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CN-224218819-U - Housing unit and semiconductor power module

CN224218819UCN 224218819 UCN224218819 UCN 224218819UCN-224218819-U

Abstract

A housing unit (2) for a semiconductor power module (1) comprises a molded body (3) configured to enclose electrical components of the semiconductor power module (1). The housing unit (2) further comprises at least one terminal (10) integrated and at least partially embedded in the molded body (3) such that the at least one terminal (10) extends through the molded body (3) and an end (11) of the at least one terminal (10) is exposed at the upper surface (6) of the molded body (3) with respect to the stacking direction (a) of the semiconductor power module (1). The at least one terminal (10) further comprises at least one sealing structure (13, 14) arranged in the boundary region (5) between the exposed end (11) and the molded edge (4) of the molded body (3), the sealing structure (13, 14) being configured to limit an upper extension of the molded body (3) during formation of the molded body.

Inventors

  • D - Geelong
  • R. Ebar

Assignees

  • 日立能源有限公司

Dates

Publication Date
20260508
Application Date
20220628

Claims (11)

  1. 1. A housing unit (2) for a semiconductor power module (1), characterized by comprising: -a molded body (3) configured to enclose electrical components of the semiconductor power module (1), and -At least one terminal (10) integrated and partly embedded in the molded body (3) such that the at least one terminal (10) extends through the molded body (3) and an end (11) of the at least one terminal (10) is exposed at an upper surface (6) of the molded body (3) with respect to a stacking direction (a) of the semiconductor power module (1), wherein the at least one terminal (10) further comprises at least one sealing structure (13, 14) arranged in a boundary area (5) between the exposed end (11) and a molded edge (4) of the molded body (3), the sealing structure (13, 14) being configured to limit an upper extension of the molded body (3), wherein the sealing structure comprises at least one recess (13) formed on an outer surface (15) of the at least one terminal, and wherein the at least one recess (13) comprises a height (H) having a value of 0.1-2. mm and/or a depth (860) of each of the sealing structure (530) and a depth (860) having a value of 530.5-5) and a corresponding to the depth (860.64) and the depth (530) from the respective depth (5) is/is defined by the sealing structure (5) and the depth (530) is defined by the depth (530) and the depth (530) is defined by the depth) and the depth (5) is defined by the depth and the depth, 14 For adjacent outer surfaces (15).
  2. 2. The housing unit (2) according to claim 1, wherein the sealing structure (13, 14) is formed on an outer surface (15) of the at least one terminal (10) such that it partially or completely encloses the terminal (10) with respect to a lateral direction (B, C) perpendicular to the stacking direction (a).
  3. 3. The housing unit (2) according to claim 1 or 2, characterized in that the molding edge (4) of the molded body (3) extends into the at least one recess (13).
  4. 4. The housing unit (2) according to claim 1 or 2, wherein the sealing structure comprises at least one protrusion (14) formed on an outer surface (15) of the at least one terminal (10).
  5. 5. The housing unit (2) according to claim 4, wherein the at least one protrusion (14) limits an upper extension of the molding edge (4) of the molded body (3) with respect to the stacking direction (a).
  6. 6. The housing unit (2) according to claim 1 or 2, wherein the at least one terminal (10) comprises two or more sealing structures (13, 14) formed in a boundary region (5) between the exposed end (11) and the molded edge (4) of the molded body (3), wherein each of the sealing structures (13, 14) comprises at least one of a recess (13) and a protrusion formed on an outer surface (15) of the at least one terminal (10).
  7. 7. The housing unit (2) according to claim 1 or 2, wherein the sealing structure (13, 14) is integrally formed with the terminal (10).
  8. 8. The housing unit (2) according to claim 1 or 2, wherein the sealing structure (13, 14) forms at least one of a square, rectangular, trapezoidal, semicircular and triangular shape with respect to a cross section along the stacking direction (a).
  9. 9. The housing unit (2) according to claim 1 or 2, wherein the at least one terminal (10) is formed solid or hollow and comprises an elongated shaft (12) with respect to the stacking direction (a), the elongated shaft having at least one of a cylindrical, cuboid and ellipsoid shape.
  10. 10. A semiconductor power module (1), characterized by comprising: -a housing unit (2) according to any of the preceding claims, and -Electrical components arranged inside the housing unit (2).
  11. 11. The semiconductor power module (1) according to claim 10, comprising: an insulating substrate having an insulating sheet made of a ceramic material and at least one metallization layer, wherein the insulating substrate is electrically coupled to the housing unit (2) by means of the at least one terminal (10).

Description

Housing unit and semiconductor power module Technical Field The present disclosure relates to a housing unit for a semiconductor power module and a method for manufacturing a corresponding housing unit. The disclosure further relates to a semiconductor power module comprising such a housing unit. Background Conventional power modules form power semiconductor packaging technology and generally include a housing and electrical components assembled therein. Providing a stable housing that facilitates reliable operation of the power module is a challenge. Disclosure of utility model Embodiments of the present disclosure may provide a housing unit for a semiconductor power module that is capable of stable operation for high voltage power module applications and that may be reliably manufactured. Further embodiments of the present disclosure may provide a semiconductor power module and a method of manufacturing a housing unit for a semiconductor power module. According to one embodiment, a housing unit for a semiconductor power module includes a molded body configured to enclose electronic and/or electrical components of the semiconductor power module. The housing unit further includes at least one terminal integrated and at least partially embedded in the molded body such that the at least one terminal extends through the molded body. The end portion of at least one terminal forms an uppermost portion of the terminal and is at least partially exposed at an upper surface of the molded body with respect to a stacking direction of the semiconductor power module. The at least one terminal further includes at least one sealing structure disposed in a boundary region between the exposed end and the molded edge of the molded body. The sealing structure is configured to limit extension of an upper portion of the molded body during formation of the molded body by molding. Due to the described configuration of the housing unit, one or more terminals extending through the molded body are securely sealed and may provide a reliable electrical connection with other components of the semiconductor power module. Thus, the housing unit counteracts unwanted leakage of molding material into the areas of the respective ends of the corresponding terminals and thus facilitates reliable operation of the semiconductor power module for low, medium and even high voltage power module applications and large modules. The described configuration and the uncontaminated upper end allow reliable electrical contact with external bus bars or signal connections. The ends of the respective terminals may be formed as nuts of the terminals. The specific sealing structure attached to the terminal enables reliable sealing even for vertically arranged terminals (e.g., having a circular or square shape). In this regard, terms such as "vertical," "upper," or "lower" refer to the alignment or orientation of elements that is expected under normal operating conditions of a semiconductor power module. Thus, the stacking direction may also be referred to as a vertical direction, and the corresponding lateral direction may also be referred to as a horizontal direction and generally spans the main expansion plane. According to one embodiment, the sealing structure is formed on the outer surface of the at least one terminal such that it partially or completely encloses the terminal with respect to a lateral or radial direction perpendicular to the stacking direction. The terminal may have a terminal leg and an elongated terminal shaft or body with an upper end forming an end of the terminal. The terminal shaft extends through the molded body and may have a different shape, such as a circle, rectangle, oval, or any other shape with respect to a cross-section along a lateral direction. Inside the housing, the corresponding terminals may have another or arbitrary shape. Accordingly, at least one terminal may be formed to include a cylindrical body, a rectangular body, and an ellipsoidal body shape. At least one terminal may be further formed to be solid or hollow and have a tubular shape. The sealing structure forms a restriction to the molding substance of the molding body and may be formed sectionally or as a closed ring around the terminal shaft. Alternatively or additionally, the sealing structure may be formed helically around the terminal shaft. For example, one or more of the terminals may have a plurality of loops. According to one embodiment, the sealing structure comprises at least one recess formed on an outer surface of the at least one terminal. The recesses may be formed such that the molding edge of the molded body extends into at least one recess. The molded edge may realize a locally uppermost portion of the molded body proximate to the terminal. Thus, the recess may form a given recess for absorbing and containing the molding substance when interacting with the corresponding molding tool, to prevent unwanted exudation into the region of the end. Al