CN-224218815-U - Liquid metal packaging structure

Abstract

The utility model discloses a liquid metal packaging structure which comprises a sealing frame and a heat dissipation piece, wherein the sealing frame comprises a frame, a first elastic sealing ring and a second elastic sealing ring, a containing area is arranged in the middle of the frame, a chip is arranged in the containing area, an annular groove is formed between the chip and the frame, the first elastic sealing ring is embedded at the bottom of the annular groove, the second elastic sealing ring is arranged around the periphery of the frame, the heat dissipation piece is covered on the end face of the frame and encloses a sealing space for filling liquid metal together with the chip, the first elastic sealing ring and the frame, and the frame comprises a plurality of holes and has compressibility. The liquid metal packaging structure of the utility model realizes efficient heat conduction and can reliably seal liquid metal under pressure.

Inventors

• LIAO ZHISHENG
• JIANG DONGYANG
• HUANG YONGLIANG

Assignees

• 东莞市兆科电子材料科技有限公司

Dates

Publication Date

20260508

Application Date

20250113

Claims (10)

1. 1. The utility model provides a liquid metal packaging structure for dispel the heat to the chip, its characterized in that, including sealing frame, radiating piece, sealing frame includes frame, first elastic sealing circle and second elastic sealing circle, the middle zone of frame has the holding district, the chip is arranged in the holding district, the chip with be formed with the ring channel between the frame, first elastic sealing circle set in the bottom of ring channel, the second elastic sealing circle encircle and locate the periphery of frame, the radiating piece lid locate the terminal surface of frame and with the chip first elastic sealing circle the frame encloses into a sealed space that is used for filling liquid metal jointly, the frame includes a plurality of holes just the frame has the compressibility.
2. 2. The liquid metal packaging structure of claim 1, wherein the first elastic sealing ring and the second elastic sealing ring are each independently made of a silicone, epoxy, polyurethane, rubber, or polyester resin material.
3. 3. The liquid metal packaging structure of claim 1, wherein the rim is made of porous silica gel, aerogel, polyurethane foam, or fiberglass material.
4. 4. The liquid metal package of claim 1, wherein the first elastomeric seal ring has a height that is lower than a height of the die.
5. 5. The liquid metal packaging structure of claim 4, wherein the height of the first elastic sealing ring is 1/4~3/4 of the height of the frame.
6. 6. The liquid metal packaging structure of claim 1, wherein the height of the second elastic sealing ring is not lower than the height of the frame.
7. 7. The liquid metal packaging structure of claim 1, wherein the opening ratio of the frame is 10-80%.
8. 8. The liquid metal packaging structure of claim 7, wherein the opening ratio of the frame is 40~60%。
9. 9. The liquid metal package of claim 1, wherein the cross-section of the hole in the rim has at least one of an oval shape and a polygonal shape.
10. 10. The liquid metal packaging structure of claim 1, wherein the height of the frame is 0.5-5.0 mm.

Description

Liquid metal packaging structure Technical Field The utility model belongs to the technical field of chip heat dissipation, and particularly relates to a liquid metal packaging structure. Background In electronic devices, heat dissipation problems of the chip are critical. With the development of semiconductor technology, chip integration and power density are increasing, resulting in a significant increase in heat generation. Therefore, efficient heat pipe understanding solutions are becoming increasingly important to ensure device performance and reliability. The heat conductive material serves as a key component for connecting the heating element (e.g., chip) and the heat sink (e.g., copper or aluminum heat sink, copper heat pipe, etc.), and plays an indispensable role in this process. Conventional heat conductive materials are generally composed of metal oxide mixed inorganic powders, which have good insulating properties to prevent short circuit risk, but have low heat conductivity due to the intrinsic characteristics of the materials, resulting in insufficient performance in efficient heat dissipation. On the other hand, liquid metal is an ideal heat conducting medium due to its high heat conductivity, however, it has a great limit in its application because of its electrical conductivity which may cause a short circuit problem. In order to solve the problem of short circuits that may be caused by liquid metal, various solutions have been proposed in the industry. For example, patent CN216749870U discloses a liquid metal encapsulation structure that uses a compressible organic polymer material (such as silica gel or rubber) to restrict the flow of liquid metal. However, in practical application, this design is easy to pack air into when pressurizing the upper and lower ends of the package structure, forming a large cavity, and this results in a significant increase in overall thermal resistance due to the fact that air is a poor conductor of heat, thereby greatly reducing heat conduction efficiency. In addition, taiwan patent TWM65102 proposes the use of a metal frame as a containment body, and although this approach takes advantage of the strength and stability of the metal, the lack of elasticity and compressibility, due to the greater rigidity of the metal material, results in poor sealing properties, and increases the risk of containment failure. Therefore, the existing methods face a plurality of limitations in practical application, including but not limited to the problems of low heat conduction efficiency, unstable sealing performance and the like, and cannot fully meet the requirements of efficient heat dissipation and reliable sealing. Therefore, a liquid metal packaging structure is needed to solve the problems of the prior art. Disclosure of utility model In view of the above, it is an object of the present utility model to provide a liquid metal packaging structure which can achieve efficient heat conduction and can reliably seal liquid metal even under pressure. In order to achieve the above object, the utility model provides a liquid metal packaging structure, which comprises a sealing frame and a heat dissipation piece, wherein the sealing frame comprises a frame, a first elastic sealing ring and a second elastic sealing ring, a containing area is arranged in the middle area of the frame, a chip is arranged in the containing area, an annular groove is formed between the chip and the frame, the first elastic sealing ring is embedded at the bottom of the annular groove, the second elastic sealing ring is arranged around the periphery of the frame, the heat dissipation piece is covered on the end face of the frame and encloses a sealing space for filling liquid metal together with the chip, the first elastic sealing ring and the frame, and the frame comprises a plurality of holes and has compressibility. Compared with the prior art, the frame comprises a plurality of holes, which provides a path for air to be discharged in the pressurizing process, and adds extra space to contain redundant liquid metal so as to prevent the redundant liquid metal from overflowing, and the frame is also provided with compressibility, can slightly deform when pressure is applied, is beneficial to thoroughly exhausting the internal air, ensures uniform distribution of the liquid metal, reduces the risk of forming a large cavity, and realizes efficient heat conduction. However, the inventors of the present utility model found in practical tests that although the holes in the frame help to absorb and store the liquid metal, under pressurized conditions, the liquid metal may leak out of the minute gap between the chip and the frame due to the uneven interface and the like. Based on the structure, the first elastic sealing ring is embedded at the bottom of the annular groove between the chip and the frame, and under pressurization, the sealing ring can be tightly attached to the bottom of the annular groove, so t