CN-224222565-U - Semiconductor high-speed rib cutting forming equipment

Abstract

The utility model relates to the technical field of semiconductor chip production, in particular to a semiconductor high-speed rib cutting forming device, which comprises a machine shell, wherein an organic large plate is fixedly connected to the rear side of an inner cavity of the machine shell, a feeding large plate is fixedly connected to the front side of the machine large plate, a tablet gripper is arranged at the top of the feeding large plate, a feeding track is arranged on the left side of the top of the feeding large plate, two tablet clips are fixedly connected to the bottom of the feeding large plate, and two ejection motors are fixedly connected to the rear side of the bottom of the feeding large plate. The automatic feeding device has the advantages of high automation degree, accurate feeding and compact structure, and can automatically operate in the whole process from feeding of the tablet cartridge clip, tablet grabbing, feeding of the feeding track, stepping feeding to punching forming and separation of products and waste materials in the actual use process, so that manual intervention is reduced, production efficiency is improved, labor cost is reduced, and errors possibly caused by manual operation are avoided.

Inventors

• WANG JIAN
• TENG ZIHAO

Assignees

• 深圳市胜和精密模具有限公司

Dates

Publication Date

20260512

Application Date

20250613

Claims (5)

1. 1. The high-speed rib cutting forming equipment for semiconductors comprises a machine shell (1) and is characterized in that a large machine table plate (2) is fixedly connected to the rear side of an inner cavity of the machine shell (1), a large feeding plate (3) is fixedly connected to the front side of the large machine table plate (2), a tablet gripper (4) is arranged at the top of the large feeding plate (3), a feeding track (5) is arranged on the left side of the top of the large feeding plate (3), two tablet clips (6) are fixedly connected to the bottom of the large feeding plate (3), two ejection motors (7) are fixedly connected to the rear side of the bottom of the large feeding plate (3), rib cutting forming dies (8) are fixedly connected to the top of the large machine table plate (2), two support columns (9) are fixedly connected to the left side of the top of the large machine table plate (2), a machine head (10) is fixedly connected to the top of the two support columns (9), a placing frame (11) is fixedly connected to the bottom of the large machine table plate (2), and a punching box (12) is connected to the inner cavity of the placing frame (11).
2. 2. The high-speed rib cutting molding device for semiconductors according to claim 1, wherein a box door (13) is rotatably connected to the front surface of the machine shell (1), and a handle (14) is fixedly connected to the front surface of the box door (13).
3. 3. The high-speed rib cutting and forming device for semiconductors, according to claim 1, is characterized in that a through hole (15) is formed in the bottom of the front surface of the shell (1), and a fan (16) is fixedly connected to the inner cavity of the through hole (15).
4. 4. The high-speed rib cutting and forming device for semiconductors according to claim 1, wherein four corners of the bottom of the shell (1) are fixedly connected with supporting legs (17), and the four supporting legs (17) are symmetrically arranged.
5. 5. The high-speed rib cutting and forming device for semiconductors according to claim 1, wherein four corners of the bottom of the shell (1) are fixedly connected with universal wheels (18), and the number of the universal wheels (18) is four.

Description

Semiconductor high-speed rib cutting forming equipment Technical Field The utility model relates to the technical field of semiconductor chip production, in particular to a semiconductor high-speed rib cutting and forming device. Background The semiconductor is a substance with specific electrical characteristics, the conductivity of the substance is between a conductor and an insulator, the substance is an essential basic material of electronic equipment, the conductivity of the semiconductor can be controlled by applying external conditions such as current, voltage or illumination, the characteristics enable the semiconductor to play a key role in the electronic equipment, trace impurities are doped in a pure semiconductor material, the conductivity of the semiconductor can be obviously changed, and various semiconductor devices with different purposes can be manufactured by utilizing the characteristics. In the existing production process, many links still highly depend on manual operation, such as tablet feeding, feeding parameter adjustment and other links, manual operation has natural limitation, the speed is relatively slow, long-time repeated operation is extremely easy to cause fatigue, and further operation errors are frequently caused, so that the production efficiency is greatly reduced, the severe requirements of large-scale production on high-efficiency output are difficult to meet, meanwhile, in the material conveying link, the feeding position and speed of the tablet are difficult to accurately control in the prior art, the control precision is lost, so that the tablet is extremely easy to generate position deviation when conveyed to a processing position, once the tablet position is deviated, the processing precision is inevitably influenced, finally, the reject ratio of products is obviously increased, in addition, the structural layout of the existing equipment lacks compactness, the matching between components is not tight and orderly, the whole occupied area of the equipment is excessively large, the installation and the use of the equipment are extremely limited in the limited space of a production workshop, the difficulty of the layout is not only increased, and the smoothness and the high efficiency of the whole production process can be possibly influenced. Disclosure of utility model The utility model aims to provide a semiconductor high-speed rib cutting forming device, which has the advantages of high automation degree, accurate feeding and compact structure, and solves the problems of the prior art. The technical scheme includes that the semiconductor high-speed rib cutting forming device comprises a machine shell, wherein a large machine table plate is fixedly connected to the rear side of an inner cavity of the machine shell, a large feeding plate is fixedly connected to the front side of the large machine table plate, a tablet gripper is arranged at the top of the large feeding plate, a feeding track is arranged on the left side of the top of the large feeding plate, two tablet clips are fixedly connected to the bottom of the large feeding plate, two material ejection motors are fixedly connected to the rear side of the bottom of the large feeding plate, a rib cutting forming die is fixedly connected to the top of the large machine table plate, two support columns are fixedly connected to the left side of the top of the large machine table plate, a punching machine head is fixedly connected to the top of the two support columns, a placing frame is fixedly connected to the bottom of the large machine table plate, and a material receiving box is slidingly connected to the inner cavity of the placing frame. Further, as a preferable mode of the utility model, the front surface of the casing is rotatably connected with a box door, and the front surface of the box door is fixedly connected with a handle. Further, as one preferable mode of the utility model, a through hole is formed in the bottom of the front surface of the casing, and a fan is fixedly connected to an inner cavity of the through hole. Furthermore, as one preferable mode of the utility model, four corners of the bottom of the shell are fixedly connected with supporting legs, and the four supporting legs are symmetrically arranged. Furthermore, as one preferable aspect of the utility model, four corners of the bottom of the casing are fixedly connected with universal wheels, and the number of the universal wheels is four. The automatic feeding device has the advantages of high automation degree, accurate feeding and compact structure, and in the actual use process, the automatic feeding device can feed materials from the material sheet clip, grasp the material sheets, feed the material feeding rail, feed the materials in a stepping manner to the punching forming and separate the products from the waste materials, the whole process is automatically operated, the manual intervention is reduced, the production efficiency