CN-224218813-U - Power switch packaging structure and power circuit

CN224218813UCN 224218813 UCN224218813 UCN 224218813UCN-224218813-U

Abstract

The utility model provides a power switch packaging structure and a power circuit, and relates to the technical field of semiconductor packaging. At least part of bonding wire sections of the plurality of source bonding wires are distributed around the grid lead, so that the mutual inductance mode between the grid and the source of the power switch can be improved, the influence of parasitic inductance of the common source is reduced, and the Kelvin source packaging related function is realized. Compared with the Kelvin source electrode packaging structure, the packaging structure provided by the utility model can set all source electrode bonding wires to be electrically connected with the same source electrode common packaging electrode, so that the number of the packaging electrodes is reduced, the packaging structure is simplified, and the space occupied by the packaging structure is reduced.

Inventors

FANG LIANG
LIU YUNFENG

Assignees

经纬恒润(天津)研究开发有限公司

Dates

Publication Date: 20260508
Application Date: 20250421

Claims (10)

1. A power switch package structure, the power switch package structure comprising: a power switch comprising a source and a gate; The grid electrode packaging electrode is connected with the grid electrode packaging electrode through a grid lead; The source electrode common packaging electrode is connected with the source electrode through a plurality of source electrode bonding wires, wherein at least part of bonding wire sections of the source electrode bonding wires are distributed around the grid electrode lead.
2. The power switch package as defined in claim 1, wherein the source is disposed around the gate; The connecting ends of the source bonding wires and the source are distributed around the connecting ends of the grid leads and the grid.
3. The power switch package of claim 2 wherein the source is an integral ring electrode; Or the source electrode comprises a plurality of electrode blocks which are arranged along the direction surrounding the grid electrode and are mutually isolated, and any electrode block is electrically connected with at least one source electrode bonding wire.
4. The power switch package as defined in claim 1, wherein the source common package electrode comprises a hollowed-out area; The grid packaging electrode is arranged in the hollowed-out area.
5. A power circuit comprising at least one power switch package structure, the power switch package structure comprising: a power switch comprising a source and a gate; The grid electrode packaging electrode is connected with the grid electrode packaging electrode through a grid lead; The source electrode common packaging electrode is connected with the source electrode through a plurality of source electrode bonding wires, wherein at least part of bonding wire sections of the source electrode bonding wires are distributed around the grid electrode lead.
6. The power circuit of claim 5, wherein the power circuit comprises a bridge inverter; The bridge inverter comprises at least one phase of bridge arm, wherein any phase of bridge arm comprises a plurality of power switch packaging structures, and all the power switch packaging structures comprise at least one upper bridge arm power switch packaging structure and at least one lower bridge arm power switch packaging structure.
7. The power circuit of claim 6, wherein the drains of all of the power switches of the upper leg power switch package structure are electrically connected to an upper leg drain common package electrode, the gate package electrodes of all of the upper leg power switch package structures are commonly used as an upper leg gate common package electrode, and the source common package electrodes of all of the upper leg power switch package structures are commonly used as an upper leg source common package electrode; The drain electrodes of the power switches of the lower bridge arm power switch packaging structure are electrically connected with the common packaging electrode of the drain electrode of the lower bridge arm, the grid packaging electrode of the lower bridge arm power switch packaging structure is shared as the common packaging electrode of the grid electrode of the lower bridge arm, the source common packaging electrode of the lower bridge arm power switch packaging structure is shared as the common packaging electrode of the source electrode of the lower bridge arm, and the upper bridge arm source common packaging electrode and the lower bridge arm drain common packaging electrode are shared as the common packaging electrode of the source and the drain.
8. The power circuit of claim 7, wherein the upper leg drain common package electrode and the source drain common package electrode are disposed opposite each other in a first direction, the source drain common package electrode includes a first electrode portion and a second electrode portion disposed along the first direction, and the first electrode portion and the second electrode portion are connected by a connection therebetween; The upper bridge arm drain electrode common packaging electrode comprises at least one switch hollow area, and a power switch of at least one upper bridge arm power switch packaging structure is arranged at the switch hollow area; The first electrode part is close to one side of the upper bridge arm drain electrode common packaging electrode, and comprises a first hollowed-out area, and the upper bridge arm gate electrode common packaging electrode is positioned in the first hollowed-out area; The lower bridge arm source electrode common packaging electrode is located between the first electrode portion and the second electrode portion, the lower bridge arm source electrode common packaging electrode comprises a second hollowed-out area, and the lower bridge arm gate electrode common packaging electrode is located in the second hollowed-out area.
9. The power circuit of claim 5, wherein in any of the power switch packages, the source is disposed around the gate; The connecting ends of the source bonding wires and the source are distributed around the connecting ends of the grid leads and the grid.
10. The power circuit of claim 9, wherein the source is a unitary ring electrode; Or the source electrode comprises a plurality of electrode blocks which are arranged along the direction surrounding the grid electrode and are mutually isolated, and any electrode block is electrically connected with at least one source electrode bonding wire.

Description

Power switch packaging structure and power circuit Technical Field The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging structure. Relates to a power switch packaging structure and a power circuit. Background The power semiconductor device can play roles of power conversion, power amplification, power switch, line protection, rectification and the like, has very wide application, and is almost used in all electronic manufacturing industries. Along with the rapid development of social economy and the continuous progress of technical process, the packaging of the power semiconductor device is continuously improved in the process of pursuing to continuously improve the energy efficiency of the power semiconductor device. The existing packaging structure of the power semiconductor device is complex, the number of packaging electrodes is large, and the problem of large occupied space exists. Disclosure of utility model In view of this, the present utility model provides a power switch package structure and a power circuit, in which all source bonding wires are electrically connected to the same source common package electrode, so as to reduce the number of package electrodes, simplify the package structure, and reduce the space occupied by the package structure. In order to achieve the above purpose, the technical scheme provided by the utility model is as follows: a power switch package structure, the power switch package structure comprising: a power switch comprising a source and a gate; The grid electrode packaging electrode is connected with the grid electrode packaging electrode through a grid lead; The source electrode common packaging electrode is connected with the source electrode through a plurality of source electrode bonding wires, wherein at least part of bonding wire sections of the source electrode bonding wires are distributed around the grid electrode lead. Optionally, the source electrode is arranged around the grid electrode; The connecting ends of the source bonding wires and the source are distributed around the connecting ends of the grid leads and the grid. Optionally, the source electrode is an integral ring electrode; Or the source electrode comprises a plurality of electrode blocks which are arranged along the direction surrounding the grid electrode and are mutually isolated, and any electrode block is electrically connected with at least one source electrode bonding wire. Optionally, the source common package electrode includes a hollowed-out area; The grid packaging electrode is arranged in the hollowed-out area. Based on the same inventive concept, the present utility model also provides a power circuit including at least one power switch package structure including: a power switch comprising a source and a gate; The grid electrode packaging electrode is connected with the grid electrode packaging electrode through a grid lead; The source electrode common packaging electrode is connected with the source electrode through a plurality of source electrode bonding wires, wherein at least part of bonding wire sections of the source electrode bonding wires are distributed around the grid electrode lead. Optionally, the power circuit includes a bridge inverter; The bridge inverter comprises at least one phase of bridge arm, wherein any phase of bridge arm comprises a plurality of power switch packaging structures, and all the power switch packaging structures comprise at least one upper bridge arm power switch packaging structure and at least one lower bridge arm power switch packaging structure. Optionally, the drains of the power switches of the upper bridge arm power switch packaging structure are electrically connected with an upper bridge arm drain common packaging electrode, the gate packaging electrodes of the upper bridge arm power switch packaging structure are shared as an upper bridge arm gate common packaging electrode, and the source common packaging electrodes of the upper bridge arm power switch packaging structure are shared as an upper bridge arm source common packaging electrode; The drain electrodes of the power switches of the lower bridge arm power switch packaging structure are electrically connected with the common packaging electrode of the drain electrode of the lower bridge arm, the grid packaging electrode of the lower bridge arm power switch packaging structure is shared as the common packaging electrode of the grid electrode of the lower bridge arm, the source common packaging electrode of the lower bridge arm power switch packaging structure is shared as the common packaging electrode of the source electrode of the lower bridge arm, and the upper bridge arm source common packaging electrode and the lower bridge arm drain common packaging electrode are shared as the common packaging electrode of the source and the drain. Optionally, the upper bridge arm drain electrode common packaging electrod