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CN-224222139-U - Semiconductor wafer cleaning device

CN224222139UCN 224222139 UCN224222139 UCN 224222139UCN-224222139-U

Abstract

The utility model discloses a semiconductor wafer cleaning device, which relates to the technical field of semiconductor processes and comprises a cleaning box, wherein a drain pipe is fixedly connected to the lower surface of the upper part of the cleaning box, an operation panel is fixedly connected to the front surface of the upper part of the cleaning box, a cleaning assembly is fixedly connected to the inner cavity of the upper part of the cleaning box, and a supporting and fixing assembly is lapped on the lower surface of the middle part of the cleaning assembly. According to the semiconductor wafer cleaning device, the connecting blocks and the supporting frames can move upwards under the action of the guide rods and the U-shaped connecting plates through the action of the hydraulic rods, so that the upper surface of the supporting frames are overlapped with the lower surface of the fixed shell, a plurality of semiconductor wafers are positioned between the fixed shell and the supporting frames at the moment, feeding and discharging are facilitated, and the supporting frames cannot collide with the lower surface of the fixed shell when moving upwards through the action of the rubber pads, so that the protection effect is achieved.

Inventors

  • KANG QINGHAI
  • XIAO LIJUN

Assignees

  • 深圳市联合睿智电子有限公司

Dates

Publication Date
20260512
Application Date
20250417

Claims (6)

  1. 1. The semiconductor wafer cleaning device comprises a cleaning box (1) and is characterized in that a drain pipe (5) is fixedly connected to the lower surface of the upper part of the cleaning box (1), an operation panel (2) is fixedly connected to the front surface of the upper part of the cleaning box (1), a cleaning assembly (3) is fixedly connected to an inner cavity of the upper part of the cleaning box (1), a supporting and fixing assembly (4) is lapped on the lower surface of the middle part of the cleaning assembly (3), and the left side and the right side of the supporting and fixing assembly (4) are fixedly connected with the inner cavity of the cleaning box (1); The supporting and fixing assembly (4) comprises a hydraulic rod (41), the outer wall of the upper part of the hydraulic rod (41) is fixedly connected with the inner cavity of the cleaning box (1), the output end of the hydraulic rod (41) is fixedly connected with a connecting block (42), and the front of the connecting block (42) is fixedly connected with a supporting frame (43); the cleaning assembly (3) comprises a fixing shell (32), the left side and the right side of the fixing shell (32) are fixedly connected with an inner cavity of the cleaning box (1), the upper surface of the fixing shell (32) is fixedly connected with a cleaning liquid box (31) and the fixing shell (32) are positioned in front of a hydraulic rod (41), the lower surface of the fixing shell (32) is overlapped with the upper surface of a supporting frame (43), the left side and the right side of the cleaning liquid box (31) are fixedly connected with a water pump (33), two opposite sides of the water pump (33) are fixedly connected with a first conveying pipeline (34), and the outer wall of the lower part of the first conveying pipeline (34) is fixedly connected with the inner cavity of the fixing shell (32).
  2. 2. The semiconductor wafer cleaning device according to claim 1, wherein the lower surface of the first conveying pipeline (34) is fixedly connected with a second conveying pipeline (35), and the left side and the right side of the outer wall of the second conveying pipeline (35) are fixedly connected with a plurality of spray heads (36).
  3. 3. The semiconductor wafer cleaning device according to claim 1, wherein the lower surface of the supporting frame (43) is fixedly connected with a liquid discharge pipe (44), the inner cavities of the left and right parts of the supporting frame (43) are respectively and slidably connected with two guide rods (45), the upper side and the lower side of each guide rod (45) are fixedly connected with two U-shaped connecting plates (46), the two U-shaped connecting plates (46) are positioned on the left side and the right side of the supporting frame (43), and the opposite surfaces of the two U-shaped connecting plates (46) are respectively and fixedly connected with the inner cavity of the cleaning box (1).
  4. 4. The semiconductor wafer cleaning device according to claim 3, wherein the inner wall of the upper portion of the supporting frame (43) is fixedly connected with a semicircular limiting frame (47), the inner wall of the semicircular limiting frame (47) is fixedly connected with a plurality of net plates (471), a plurality of water outlets (472) are formed in the lower surface of the semicircular limiting frame (47), and the water outlets (472) are respectively located below the net plates (471).
  5. 5. The semiconductor wafer cleaning device according to claim 2, wherein the lower parts of the outer walls of the second conveying pipelines (35) are movably sleeved with the inner walls of the mesh plates (471), and rubber pads are fixedly connected to the lower surfaces of the front and rear parts of the fixed shell (32).
  6. 6. The semiconductor wafer cleaning device according to claim 5, wherein the motor (37) is fixedly connected to the inner cavity of the left portion of the fixed shell (32), the first gear (38) is fixedly connected to the output end of the motor (37), the second gears (39) are meshed to the front side and the rear side of the outer wall of the first gear (38), the driving rollers (310) are fixedly connected to the right sides of the two second gears (39), the two driving rollers (310) are located on the front side and the rear side of the first conveying pipeline (34), and the outer walls of the left portion and the right portion of the two driving rollers (310) are respectively connected with the inner cavity in the middle of the fixed shell (32) in a rotating mode.

Description

Semiconductor wafer cleaning device Technical Field The utility model relates to the technical field of semiconductor processes, in particular to a semiconductor wafer cleaning device. Background Wafer cleaning can be classified into wet cleaning and dry cleaning. Dry cleaning uses gas phase chemicals, typically to facilitate the empirical cleaning by providing excitation energy, which may be provided in the form of heat, plasma, or radiation, to facilitate the chemical reaction. Conventional wet cleaning uses liquid chemicals such as solvents, acids, surfactants, and water to spray, brush, oxidize, etch, etc. the solvent contaminants. Wet cleaning with ultra-high purity water is also often required after use of various chemicals. Chinese patent document CN210837668U discloses a semiconductor wafer cleaning device, which belongs to the field of semiconductor technology. The utility model provides a semiconductor wafer cleaning device for solving the problem that the cleaning is not thorough due to shielding at a wafer bearing mechanism, which comprises a cleaning device and a wafer placing device, wherein the wafer placing device comprises a limiting frame, a driving roller and a driving device, the driving roller is arranged below the limiting frame, and the driving device is arranged at one end of the driving roller; the device can enable the cleaned wafer to rotate when the wafer is cleaned, so that the situation that the wafer is shielded by the bearing mechanism is guaranteed, and the whole wafer is completely cleaned. The following problems exist in the prior art: The semiconductor wafer cleaning device is inconvenient to put into the cleaning assembly when in use, so that the use inconvenience is caused, the semiconductor wafer cleaning device cannot well perform dead angle-free cleaning operation on the semiconductor wafer when in use, and cleaning liquid can splash to the inner wall of the box when in cleaning, so that the cleaning by staff is required, and the workload is increased. Disclosure of utility model The present utility model provides a semiconductor wafer cleaning apparatus to solve the above-mentioned problems in the prior art. In order to solve the technical problems, the utility model adopts the following technical scheme: The utility model provides a semiconductor wafer belt cleaning device, includes washs the case, the lower fixed surface who washs case upper portion is connected with the drain pipe, the preceding fixedly connected with operating panel of washs case upper portion, the inner chamber fixedly connected with who washs case upper portion washs the subassembly, the lower surface overlap joint at subassembly middle part has the support fixed subassembly, the left and right sides of support fixed subassembly and the inner chamber fixed connection who washs the case. Preferably, the support fixing assembly comprises a hydraulic rod, the outer wall of the upper part of the hydraulic rod is fixedly connected with the inner cavity of the cleaning box, the output end of the hydraulic rod is fixedly connected with a connecting block, and the front of the connecting block is fixedly connected with a supporting frame. Preferably, the cleaning assembly comprises a fixing shell, the left side and the right side of the fixing shell are fixedly connected with an inner cavity of the cleaning box, the upper surface of the fixing shell is fixedly connected with a cleaning liquid box, the cleaning liquid box and the fixing shell are positioned in front of a hydraulic rod, the lower surface of the fixing shell is overlapped with the upper surface of the supporting frame, the left side and the right side of the cleaning liquid box are fixedly connected with water pumps, the two opposite sides of the water pumps are fixedly connected with a first conveying pipeline, and the outer wall of a lower portion of the conveying pipeline is fixedly connected with the inner cavity of the fixing shell. Preferably, the lower surface of the first conveying pipeline is fixedly connected with a plurality of second conveying pipelines, and a plurality of spray heads are fixedly connected to the left side and the right side of the outer wall of the second conveying pipeline. Preferably, the lower surface fixedly connected with fluid-discharge tube of support frame, the inner chamber of the left and right parts of support frame is all sliding connection has two guide arms, four the upper and lower both sides fixedly connected with two U type connecting plates of guide arm and two U type connecting plates are located the left and right sides of support frame, two the opposite face of U type connecting plate respectively with the inner chamber fixed connection of wasing the case. Preferably, the inner wall of support frame upper portion fixedly connected with semi-circular spacing, the inner wall fixedly connected with of semi-circular spacing a plurality of otter boards, a plurality of outlet openings have bee