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CN-224218809-U - Power device module

CN224218809UCN 224218809 UCN224218809 UCN 224218809UCN-224218809-U

Abstract

The application relates to a power device module, which comprises a circuit board, a power device, wherein the power device comprises a packaging body and pins extending from the end part of the packaging body, the packaging body comprises a shell, at least part of the pins are positioned in the shell, the pins are bent towards the top surface of the shell to form a first section, a second section and a third section, the first section is connected with the packaging body, the second section is connected with the first section and the third section, the first section is parallel to the third section, the third section is connected with the circuit board in a bonding mode, the radiator is connected with the bottom surface of the shell in a bonding mode through a locking circuit board and a radiator, the radiator is used for radiating the power device, the use requirement of a high-current environment can be met, the power device of a plug-in type can be connected onto the circuit board in a bonding mode through a surface mounting technology, and therefore automatic production of the plug-in type power device is achieved, on the other hand, the power device in the circuit board can be quickly mounted on the radiator in a bonding mode, and automatic assembly is achieved.

Inventors

  • LIU XIAO
  • WU HAIFENG

Assignees

  • 上海格立特电力电子有限公司
  • 上海电机系统节能工程技术研究中心有限公司

Dates

Publication Date
20260508
Application Date
20250619

Claims (5)

  1. 1. A power device module, comprising: A circuit board; The power device comprises a packaging body and pins extending from the end part of the packaging body, wherein the packaging body comprises a shell, at least part of the pins are positioned in the shell, the pins are bent towards the top surface of the shell to form a first section, a second section and a third section, the first section is connected with the packaging body, the second section is connected with the first section and the third section, the first section is parallel to the third section, and the third section is used for being attached to the circuit board; The radiator is connected with the bottom surface of the shell in a bonding way and is used for radiating the power device; the third section is higher than the top surface of the shell in the height direction; The power device module further comprises a copper column arranged on the circuit board, the third section is in fit connection with the circuit board, the copper column is propped against the top surface of the shell towards the direction of the radiator so as to compress the power device and the radiator, and the power device is a plug-in type power device; The copper column comprises a connecting part, a pressing part and an extending part, wherein the connecting part is connected with the circuit board, the pressing part is pressed against the top surface of the packaging body when the copper column presses the power device, and the extending part is positioned in the screw hole.
  2. 2. The power device module of claim 1, wherein the third section is disposed flush with the top surface of the housing, the third section is in contact with the circuit board, and the circuit board is pressed against the top surface of the housing toward the heat sink to press the power device against the heat sink.
  3. 3. The power device module of claim 1, wherein an insulating and thermally conductive layer is further disposed between the package and the heat sink.
  4. 4. The power device module of claim 1, wherein a conductive layer is disposed on the circuit board, the conductive layer being configured to connect to the third segment, the conductive layer being teardrop-shaped.
  5. 5. The power device module of claim 1, wherein a conductive layer is disposed on the circuit board, and a copper bar is further connected to the conductive layer, and the copper bar is used for connecting with the third section.

Description

Power device module Technical Field The utility model relates to the technical field of power device packaging, in particular to a power device module. Background The power semiconductor device is widely applied in the field of high voltage and high current, such as a frequency converter, an inverter, an electric automobile driver, power equipment and the like. The traditional power semiconductor devices in high-current and high-voltage environments mostly adopt package types, such as TO-220 package, TO-247 package and the like. These devices typically need to be used with a heat sink to meet heat dissipation requirements. However, the assembly process of the power semiconductor device in the prior art is complicated, the production efficiency is low, and the automatic production and assembly cannot be realized. Accordingly, there is a need for an improvement over the prior art to overcome the deficiencies described in the prior art. Disclosure of utility model In view of the above, an embodiment of the present application provides a power device module for solving at least one problem existing in the background art, including: A circuit board; The power device comprises a packaging body and pins extending from the end part of the packaging body, wherein the packaging body comprises a shell, at least part of the pins are positioned in the shell, the pins are bent towards the top surface of the shell to form a first section, a second section and a third section, the first section is connected with the packaging body, the second section is connected with the first section and the third section, the first section is parallel to the third section, and the third section is used for being attached to the circuit board; And the radiator is connected with the bottom surface of the shell in a bonding way and is used for radiating the power device. Optionally, above-mentioned power device module, the third section with the casing top surface flushes the setting, the third section with the circuit board laminating is connected, just the circuit board orientation the direction of radiator supports presses the casing top surface, in order to with power device with the radiator compresses tightly. Optionally, in the power device module, the third section is higher than the top surface of the housing in a height direction; The power device module further comprises a copper column arranged on the circuit board, the third section is connected with the circuit board in a fitting mode, and the copper column is pressed against the top surface of the shell towards the direction of the radiator so as to compress the power device with the radiator. Optionally, in the power device module, a screw hole is formed on the package body; the copper column comprises a connecting part, a pressing part and an extending part, wherein the connecting part is connected with the circuit board, the pressing part is pressed against the top surface of the packaging body when the copper column is pressed against the power device, and the extending part is positioned in the screw hole. Optionally, in the power device module, an insulating heat conducting layer is further disposed between the package body and the heat sink. Optionally, in the power device module, a conductive layer is disposed on the circuit board, and the conductive layer is used for being connected with the third section, and the conductive layer is in a teardrop shape. Optionally, in the power device module, a conductive layer is disposed on the circuit board, and a copper bar is further connected to the conductive layer, and the copper bar is used for being connected with the third section. Compared with the prior art, the plug-in type power device has the advantages that the pins of the plug-in type power device are bent into the first section, the second section and the third section, and the third section is used for being in joint connection with the circuit board, so that the use requirement of a high-current environment can be met, the plug-in type power device can be also in joint connection with the circuit board through a surface mounting technology (Surface Mount Technology, SMT), and therefore automatic production of the plug-in type power device is achieved, and on the other hand, the radiator is in joint connection with the bottom surface of the shell, and good heat dissipation of the power device can be achieved when the power device works under high-voltage and high-current. Drawings Fig. 1 is a schematic diagram of the structure of a power device shown in the present embodiment; Fig. 2 is a schematic diagram showing the structure of one of the plurality of power device mounting embodiments shown in this embodiment; FIG. 3 is a cross-sectional view of FIG. 2; fig. 4 is a schematic structural view of still another embodiment of the multiple power device mounting shown in this embodiment; FIG. 5 is a cross-sectional view of FIG. 4; Fig. 6 is a partial enlarged view o