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CN-224218817-U - Packaging structure

CN224218817UCN 224218817 UCN224218817 UCN 224218817UCN-224218817-U

Abstract

The utility model provides a packaging structure which is applied to the technical field of semiconductor packaging. In the utility model, the wiring layer and the conductive structure are arranged on the surface and/or the inside of the substrate, so that the partition shielding and the double-sided packaging can be realized while the packaging structure is prevented from warping without arranging the ball and grinding, and the purposes of reducing the size of the packaging part, the packaging process and the packaging cost and realizing the thinning are achieved.

Inventors

  • WANG YUEHAI
  • Jiang Pinfang

Assignees

  • 唯捷创芯(天津)电子技术股份有限公司

Dates

Publication Date
20260508
Application Date
20250520

Claims (14)

  1. 1. A package structure, comprising: A first substrate including a first surface; a first wiring layer disposed on the first surface; the conductive structure is arranged on the first substrate to form a partition shielding structure; the first bonding pads are arranged on the first surface of the first substrate.
  2. 2. The package structure of claim 1, further comprising: a first groove provided in the first substrate from the first surface side; The first filter chip is arranged in the first groove and is provided with a first gap with the first substrate.
  3. 3. The package structure of claim 2, further comprising: And the first plastic sealing layer covers the side wall and the surface of the first filter chip and the surfaces of the first substrate on two sides of the first filter chip so as to encapsulate the first gap and the first groove, so that a sealed cavity is formed between the first filter chip and the first substrate.
  4. 4. The package structure of claim 3, wherein the conductive structure comprises: the plurality of conductive posts are arranged in the first substrate, and comprise a first end positioned on the first surface of the first substrate and a second end opposite to the first end, and the first end is electrically connected with the first bonding pad.
  5. 5. The package structure of claim 4, further comprising: And a second pad crossing over the plurality of first pads to electrically connect the plurality of first pads, the second pad having a width in a horizontal direction greater than a width of the first pad in the horizontal direction.
  6. 6. The package structure of claim 5, wherein the conductive structure further comprises: and the third bonding pad is arranged above the conductive columns in the first substrate and is electrically connected with the second ends of the conductive columns, and the width of the third bonding pad in the horizontal direction is larger than that of the first bonding pad in the horizontal direction and is the same as that of the second bonding pad in the horizontal direction.
  7. 7. The package structure of claim 3, further comprising: The first shielding wall is arranged on the outer surface of the first filter chip in a surrounding mode, extends to be arranged on the inner surface of the first groove on two sides of the first filter chip and part of the first surface, and is electrically connected with the plurality of first bonding pads; the conductive structure comprises: And the third bonding pad is arranged in the first substrate above the first groove and is electrically connected with the first shielding wall which is arranged on part of the inner surface of the first groove at two sides of the first filter chip in an extending way.
  8. 8. The package structure of claim 4 or 7, further comprising: A second substrate disposed opposite to the first substrate and including a second surface opposite to the first surface of the first substrate; A second wiring layer disposed on the second surface of the second substrate, electrically connected to the first wiring layer, and having a second gap with the first substrate; Wherein, the second base plate includes the PCB board.
  9. 9. The package structure of claim 3, wherein the first molding layer further extends laterally over the first wiring layer on the first substrate; the package structure further includes: the third wiring layer is arranged on part of the first plastic sealing layer; the conductive structure comprises: A plurality of conductive posts disposed within the first substrate, including a first end disposed on the first surface of the first substrate and a second end disposed opposite the first end, the first end being electrically connected to the first pad; And the third bonding pad is arranged on part of the first plastic sealing layer, penetrates through the first plastic sealing layer and is respectively and electrically connected with the plurality of first bonding pads, and the width of the third bonding pad in the horizontal direction is larger than that of the first bonding pad in the horizontal direction.
  10. 10. The package structure of claim 1, further comprising: A third substrate disposed opposite to the first substrate and including a third surface opposite to the first surface of the first substrate, and a second groove disposed in the third substrate from the third surface side; The second filter chip is arranged in the second groove, is flip-chip mounted on the first surface of the first substrate through a plurality of bumps, and has a gap with the first substrate and the third substrate; And a fourth wiring layer disposed on the third surface of the third substrate and electrically connected to the first wiring layer.
  11. 11. The package structure of claim 10, wherein the conductive structure comprises: the plurality of conductive posts are arranged in the first substrate, and comprise a first end positioned on the first surface of the first substrate and a second end opposite to the first end, and the first end is electrically connected with the first bonding pad.
  12. 12. The package structure of claim 11, further comprising: A second shielding wall surrounding the second filter chip and extending to be arranged on part of the third surface of the third substrate so as to be electrically connected with the plurality of first bonding pads; Wherein, the third base plate includes the PCB board.
  13. 13. The package structure of claim 12, wherein the second shielding wall is disposed on an inner surface of the second recess on both sides of the second filter chip and communicates with a portion extending over a portion of the third surface of the third substrate.
  14. 14. The package structure of claim 12, wherein the second shielding wall is disposed within the third substrate on both sides and below the second filter chip and communicates with a portion of the third surface extending over a portion of the third substrate.

Description

Packaging structure Technical Field The utility model relates to the technical field of communication, in particular to a packaging structure. Background With the rapid development of the semiconductor industry, fan-out wafer level package (FOWLP) package structures are widely used in the semiconductor industry. The fan out technology mainly realizes multi-pin output and smaller output pin spacing, and the traditional fan-out type packaging product structure mainly forms a packaging structure on the front side and the back side of the same substrate base plate, and because multiple packaging materials exist in the double-sided packaging structure formed on the substrate, materials of different packaging bodies are different in use, CTE coefficients among the materials are different, the product has a warping problem in the reliability process, and the delamination problem between a plastic packaging body and the chip surface and the delamination problem between the plastic packaging body and the substrate base plate are easily caused. In addition, the existing stacking mode not only ensures that the size of the packaging piece is larger, but also requires additional cleaning processes, such as soldering flux cleaning, plasma cleaning and the like, so that the preparation process is complex and the packaging cost is high. And, carry out plastic packaging on two sides of same substrate base plate, its substrate base plate wiring density is limited, can't realize higher density wiring demand. In addition, the existing double-sided packaging structure cannot realize the routing stacking of the chips on the same side in the placement direction, and the chip mounting mode and the wiring mode of the circuit layer are greatly limited. Disclosure of utility model The utility model aims to provide a packaging structure which is used for reducing the size of a packaging piece, reducing the packaging process and the risk of warping, reducing the packaging cost and finally realizing the thinning. In order to solve the above technical problems, the present utility model provides a packaging structure, including: A first substrate including a first surface; a first wiring layer disposed on the first surface; the conductive structure is arranged on the first substrate to form a partition shielding structure; the first bonding pads are arranged on the first surface of the first substrate. In some examples, the package structure may further include: the plurality of conductive posts are arranged in the first substrate, and comprise a first end penetrating through part of the first substrate and exposed out of the first surface, and a second end opposite to the first end, wherein the first end is electrically connected with the first bonding pad. In some examples, the package structure may further include: a first groove provided in the first substrate from the first surface side; The first filter chip is arranged in the first groove and is provided with a first gap with the first substrate. In some examples, the package structure may further include: And the first plastic sealing layer covers the side wall and the surface of the first filter chip and the surfaces of the first substrate on two sides of the first filter chip so as to encapsulate the first gap and the first groove, so that a sealed cavity is formed between the first filter chip and the first substrate. In some examples, the package structure may further include: the plurality of conductive posts are arranged in the first substrate, and comprise a first end positioned on the first surface of the first substrate and a second end opposite to the first end, and the first end is electrically connected with the first bonding pad. In some examples, the package structure may further include: And a second pad crossing over the plurality of first pads to electrically connect the plurality of first pads, the second pad having a width in a horizontal direction greater than a width of the first pad in the horizontal direction. In some examples, the package structure may further include: and the third bonding pad is arranged above the conductive columns in the first substrate and is electrically connected with the second ends of the conductive columns, and the width of the third bonding pad in the horizontal direction is larger than that of the first bonding pad in the horizontal direction and is the same as that of the second bonding pad in the horizontal direction. In some examples, the package structure may further include: The first shielding wall is arranged on the outer surface of the first filter chip in a surrounding mode, extends to be arranged on the inner surface of the first groove on two sides of the first filter chip and part of the first surface, and is electrically connected with the plurality of first bonding pads; the conductive structure comprises: And the third bonding pad is arranged in the first substrate above the first groove and is electrically conne