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CN-224222129-U - Cleaning equipment

CN224222129UCN 224222129 UCN224222129 UCN 224222129UCN-224222129-U

Abstract

The application discloses a cleaning device, which comprises a first cleaning component and a second cleaning component. The first cleaning assembly comprises a cleaning mechanism and a driving piece, wherein the cleaning mechanism is used for cleaning a wafer, and the driving piece is used for driving the cleaning mechanism to move. The second cleaning component comprises a cleaning tank and a spraying part, the spraying part is used for cleaning the cleaning mechanism, the spraying part is at least partially positioned in the cleaning tank, the driving part can drive the cleaning mechanism to be positioned at a cleaning position, and when the cleaning mechanism is positioned at the cleaning position, the cleaning mechanism is at least partially positioned in the cleaning tank. Through the arrangement, the cleaning mechanism cleans the wafer, when the cleaning mechanism cannot effectively clean the wafer, the driving piece drives the cleaning mechanism into the cleaning tank, so that the spray cleaning piece cleans the cleaning mechanism, and pollutants on the cleaning mechanism are removed, so that the wafer cleaning effect of the cleaning mechanism is improved.

Inventors

  • XIE LONGHUI
  • ZHANG HANGJUN
  • PU TAO
  • WANG KAI
  • ZHAO QI
  • FAN GUOSHUAI
  • XIA XILIN
  • CHAI HONGLU

Assignees

  • 浙江求是半导体设备有限公司
  • 浙江晶盛机电股份有限公司

Dates

Publication Date
20260512
Application Date
20250324

Claims (10)

  1. 1. A cleaning apparatus (100) for cleaning a wafer, the cleaning apparatus (100) comprising: a first cleaning assembly (11), the first cleaning assembly (11) comprising a cleaning mechanism (111) for cleaning a wafer and a driving member (112) for driving the cleaning mechanism (111) to move; -a second washing assembly (12), the second washing assembly (12) comprising a washing tank (121) and a spray (122) for washing the washing mechanism (111), the spray (122) being at least partially located within the washing tank (121); the driving piece (112) can drive the cleaning mechanism (111) to be in a cleaning position, and when the cleaning mechanism (111) is in the cleaning position, the cleaning mechanism (111) is at least partially positioned in the cleaning tank (121).
  2. 2. The cleaning apparatus (100) of claim 1, wherein, The second cleaning assembly (12) comprises a cover plate (123), and the cover plate (123) is movably connected with the cleaning tank (121); The cover plate (123) comprises a closing position for closing the cleaning tank (121) and a waiting position for opening the cleaning tank (121), when the cover plate (123) is in the waiting position, the driving piece (112) drives the cleaning mechanism (111) to be in the cleaning position, and when the cover plate (123) is in the closing position, the spraying piece (122) cleans the cleaning mechanism (111).
  3. 3. The cleaning apparatus (100) of claim 2, wherein, The second cleaning assembly (12) comprises a swinging piece (124) for driving the cover plate (123) to move, and the swinging piece (124) is connected with the cover plate (123).
  4. 4. A cleaning apparatus (100) according to any one of claims 1 to 3, wherein the second cleaning assembly (12) comprises a turbidity meter (125), the turbidity meter (125) being connected to the cleaning tank (121) for detecting the cleaning liquid discharged from the cleaning tank (121).
  5. 5. A cleaning apparatus (100) according to any one of claims 1 to 3, wherein the cleaning mechanism (111) comprises an upper cleaning member (1111) and a lower cleaning member (1112), the first cleaning assembly (11) comprises a support member (113), the upper cleaning member (1111) and the lower cleaning member (1112) are each rotatably connected to the support member (113), and a cleaning gap (1113) for cleaning a wafer is formed between the upper cleaning member (1111) and the lower cleaning member (1112).
  6. 6. The cleaning apparatus (100) of claim 5, wherein, Two spraying pieces (122) are arranged, and the two spraying pieces (122) respectively clean the upper cleaning piece (1111) and the lower cleaning piece (1112); The second cleaning assembly (12) further comprises a partition (126), the partition (126) divides the cleaning tank (121) into a first cleaning space (1211) and a second cleaning space (1212), the two spraying cleaning pieces (122) are respectively located in the first cleaning space (1211) and the second cleaning space (1212), when the cleaning mechanism (111) is located at the cleaning position, the upper cleaning piece (1111) is located in the first cleaning space (1211), and the lower cleaning piece (1112) is located in the second cleaning space (1212).
  7. 7. The cleaning apparatus (100) of claim 5, wherein, The first cleaning assembly (11) comprises a lifting part (114) and a rotating part (115), wherein the lifting part (114) and the rotating part (115) are both installed on the supporting part (113), the lifting part (114) is provided with two lifting parts (114) respectively drive the upper cleaning part (1111) and the lower cleaning part (1112) to lift, the rotating part (115) is provided with two rotating parts (115) respectively drive the upper cleaning part (1111) and the lower cleaning part (1112) to rotate.
  8. 8. The cleaning apparatus (100) of claim 5, wherein, The cleaning device (100) comprises a base (13), the second cleaning assembly (12) and the driving piece (112) are both installed on the base (13), and the driving piece (112) is connected with the supporting piece (113) and drives the supporting piece (113) to move.
  9. 9. The cleaning apparatus (100) of claim 8, wherein, The cleaning device (100) further comprises a shielding cover (14), the shielding cover (14) is mounted on the base (13), an accommodating space is formed in the shielding cover (14), and the first cleaning assembly (11) and the second cleaning assembly (12) are both located in the accommodating space.
  10. 10. A cleaning apparatus (100) according to any one of claims 1 to 3, characterized in that the cleaning apparatus (100) comprises a support assembly (15) for supporting a wafer, the support assembly (15) comprising a first support (151) and a second support (152), at least one of the first support (151) and the second support (152) having a degree of freedom of movement such that a distance between the first support (151) and the second support (152) is adjustable, a support space for supporting a wafer being formed between the first support (151) and the second support (152); The support assembly (15) further comprises a plurality of rotating members (153) rotatably connected to the first support member (151) and the second support member (152), wherein the rotating members (153) have a rotational degree of freedom, and the rotating members (153) can contact with a wafer and drive the wafer to rotate; The driving piece (112) can drive the cleaning mechanism (111) to be in a working position, when the cleaning mechanism (111) is in the working position, the cleaning mechanism (111) is located between the first supporting piece and the second supporting piece, and the driving piece (112) can drive the cleaning mechanism (111) to swing.

Description

Cleaning equipment Technical Field The application relates to the technical field of wafer production equipment, in particular to cleaning equipment. Background Wafer cleaning is an important link in wafer production, and in the existing wafer cleaning equipment, a sponge brush head is generally used to match with various medicaments to clean pollutants on the surface of a wafer. However, the sponge brush head can accumulate pollutants after long-term use, so that the wafer cleaning effect is reduced. Therefore, how to remove the contaminants on the sponge brush head and thereby improve the wafer cleaning effect of the cleaning device is a technical problem that needs to be solved in the art. Disclosure of utility model In order to solve the defects in the prior art, the application aims to provide cleaning equipment capable of improving the cleaning effect of wafers. In order to achieve the above purpose, the present application adopts the following technical scheme: A cleaning apparatus for cleaning a wafer includes a first cleaning assembly and a second cleaning assembly. The first cleaning component comprises a cleaning mechanism and a driving piece, the cleaning mechanism is used for cleaning a wafer, the driving piece drives the cleaning mechanism to move, the second cleaning component comprises a cleaning tank and a spraying piece, the spraying piece is used for cleaning the cleaning mechanism, the spraying piece is at least partially located in the cleaning tank, the driving piece can drive the cleaning mechanism to be located at a cleaning position, and when the cleaning mechanism is located at the cleaning position, the cleaning mechanism is at least partially located in the cleaning tank. The second cleaning component comprises a cover plate, the cover plate is movably connected with the cleaning tank, the cover plate comprises a closing position for closing the cleaning tank and a waiting position for opening the cleaning tank, when the cover plate is in the waiting position, the driving piece drives the cleaning mechanism to be in the cleaning position, and when the cover plate is in the closing position, the spraying piece cleans the cleaning mechanism. Further, the second cleaning assembly comprises a swinging piece for driving the cover plate to move, and the swinging piece is connected with the cover plate. Further, the second cleaning assembly comprises a turbidity meter which is connected with the cleaning tank and is used for detecting the cleaning liquid discharged from the cleaning tank. Further, the cleaning mechanism comprises an upper cleaning piece and a lower cleaning piece, the first cleaning assembly comprises a supporting piece, the upper cleaning piece and the lower cleaning piece are both rotationally connected with the supporting piece, and a cleaning gap for cleaning the wafer is formed between the upper cleaning piece and the lower cleaning piece. Further, two spray cleaning pieces are provided, and the two spray cleaning pieces respectively clean the upper cleaning piece and the lower cleaning piece. The second cleaning assembly further comprises a separating piece, the separating piece separates the cleaning tank into a first cleaning space and a second cleaning space, the two spraying cleaning pieces are respectively located in the first cleaning space and the second cleaning space, when the cleaning mechanism is located at the cleaning position, the upper cleaning piece is located in the first cleaning space, and the lower cleaning piece is located in the second cleaning space. Further, the first cleaning assembly comprises a lifting piece and a rotating piece, the lifting piece and the rotating piece are both arranged on the supporting piece, the lifting piece is provided with two lifting pieces, the two lifting pieces respectively drive the upper cleaning piece and the lower cleaning piece to lift, the rotating piece is provided with two, and the two rotating pieces respectively drive the upper cleaning piece and the lower cleaning piece to rotate. Further, the cleaning device comprises a base, the second cleaning assembly and the driving piece are both arranged on the base, and the driving piece is connected with the supporting piece and drives the supporting piece to move. Further, the cleaning device further comprises a shielding cover, the shielding cover is installed on the base, an accommodating space is formed in the shielding cover, and the first cleaning assembly and the second cleaning assembly are located in the accommodating space. Further, the cleaning device comprises a supporting component and a driving component, wherein the supporting component is used for supporting a wafer and comprises a first supporting piece, a second supporting piece and a plurality of rotating pieces, at least one of the first supporting piece and the second supporting piece is provided with a moving freedom degree, so that the distance between the first supporting piece and t