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CN-224218814-U - Bonding wire structure and packaging structure

CN224218814UCN 224218814 UCN224218814 UCN 224218814UCN-224218814-U

Abstract

The application provides a bonding wire structure and a packaging structure, wherein the bonding wire structure comprises a first welding spot part, a second welding spot part and a middle connecting section, two ends of the middle connecting section are respectively connected with the first welding spot part and the second welding spot part, the first welding spot part and the second welding spot part are made of a first conductive material, at least part of the middle connecting section is made of a second conductive material, and the first conductive material and the second conductive material are different. In the application, at least part of the material of the middle connecting section is different from the material of the first welding spot part and the second welding spot part, and the first welding spot part and the second welding spot part are closely related to welding quality, so that the materials with high price and good performance can be selected, the welding quality is ensured, the requirement of welding reliability is met, the influence of the middle connecting section on the welding quality is not great, and the materials with lower price and slightly lower performance can be selected, thereby ensuring the welding quality, simultaneously reducing the cost and meeting the production requirement of products.

Inventors

  • ZENG FUCHENG
  • QIAN XIAOMIN
  • JIE MIAOYE
  • LI JUNDONG

Assignees

  • 鸿利智汇集团股份有限公司

Dates

Publication Date
20260508
Application Date
20250430

Claims (10)

  1. 1. The bonding wire structure is characterized by comprising a first welding spot part (301), a second welding spot part (303) and an intermediate connecting section (302), wherein two ends of the intermediate connecting section (302) are respectively connected with the first welding spot part (301) and the second welding spot part (303); The first welding spot part (301) and the second welding spot part (303) are made of a first conductive material, at least part of the intermediate connecting section (302) is made of a second conductive material, and the first conductive material is different from the second conductive material.
  2. 2. The bonding wire structure of claim 1 wherein the oxidation resistance of the first conductive material is greater than the oxidation resistance of the second conductive material.
  3. 3. Bond wire structure according to claim 1 or 2, characterized in that the first solder joint portion (301) is a ball solder joint and the second solder joint portion (303) is a wedge solder joint.
  4. 4. A bond wire structure according to claim 3, characterized in that the intermediate connection section (302) comprises a wire arc transition section (322) and an annealing section (312) connected to each other, the annealing section (312) connecting the first solder joint portion (301), the wire arc transition section (322) connecting the second solder joint portion (303), the material of the annealing section (312) being a third conductive material, the material of at least part of the wire arc transition section (322) being the second conductive material, the third conductive material being different from the second conductive material.
  5. 5. The bonding wire structure of claim 4 wherein the oxidation resistance of the third conductive material is greater than the oxidation resistance of the second conductive material and/or the third conductive material is the same as the first conductive material.
  6. 6. The bonding wire structure according to claim 4, wherein the length of the annealing section (312) is 30-150 μm.
  7. 7. The bonding wire structure according to claim 1, wherein a ratio of a portion of the intermediate connection section (302) of the material of the second conductive material to a length of the intermediate connection section (302) is greater than or equal to 50%.
  8. 8. The bonding wire structure according to claim 1 or 2, wherein the first conductive material is gold and the second conductive material is at least one of gold alloy, silver, copper, iron, aluminum.
  9. 9. The bonding wire structure according to claim 1 or 2, wherein the first conductive material and the second conductive material are gold alloys, and a gold content in the first conductive material is greater than a gold content in the second conductive material.
  10. 10. A package structure comprising at least one pair of bonding pads, wherein the bonding wire structure of any one of claims 1 to 9 is soldered between each pair of bonding pads.

Description

Bonding wire structure and packaging structure Technical Field The application relates to the technical field of semiconductors, in particular to a bonding wire structure and a packaging structure. Background The bonding wire structure is an inner lead between the chip and the frame, is one of the basic structures of the integrated circuit package, and is increasingly required as the demands of society on the number and the quality of the integrated circuits are continuously improved. Conventional bonding wire structures typically employ a single material, such as gold, gold alloy, silver alloy, copper alloy, iron alloy, aluminum or aluminum alloy, which necessarily faces a cost and weld quality discrepancy. If the welding quality is to be ensured, materials with better performance are required, but the materials with better performance are usually high in price, and the cost can be reduced by adopting mixed materials or materials with poorer performance, but the welding quality is reduced, so that the reliability of the product is difficult to ensure. Therefore, the bonding wire structure made of a single material is difficult to combine cost performance and reliability. The bonding wire structure is mainly used for solving the electrical connection between the chip end and the frame end, the connection area between the bonding wire structure and the chip end and the frame end is closely related to the welding quality, and the technical problem to be solved at present is how to reduce the cost while guaranteeing the welding quality. Disclosure of utility model In view of the above, the embodiments of the present application are directed to providing a bonding wire structure and a packaging structure, so as to solve the problem that the welding quality and the welding cost cannot be considered in the prior art. The application provides a bonding wire structure, which comprises a first welding spot part, a second welding spot part and a middle connecting section, wherein two ends of the middle connecting section are respectively connected with the first welding spot part and the second welding spot part; the first welding spot part and the second welding spot part are made of a first conductive material, at least part of the middle connecting section is made of a second conductive material, and the first conductive material is different from the second conductive material. In some embodiments, the oxidation resistance of the first conductive material is greater than the oxidation resistance of the second conductive material. In some embodiments, the first weld portion is a ball weld and the second weld portion is a wedge weld. In some embodiments, the intermediate connection section includes a wire arc transition section and an annealing section connected to each other, the annealing section connecting the first solder joint portion, the wire arc transition section connecting the second solder joint portion, the material of the annealing section being a third conductive material, the material of at least part of the wire arc transition section being the second conductive material, the third conductive material being different from the second conductive material. In some embodiments, the oxidation resistance of the third conductive material is greater than the oxidation resistance of the second conductive material, and/or the third conductive material is the same as the first conductive material. In some embodiments, the length of the annealing section is 30 μm to 150 μm. In some embodiments, a ratio of a portion of the intermediate connection section where material is the second conductive material to a length of the intermediate connection section is greater than or equal to 50%. In some embodiments, the first conductive material is gold and the second conductive material is at least one of gold alloy, silver, copper, iron, aluminum. In some embodiments, the first conductive material and the second conductive material are gold alloys, and the gold content in the first conductive material is greater than the gold content in the second conductive material. The embodiment of the application also provides a packaging structure which comprises at least one pair of welding pads, wherein the bonding wire structure is welded between each pair of welding pads. The application provides a bonding wire structure and a packaging structure, wherein the bonding wire structure comprises a first welding spot part, a second welding spot part and a middle connecting section, two ends of the middle connecting section are respectively connected with the first welding spot part and the second welding spot part, the first welding spot part and the second welding spot part are made of a first conductive material, at least part of the middle connecting section is made of a second conductive material, and the first conductive material and the second conductive material are different. In the application, at least part of the material