CN-224218807-U - Frame type packaging structure containing passive element

Abstract

The utility model provides a frame type packaging structure containing a passive element, which comprises an LGA packaging body, an integrated circuit chip and a metal frame, wherein the LGA packaging body is configured to comprise the passive element and a substrate, one surface of the substrate is provided with a substrate pad, the passive element is configured to be adhered to the surface of the substrate opposite to the substrate pad, the LGA packaging body and the integrated circuit chip are configured to be adhered to a frame carrier, the substrate pad of the LGA and the pad of the integrated circuit chip are arranged face up, and the substrate pad, the pad of the integrated circuit chip and a frame pin are interconnected through a wire bonding process.

Inventors

• WANG BAOSHUAI
• XIAO LIMIN
• GAO RUITING
• LIANG DONG
• ZHANG LING
• OUYANG YI
• QIAN YONGXUE
• HUANG XIN

Assignees

• 北京昂瑞微电子技术股份有限公司

Dates

Publication Date

20260508

Application Date

20250513

Claims (9)

1. 1. A frame-type package structure containing passive element comprises LGA package, integrated circuit chip, and metal frame, and is characterized in that, The LGA package is configured to include a passive component and a substrate, the substrate having a substrate pad disposed on one surface thereof, the passive component being configured to be affixed to the surface of the substrate opposite the substrate pad; The metal frame comprises a frame carrier and frame pins; the LGA package and the integrated circuit chip are configured to be adhered to a frame carrier, the land pads of the LGA and the land pads of the integrated circuit chip being disposed face up; The substrate pads, pads of the integrated circuit chip, and frame pins are interconnected by a wire bonding process.
2. 2. The frame-like package structure containing a passive component of claim 1, wherein the passive component comprises a solder terminal surface and the substrate comprises a via through which the solder terminal surface and substrate pad are connected.
3. 3. The frame-like package structure containing a passive component of claim 2, wherein an area of the substrate pad is configured to be larger than an area of the solder terminal surface.
4. 4. The frame-like package structure of claim 1, wherein the LGA package further comprises a plastic package housing disposed on a surface of the substrate opposite the substrate pads to cover the package housing of the passive component.
5. 5. The frame-like package structure containing a passive component according to claim 1, wherein the passive component is attached to a surface of a substrate opposite to a substrate pad by a surface mount technology, and The LGA package and the integrated circuit chip are attached to a frame carrier by means of a die attach adhesive.
6. 6. The frame-like packaging structure containing passive components of claim 1, further comprising a protective housing configured as an epoxy molding compound to cover the frame carrier and to be connected to the outside through the frame pins.
7. 7. The frame-like package structure comprising a passive component of claim 1, wherein the frame carrier is configured as a copper frame carrier.
8. 8. The frame-like package structure containing a passive component of claim 1, wherein the frame-like package structure comprises a QFN package.
9. 9. The frame-like package structure of claim 2, wherein the substrate pads are configured as electroless nickel palladium gold pads, the nickel thickness being 0.3-0.5 um, the palladium thickness being at least 0.1um, the gold thickness being at least 0.1um.

Description

Frame type packaging structure containing passive element Technical Field The present disclosure relates to semiconductor packaging technology, and more particularly, to a frame-type packaging structure including a passive component. Background The main purpose of the chip package is to lead out the functional signals inside the chip, realize the conduction with the outside, and simultaneously play roles of fixing, sealing and protecting the chip. The package technology and the package type are various, and the package type can be divided into a frame type package and a substrate type package according to the type of the chip carrier, wherein the frame type package forms mainly comprise a small-outline package (Small Outline Package, SOP), a square Flat package (Quad FLAT PACKAGE, QFP), a square Flat No-lead package (Quad Flat No-LEAD PACKAGE, QFN) and the like, and the substrate type package forms mainly comprise a grid array package (LAND GRID ARRAY, LGA), a Ball grid array package (Ball GRID ARRAY PACKAGE, BGA), a pin grid array package (PIN GRID ARRAY, PGA) and the like. The frame type package has simple production process, low production cost and wide application field, and can be applied to low-end electronic products and high-end electronic products. The substrate packaging has higher integration level, more complex production process and higher production cost, and is mainly applied to electronic products with more complex functions. The passive element is a common electronic component and is an important class in microwave radio frequency devices. The passive element is an element which can display its characteristics without an external power source, and is mainly classified into a resistor element, an inductor element, a capacitor element, and the like. These passive components are typically ceramic-type packages with solder faces at both ends of the component, the metal making up the solder faces may be tin, and the solder faces of the passive components may be soldered to pads of a PCB board by Surface Mount Technology (SMT). Because the welding end face of the passive element is smaller, the welding reliability is considered and short circuit is prevented when the passive element is conducted with the outside, and the carrier for welding the passive element is required to make a precise window, so that only the carrier which can make the precise window on the surface, such as a substrate, can be packaged with the passive element, and the passive element is usually packaged with the substrate, and is rarely packaged with a frame. However, for some frame-like packaged products, if the number of passive components such as capacitors, resistors, inductors, etc. integrated within the integrated circuit chip is insufficient, or some special passive components are required, it is necessary to package the integrated circuit chip and the passive components on a frame carrier. How to implement the interconnection between the integrated circuit chip and the passive components becomes a critical issue. Because the shell of the passive element is made of ceramic material, the welding end face is made of tin, and the welding area is small, direct wire bonding interconnection between the integrated circuit chip and the passive element cannot be realized, and a package structure needs to be searched for, so that the interconnection between the integrated circuit chip and the passive element is realized and sealed on the frame carrier. Disclosure of utility model One aspect of the present utility model provides a frame-like package structure including a passive component. An LGA package is formed by packaging the passive components on a substrate carrier, then bonding the LGA package pads face up to a frame, and simultaneously bonding the integrated circuit chip to the frame, because the land surface of the LGA package is wireable, the land of the LGA can be connected to the chip land by means of the wirebonding, thereby achieving the integrated circuit chip and passive component package to the frame carrier. According to an aspect of the present utility model, there is provided a frame-like package structure including a passive element, including an LGA package configured to include the passive element and a substrate having a substrate pad disposed on one surface thereof, the passive element configured to be attached to a surface of the substrate opposite to the substrate pad, and a metal frame including a frame carrier and a frame lead, the LGA package and the integrated circuit chip configured to be attached to the frame carrier, wherein the substrate pad of the LGA and the pad of the integrated circuit chip are disposed face up, and the substrate pad, the pad of the integrated circuit chip, and the frame lead are interconnected by a wire bonding process. According to an aspect of the present utility model, there is provided a frame-like package structure including a passive element, wherein the passive el