between the upper elastic cleaning part and the lower metal cleaning part, the width of the horizontal gap is smaller than the thickness of the blade, the horizontal gap corresponds to the horizontal height of a bonding surface of the bonding wafers, and the blade is used for cutting into the bonding surface of the bonding wafers after passing through the horizontal gap in the feeding direction under the pushing of the feeding clamping piece. The blade cleaning device can clean scraps on the blade, and improves the stability of a measurement result.

Inventors

  • WEI FEIYUN

Assignees

  • 湖北星辰技术有限公司

Dates

Publication Date
20260508
Application Date
20250611

Claims (10)

  1. 1. The wafer bonding force testing device is characterized by comprising a wafer clamp and a feeding mechanism arranged on one side of the wafer clamp, wherein bonding wafers are horizontally arranged on the wafer clamp, the feeding mechanism comprises a blade clamped and fixed by the feeding clamping piece and a cleaning structure arranged in front of the wafer clamp in the feeding direction of the blade, the cleaning structure comprises an upper elastic cleaning part and a lower metal cleaning part which are oppositely arranged in the vertical direction, a horizontal gap is formed between the upper elastic cleaning part and the lower metal cleaning part, the width of the horizontal gap is smaller than the thickness of the blade, the horizontal gap corresponds to the horizontal height of the bonding surface of the bonding wafers, and the blade is used for cutting into the bonding surface of the bonding wafers after passing through the horizontal gap in the feeding direction under the pushing of the feeding clamping piece.
  2. 2. The wafer bonding force testing apparatus according to claim 1, wherein a side of the upper elastic cleaning portion facing the horizontal slit is a plane, a side of the lower metal cleaning portion facing the horizontal slit is a plane, and the two planes are parallel.
  3. 3. The wafer bonding force testing apparatus according to claim 1 or 2, wherein the upper elastic cleaning portion is inclined with respect to a vertical direction so that a bottom of the upper elastic cleaning portion is offset with respect to the lower metal cleaning portion in a direction approaching the bonded wafer in a feeding direction of the blade.
  4. 4. A wafer bonding force testing apparatus according to claim 3, wherein the upper elastic cleaning portion has an included angle of 5 ° -8 ° with respect to the vertical direction.
  5. 5. The wafer bonding force testing apparatus according to claim 1 or 2, wherein a collecting groove is provided in a side of the lower metal cleaning portion facing the bonded wafer in a fitting manner for receiving chips detached from the blade during a retracting process.
  6. 6. The wafer bonding force testing apparatus according to claim 3, wherein a top of the upper elastic cleaning portion and the lower metal cleaning portion are located in a plane in a vertical direction at a feeding side of the blade.
  7. 7. The wafer bonding force testing apparatus according to claim 6, wherein a bevel cut surface or an arc cut surface is machined on a feed side of the lower metal cleaning portion facing a plane of the horizontal slit so that the blade is guided into the horizontal slit through the bevel cut surface or the arc cut surface during the feeding process.
  8. 8. The wafer bonding force testing apparatus according to claim 6, wherein the lower metal cleaning portion forms a polished metal face toward a plane of the horizontal slit, and a track groove in a feed direction is processed on the polished metal face.
  9. 9. The wafer bond force testing apparatus of claim 5, wherein the bonding surface for blade cutting is above the collection trough.
  10. 10. The wafer bonding force testing apparatus according to claim 1, wherein a side of the upper elastic cleaning portion facing the bonding wafer protrudes from a side of the lower metal cleaning portion facing the bonding wafer.

Description

Wafer bonding force testing device Technical Field The application relates to the technical field of semiconductors, in particular to a wafer bonding force testing device. Background In the wafer bonding technology, the bonding force between wafers is an important parameter reflecting the bonding condition of the wafers, and accurate measurement of the bonding force between wafers is related to the quality of products. Currently, a crack propagation and diffusion method (also called a blade insertion method) is adopted for measuring bonding force of a wafer, namely, a blade is inserted into a bonding surface of the wafer, two new surfaces are generated on the bonded wafer, cracks appear on the two new surfaces and gradually tend to be stable, and bonding strength between the two new surfaces can be calculated by calculating the length of the generated cracks. In the prior art, the blade is directly inserted into the bonding surface of the wafer during the measurement, and in the repeated measurement process, the surface of the blade is attached with chips of the wafer, and the subsequent measurement can cause distortion of the measurement result and even breakage of the wafer. Disclosure of utility model The application aims to provide a wafer bonding force testing device which can clean scraps on a blade and improve the stability of a measurement result. Embodiments of the present application are implemented as follows: The embodiment of the application provides a wafer bonding force testing device, which comprises a wafer clamp and a feeding mechanism arranged on one side of the wafer clamp, wherein the wafer clamp is used for horizontally arranging a bonding wafer, the feeding mechanism comprises a blade clamped and fixed by a feeding clamping piece and a cleaning structure arranged in front of the wafer clamp in the feeding direction of the blade, the cleaning structure comprises an upper elastic cleaning part and a lower metal cleaning part which are oppositely arranged in the vertical direction, a horizontal gap is formed between the upper elastic cleaning part and the lower metal cleaning part, the width of the horizontal gap is smaller than the thickness of the blade, the horizontal gap corresponds to the horizontal height of a bonding surface of the bonding wafer, and the blade is used for cutting into the bonding surface of the bonding wafer after passing through the horizontal gap in the feeding direction under the pushing of the feeding clamping piece. Alternatively, as an implementation manner, a side of the upper elastic cleaning part facing the horizontal slit is a plane, a side of the lower metal cleaning part facing the horizontal slit is a plane, and the two planes are parallel. Optionally, as an implementation manner, the upper elastic cleaning portion forms an angle with the vertical direction, so that in the feeding direction of the blade, the bottom of the upper elastic cleaning portion is offset relative to the lower metal cleaning portion in a direction approaching the bonding wafer. Optionally, as an implementation manner, the included angle between the upper elastic cleaning part and the vertical direction is between 5 ° and 8 °. Optionally, as an implementation manner, a collecting groove is also provided on the side of the lower metal cleaning part facing the bonding wafer in a fitting way, so as to receive the chips falling off from the blade in the retracting process. Alternatively, as an implementation manner, on the feeding side of the blade, the top of the upper elastic cleaning part and the lower metal cleaning part are located in a plane in the vertical direction. Alternatively, as an embodiment, the lower metal cleaning part is processed with a chamfer cut-in surface or an arc cut-in surface towards the feed side of the plane of the horizontal slit, so that the blade is guided into the horizontal slit through the chamfer cut-in surface or the arc cut-in surface during the feed process. Alternatively, as an embodiment, the lower metal cleaning part forms a polished metal surface toward a plane of the horizontal slit, and a track groove in a feed direction is formed on the polished metal surface. Optionally, as an implementation, the bonding surface for the blade to cut into is located above the collection trough. Alternatively, as an implementation manner, a side of the upper elastic cleaning portion facing the bonding wafer protrudes from a side of the lower metal cleaning portion facing the bonding wafer. The beneficial effects of the embodiment of the application include: The application provides a wafer bonding force testing device, which comprises a wafer clamp and a feeding mechanism arranged on one side of the wafer clamp, wherein the wafer clamp is used for horizontally arranging a bonding wafer, the feeding mechanism comprises a blade clamped and fixed by a feeding clamping piece, and a cleaning structure arranged in front of the wafer clamp in the feeding directi