CN-224218810-U - Electronic package

Abstract

The application relates to an electronic package, which comprises a wiring structure, a circuit structure, an intermediate board, a plurality of electronic elements, a packaging colloid and other components. The circuit structure is arranged on the wiring structure to be electrically connected with the wiring structure, the intermediate plate is arranged on the circuit structure and is provided with a plurality of conductive through holes to be electrically connected with the circuit structure, the electronic element is arranged on the intermediate plate to be electrically connected with the conductive through holes, and the packaging colloid is formed on the wiring structure to cover the circuit structure, the intermediate plate and the electronic element. Therefore, the application can effectively heterogeneous integrate different components to form the composite electronic package.

Inventors

• CHEN WEIMING
• NI QINGYU
• HUANG JITING

Assignees

• 青岛新核芯科技有限公司

Dates

Publication Date

20260508

Application Date

20250520

Claims (10)

1. 1. An electronic package, comprising: A wiring structure; The intermediate plate is arranged on the wiring structure and is provided with a plurality of conductive through holes for electrically connecting the wiring structure; a plurality of electronic components disposed on the interposer for electrically connecting the conductive vias, and And the packaging colloid is formed on the wiring structure to cover the intermediate plate and the plurality of electronic elements.
2. 2. The electronic package of claim 1, wherein a wiring structure is formed on the interposer, the wiring structure has at least one dielectric layer and at least one wiring layer combined with the dielectric layer, the wiring structure has at least one insulating layer and at least one redistribution wiring layer combined with the insulating layer, and the redistribution wiring layer of the wiring structure is electrically connected with the wiring layer of the wiring structure.
3. 3. The electronic package of claim 2, further comprising a plurality of conductive bumps and a plurality of conductive contacts, wherein the plurality of conductive bumps are formed between the wiring structure and the circuit structure, the plurality of conductive contacts are formed between the plurality of conductive vias of the interposer and the plurality of electronic components, and the encapsulant further encapsulates the plurality of conductive bumps and the plurality of conductive contacts.
4. 4. The electronic package of claim 2, further comprising a plurality of conductive bumps, wherein the routing structure has at least one redistribution layer, the routing structure has at least one routing layer, and the redistribution layer of the routing structure is electrically connected to the routing layer of the routing structure through the plurality of conductive bumps.
5. 5. The electronic package of claim 1, further comprising a plurality of conductive contacts, wherein the plurality of electronic components are connected to the interposer through the plurality of conductive contacts, and the plurality of electronic components are electrically connected to the plurality of conductive contacts, the plurality of conductive vias of the interposer, and the wiring structure in sequence.
6. 6. The electronic package of claim 1, wherein the top surfaces of the plurality of electronic components are coplanar with the top surface of the encapsulant.
7. 7. The electronic package of claim 1, further comprising a plurality of conductors and a substrate, wherein the plurality of conductors are formed between the wiring structure and the substrate to electrically connect the wiring structure and the substrate.
8. 8. The electronic package of claim 1, further comprising a thermally conductive layer formed on the top surfaces of the plurality of electronic components.
9. 9. The electronic package of claim 8, further comprising a heat sink formed on the thermally conductive layer, the thermally conductive layer being interposed between the plurality of electronic components and the heat sink.
10. 10. The electronic package of claim 1, further comprising a heat sink having a heat sink and at least one support leg coupled to the heat sink, wherein the heat sink or the support leg is in contact with or in proximity to the plurality of electronic components.

Description

Electronic package Technical Field The present application relates to a semiconductor device, and more particularly, to an electronic package capable of heterogeneous integration of different components. Background In order to ensure the continuous miniaturization and versatility of electronic products, semiconductor devices or electronic packages are continuously being developed toward miniaturization of the size. For example, in advanced packaging technologies for semiconductor devices or electronic packages, commonly used packaging technologies may include 2.5D Integrated Circuit (IC) packaging technologies, 3D Integrated Circuit (IC) packaging technologies, fan-out stack packaging (Fan-Out Package on Package; FO-PoP) technologies, and the like. Furthermore, 2.5D integrated circuit packaging technology or 3D integrated circuit packaging technology employing through silicon vias (Through Silicon Via; TSVs) is rapidly becoming an important development in the semiconductor industry in recent years due to its advantages of better bandwidth and less power consumption, and the ability to provide higher integration to break through the limits of small dimensions (e.g., microns/nm). However, it is generally difficult to heterogeneous integrate various components such as a wiring structure, a circuit structure, an interposer (conductive via), a plurality of electronic devices and a molding compound to form a composite electronic package, and it is also difficult to use components such as a heat conducting layer and/or a heat dissipating member (such as a heat sink and a supporting leg) to rapidly dissipate heat generated by the electronic package or the plurality of electronic devices, and it is also often impossible to make the electronic package have a property of anti-bending or high anti-bending strength. Therefore, how to overcome the above problems of the prior art has been an urgent issue. Disclosure of utility model In view of the above-mentioned drawbacks of the prior art, the present application provides an electronic package, which includes a wiring structure, an interposer disposed on the wiring structure and having a plurality of conductive vias for electrically connecting the wiring structure, a plurality of electronic devices disposed on the interposer for electrically connecting the plurality of conductive vias, and a molding compound formed on the wiring structure for encapsulating the interposer and the plurality of electronic devices. In the foregoing electronic package, a circuit structure is formed on the interposer, the circuit structure has at least one dielectric layer and at least one circuit layer combined with the dielectric layer, the circuit structure has at least one insulating layer and at least one redistribution circuit layer combined with the insulating layer, and the redistribution circuit layer of the circuit structure is electrically connected with the circuit layer of the circuit structure. The electronic package further includes a plurality of conductive bumps and a plurality of conductive contacts, wherein the plurality of conductive bumps are formed between the wiring structure and the circuit structure, the plurality of conductive contacts are formed between the plurality of conductive vias of the interposer and the plurality of electronic components, and the encapsulant further encapsulates the plurality of conductive bumps and the plurality of conductive contacts. The electronic package may include a plurality of conductive bumps, wherein the wiring structure has at least one redistribution layer, the wiring structure has at least one wiring layer, and the redistribution layer of the wiring structure is electrically connected to the wiring layer of the wiring structure through the plurality of conductive bumps. The electronic package may include a plurality of conductive contacts, wherein the plurality of electronic devices are connected to the interposer through the plurality of conductive contacts, and the plurality of electronic devices are electrically connected to the plurality of conductive contacts, the plurality of conductive vias and the wiring structure of the interposer in sequence. The electronic package may include a plurality of conductive bumps and a plurality of conductive contacts, wherein the upper surfaces of the plurality of electronic components and the upper surface of the encapsulant are coplanar. The electronic package may include a plurality of conductors and a substrate, and the plurality of conductors are formed between the wiring structure and the substrate to electrically connect the wiring structure and the substrate. The electronic package may include a heat conductive layer formed on the upper surfaces of the plurality of electronic components. The electronic package may include a heat sink formed on the heat conductive layer, and the heat conductive layer is interposed between the plurality of electronic components and the heat sink. The