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CN-224218808-U - SOP16W lead frame and integrated packaging module

CN224218808UCN 224218808 UCN224218808 UCN 224218808UCN-224218808-U

Abstract

The SOP16W lead frame comprises a lead frame body, a first base island and a second base island are arranged in a packaging unit of the lead frame at intervals along the width direction, a third base island which is arranged at intervals with the second base island is arranged along the length direction, a plurality of pins are respectively arranged on two sides of the packaging unit in the length direction, the first base island is connected with one pin on one side of the packaging unit in the length direction, the second base island and the third base island are respectively connected with a plurality of different pins on the other side of the packaging unit in the length direction, the other pins are spaced from the base islands, the first base island is connected with a frame body through a first base island connecting rib which extends out of one side of the packaging unit in the length direction, the second base island is connected with the frame body through a second base island connecting rib which extends out of one end of the packaging unit, and the third base island is connected with the frame body through a third base island connecting rib which extends out of the other end of the packaging unit. The integrated packaging module comprises an injection molding body and the SOP16W lead frame packaged in the injection molding body, so that the multi-chip packaging requirement can be guaranteed, the functional requirement is met, and meanwhile, the reliability is improved.

Inventors

  • Yuan Zhanfei
  • XIE HONGXING
  • CHENG JIAYUAN

Assignees

  • 四川明泰微电子有限公司

Dates

Publication Date
20260508
Application Date
20250530

Claims (9)

  1. 1. An SOP16W lead frame comprises an array of packaging units (2) formed on a frame main body (1), and is characterized in that a first base island (21) and a second base island (22) are arranged in the packaging units (2) at intervals along the width direction, and a third base island (23) spaced from the second base island (22) is arranged along the length direction; The two sides of the length direction of the packaging unit (2) are respectively provided with a plurality of pins, the first base island (21) is connected with one pin on one side of the length direction of the packaging unit (2), the second base island (22) and the third base island (23) are respectively connected with a plurality of different pins on the other side of the length direction of the packaging unit (2), and the other pins are spaced from the base islands; A thirteenth pin (A13), a twelfth pin (A12), an eleventh pin (A11), a tenth pin (A10), a ninth pin (A9), an eighth pin (A8) and a seventh pin (A7) are sequentially arranged on one side of the packaging unit (2) in the length direction, and a first pin (A1), a second pin (A2), a third pin (A3), a fourth pin (A4), a fifth pin (A5) and a sixth pin (A6) are sequentially arranged on the other side of the packaging unit; The thirteenth pin (A13) is opposite to the first pin (A1), and the seventh pin (A7) is opposite to the sixth pin (A6); The thirteenth pin (A13) is connected with the first base island (21), the second pin (A2), the third pin (A3) and the fourth pin (A4) are connected with the second base island (22), and the fifth pin (A5) and the sixth pin (A6) are connected with the third base island (23).
  2. 2. The SOP16W lead frame according to claim 1, characterized in that the seventh lead (A7) is folded, extends toward the third land (23) along the width direction of the package unit (2), and then changes to extend toward the first land (21) along the length direction of the package unit (2), and the rest of the leads extend toward the middle of the package unit (2) along the width direction of the package unit (2).
  3. 3. The SOP16W lead frame according to claim 2, characterized in that the first lead (A1) is located between the second land (22) and one end of the package unit (2), and extends a distance along the width direction of the package unit (2) greater than the distance that the remaining leads extend along the width direction of the package unit (2), and the first lead (A1) is connected to the frame body (1) through a lead connecting rib (34) extending out of one end of the package unit (2).
  4. 4. SOP16W lead frame according to claim 1, characterized in that the seventh lead (A7) is formed with a fourth land (24) extending in the width direction of the package unit (2).
  5. 5. The SOP16W lead frame according to claim 1, characterized in that the first base island (21) is connected to the frame body (1) through a first base island connecting rib (31) extending out of one side of the packaging unit (2) in the length direction, the second base island (22) is connected to the frame body (1) through a second base island connecting rib (32) extending out of one end of the packaging unit (2), and the third base island (23) is connected to the frame body (1) through a third base island connecting rib (33) extending out of the other end of the packaging unit (2).
  6. 6. The SOP16W lead frame according to claim 5, wherein the outer side edges of the first base island connecting rib (31), the second base island connecting rib (32), and the third base island connecting rib (33) are all recessed inward to form the precut groove (30).
  7. 7. The SOP16W lead frame according to claim 1, wherein a pitch of the first pin (A1) and the second pin (A2), a pitch of the fourth pin (A4) and the fifth pin (A5), and a pitch of the seventh pin (A7) and the eighth pin (A8) are each larger than a pitch between the remaining adjacent pins.
  8. 8. An integrated package module comprising an injection molded body and the SOP16W lead frame of any of claims 1-7 encapsulated in the injection molded body.
  9. 9. An integrated package module, comprising an injection molding body and the SOP16W lead frame according to any one of claims 1-7 encapsulated in the injection molding body, wherein a first base island (21) is used for bonding an IC driving chip (41), a second base island (22) is used for bonding a first power chip (42), a third base island (23) is used for bonding a second power chip (43), and the IC driving chip (41) is connected with a thirteenth pin (a 13), a twelfth pin (a 12), an eleventh pin (a 11), a tenth pin (a 10), a ninth pin (A9), an eighth pin (A8), a seventh pin (A7), a second base island (22), the first power chip (42) and the second power chip (43) through bonding wires.

Description

SOP16W lead frame and integrated packaging module Technical Field The application relates to a semiconductor technology, belongs to the technical field of integrated circuit packaging, and particularly relates to an SOP16W lead frame and an integrated packaging module. Background Currently, in order to meet the demands of integrated packaging and miniaturization, more and more packaged products are demanded to integrate more chips instead of conventional discrete devices. How to integrate multiple pairs of chips under the existing packaging models and packaging sizes becomes one of the important research points of the packaging industry, and as a lead frame of a chip carrier, the lead frame becomes a subdivision path in the research, and the design of an internal structure of the lead frame and the lead bonding in the subsequent packaging have great relation, and the stability of the packaging structure is guaranteed after plastic packaging. The current market demand of the half-bridge circuit matched with the control chip is large, SOP16W is a general packaging appearance of the product, and a general framework with low packaging difficulty and high reliability is needed to be developed for the demand. Disclosure of utility model In order to meet the development requirements of the existing products, the application provides the SOP16W lead frame and the integrated packaging module, wherein three base islands which are respectively and directly connected with different pins are distributed at intervals in the integrated packaging module, so that the multi-chip packaging requirements can be ensured, the mutual isolation can be ensured, the overlong bonding wires in the subsequent packaging can be avoided, the functional requirements are met, and meanwhile, the reliability of the formed packaging module is improved. In order to achieve the above object, the present utility model adopts the following technique: The SOP16W lead frame comprises a packaging unit formed on a frame main body in an array manner, wherein a first base island and a second base island are arranged in the packaging unit at intervals along the width direction, and a third base island which is arranged at intervals with the second base island is arranged in the length direction; The two sides of the length direction of the packaging unit are respectively provided with a plurality of pins, the first base island is connected with one pin on one side of the length direction of the packaging unit, the second base island and the third base island are respectively connected with a plurality of different pins on the other side of the length direction of the packaging unit, and the other pins are spaced from the base islands; The first base island is connected with the frame main body through a first base island connecting rib extending out of one side of the length direction of the packaging unit, the second base island is connected with the frame main body through a second base island connecting rib extending out of one end of the packaging unit, and the third base island is connected with the frame main body through a third base island connecting rib extending out of the other end of the packaging unit. Further, a thirteenth pin, a twelfth pin, an eleventh pin, a tenth pin, a ninth pin, an eighth pin and a seventh pin are sequentially arranged on one side of the packaging unit in the length direction, a first pin, a second pin, a third pin, a fourth pin, a fifth pin and a sixth pin are sequentially arranged on the other side of the packaging unit, the thirteenth pin is opposite to the first pin, the seventh pin is opposite to the sixth pin, the thirteenth pin is connected with the first base island, the second pin, the third pin and the fourth pin are connected with the second base island, and the fifth pin and the sixth pin are connected with the third base island. Further, the seventh pin is folded, extends towards the third base island along the width direction of the packaging unit, and then is converted into extending towards the first base island along the length direction of the packaging unit, and the other pins extend towards the middle of the packaging unit along the width direction of the packaging unit. Further, the first pins are located between the second base island and one end of the packaging unit, the distance extending along the width direction of the packaging unit is larger than the distance extending along the width direction of the packaging unit of the other pins, and the first pins are connected with the frame body through the pin connecting ribs extending out of one end of the packaging unit. Further, the seventh lead is formed with a fourth land extending in the package unit width direction. Further, the outer side edges of the first base island connecting rib, the second base island connecting rib and the third base island connecting rib are inwards recessed to form pre-cutting grooves. Further, the distance between