CN-224218805-U - Chip packaging structure with metal shielding layer

Abstract

The utility model relates to the technical field of chip packaging, in particular to a chip packaging structure with a metal shielding layer, which comprises a substrate, wherein the top of the substrate is fixedly connected with a chip, the top of the substrate is fixedly connected with a shielding cover, the periphery of the shielding cover is fixedly connected with radiating fins, one side of each radiating fin is fixedly connected with a heat conducting plate, the other side of each heat conducting plate is fixedly connected with a heat conducting gasket, the inner wall of the shielding cover is provided with a first shielding layer, and the outer surface of the shielding cover is provided with a second shielding layer. According to the utility model, heat generated by the chip working is conducted to the heat conducting plate through the heat conducting gasket, the heat conducting plate transmits the heat to the shielding cover and is dispersed by the radiating fins, internal electromagnetic waves generated by the chip are absorbed by the first shielding layer, external electromagnetic waves are further attenuated by the second shielding layer after being blocked by the reflecting layer, and the heat radiating efficiency and electromagnetic compatibility of the packaging structure are improved through the cooperative cooperation of heat radiation and the shielding structure.

Inventors

• QIU PENGYU
• CHEN RUOWEI
• ZHANG YINGDE

Assignees

• 泉州市堃方半导体有限公司

Dates

Publication Date

20260508

Application Date

20260320

Claims (6)

1. 1. The chip packaging structure with the metal shielding layer comprises a substrate (1), a chip (2) is fixedly connected to the top of the substrate (1), a shielding cover (3) is fixedly connected to the top of the substrate (1), and the chip packaging structure is characterized in that radiating fins (4) are fixedly connected to the periphery of the shielding cover (3), a heat conducting plate (5) is fixedly connected to one side of each radiating fin (4), a heat conducting gasket (6) is fixedly connected to the other side of each heat conducting plate (5), a first shielding layer (7) is arranged on the inner wall of the shielding cover (3), a second shielding layer (8) is arranged on the outer surface of the shielding cover (3), and a reflecting layer (9) is arranged on the outer surface of the second shielding layer (8).
2. 2. The chip packaging structure with the metal shielding layer of claim 1, wherein the periphery of the shielding cover (3) is provided with extension grooves matched with the heat conducting plates (5), one side, far away from the radiating fins (4), of the heat conducting plates (5) extends into the shielding cover (3), and the heat conducting plates (5) and the shielding cover (3) are fixed in a welding mode.
3. 3. The chip packaging structure with the metal shielding layer according to claim 1, wherein the shielding cover (3) is made of copper alloy, the radiating fins (4) are made of aluminum alloy, the heat conducting plate (5) is made of copper plate, and the heat conducting gasket (6) is made of high-performance heat conducting silica gel sheet.
4. 4. The chip packaging structure with the metal shielding layer according to claim 1, wherein the first shielding layer (7) is made of a magnetic powder composite wave-absorbing material, and the first shielding layer (7) is directly coated on the inner wall of the shielding cover (3) in a spraying mode.
5. 5. The chip packaging structure with the metal shielding layer according to claim 1, wherein the second shielding layer (8) is prepared by adopting a high-conductivity metal coating, and the second shielding layer (8) realizes metallurgical bonding of the metal layer and the copper alloy shielding cover (3) in an electroplating mode.
6. 6. The chip packaging structure with the metal shielding layer according to claim 1, wherein the reflecting layer (9) is prepared by adopting an epoxy resin composite film, and the reflecting layer (9) is coated on the outer surface of the second shielding layer (8) in a direct coating mode.

Description

Chip packaging structure with metal shielding layer Technical Field The utility model relates to the technical field of chip packaging, in particular to a chip packaging structure with a metal shielding layer. Background The chip package is a key link in the semiconductor manufacturing process, and is mainly used for providing basic functions of mechanical support, environmental protection, electrical connection, heat management and the like for the chip, the package structure can protect the chip from external factors such as temperature change, physical impact, chemical pollution and the like, meanwhile, a signal transmission path between an internal circuit of the chip and an external system is established, and along with the development of electronic equipment to the high-integration and high-frequency directions, the heat management and electromagnetic compatibility of the package structure become important factors for influencing the reliability and the system stability of the chip. In electromagnetic shielding, a shielding layer is usually required to be arranged on the packaging structure to prevent external electromagnetic interference from affecting the normal operation of the chip, and meanwhile, electromagnetic radiation generated by the chip is restrained from interfering with an external circuit, and the traditional electromagnetic shielding scheme mainly depends on a metal shielding cover, however, the traditional electromagnetic shielding scheme only depends on a single metal shielding layer and has obvious defects that for external incident electromagnetic waves, the absorption effect of a thin metal layer is limited, and for electromagnetic wave clutter generated inside the chip, the shielding effectiveness is attenuated because the electromagnetic wave clutter is difficult to effectively restrain multiple reflection interference in a cavity simply by the metal shielding cover. In the aspect of heat dissipation management, the existing chip package mostly adopts a mode of heat conduction silicone grease matched with an external fan to dissipate heat, and the heat dissipation scheme has the following defects that the interface contact thermal resistance between the heat conduction silicone grease and the heat sink is high, and the heat conduction efficiency is limited. The existing chip packaging structure has a lifting space in the aspects of heat radiation efficiency and electromagnetic shielding performance, and is difficult to effectively meet the double requirements of internal electromagnetic wave absorption and external electromagnetic wave reflection by singly relying on a shielding cover, and the heat radiation mode of the traditional heat conduction silicone grease matched with a fan has larger path thermal resistance and limited heat radiation effect. Therefore, it is necessary to design a chip package structure capable of assisting in improving the heat dissipation effect and electromagnetic shielding performance, so as to solve the technical problems of low heat dissipation efficiency and insufficient electromagnetic shielding in the prior art. Disclosure of utility model The utility model aims to provide a chip packaging structure with a metal shielding layer, which solves the problems of low heat dissipation efficiency and insufficient electromagnetic shielding effect of the chip packaging structure in the prior art by arranging a heat dissipation fin and a first shielding layer. The chip packaging structure with the metal shielding layer comprises a substrate, wherein a chip is fixedly connected to the top of the substrate, a shielding cover is fixedly connected to the top of the substrate, radiating fins are fixedly connected to the periphery of the shielding cover, a heat conducting plate is fixedly connected to one side of each radiating fin, a heat conducting gasket is fixedly connected to the other side of each heat conducting plate, a first shielding layer is arranged on the inner wall of the shielding cover, a second shielding layer is arranged on the outer surface of the shielding cover, and a reflecting layer is arranged on the outer surface of the second shielding layer. Preferably, the periphery of the shielding case is provided with extension grooves matched with the heat conducting plates, one sides of the heat conducting plates, which are far away from the radiating fins, extend to the inside of the shielding case, and the heat conducting plates are fixed with the shielding case in a welding mode. Preferably, the shielding cover is made of copper alloy, the radiating fins are made of aluminum alloy, the heat conducting plate is made of copper plates, and the heat conducting gasket is made of high-performance heat conducting silica gel sheets. Preferably, the first shielding layer is prepared from a wave-absorbing material compounded by magnetic powder, and the first shielding layer is directly coated on the inner wall of the shielding cover in a spraying mode.