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CN-224222918-U - Inlet and outlet oxygen concentration controller for reflow soldering and vacuum reflow soldering

CN224222918UCN 224222918 UCN224222918 UCN 224222918UCN-224222918-U

Abstract

The utility model discloses an inlet-outlet oxygen concentration control device for reflow soldering and vacuum reflow soldering, which is mounted on an inlet and an outlet of a product of equipment for sealing, so that oxygen content change of the reflow soldering and vacuum reflow soldering equipment caused by product conveying is prevented and isolated, the consumption of protective gas of the whole equipment can be effectively reduced, a tray is driven by a conveyor belt structure to move from an inlet at one end to an outlet at the other end of a cavity, a flange port is used for being communicated with a gas distribution disc or a pump body, a sealing ring is arranged on the side surface of the wall of the corresponding cavity on a gate, a cylinder is movably arranged between the lower end of the gate and the cavity, two ends of the gate are matched and movably arranged in an upper limit guide bar on the side wall of the cavity, and the distance between the lower limit guide bar and the upper limit guide bar is gradually reduced from bottom to top, so that the SMT gate can be tightly pressed when being closed.

Inventors

  • ZHONG WEIYU

Assignees

  • 仁飒科技(上海)有限公司

Dates

Publication Date
20260512
Application Date
20250611

Claims (7)

  1. 1. The inlet and outlet oxygen concentration control device for reflow soldering and vacuum reflow soldering is characterized by comprising a cavity (1), flange ports (3) and a gate (4), wherein the cavity (1) is of a two-end penetrating opening structure, the gate (4) is movably arranged at the two-end opening sides of the cavity (1), the two-end openings are respectively an inlet and an outlet, a driving rod (9) is arranged in the cavity (1) in the direction perpendicular to the penetrating opening, two ends of the driving rod (9) are movably arranged on the side wall of the cavity (1), chain wheels (13) are arranged at two ends of the driving rod (9), chains (12) are arranged on the chain wheels (13), two chains (12) form a parallel and upper-side horizontal conveying belt structure through auxiliary rods and auxiliary chain wheels, and one end of the driving rod (9) penetrates through the cavity (1) and then stretches out of the cavity (1) and is in power connection with a driving motor (15) fixed at the outer side of the cavity (1); the cavity (1) is provided with a flange port (3) communicated with the outer side of the cavity (1), and the flange port (3) is used for being communicated with a gas distribution disc or a pump body so as to extract or discharge gas in the cavity (1); The sealing device is characterized in that a sealing ring (8) is arranged on the side face of the wall of the cavity (1) corresponding to the gate (4), an air cylinder (7) is movably arranged between the lower end of the gate (4) and the cavity (1), the air cylinder (7) is used for driving the gate (4) to open and close, two ends of the gate (4) are movably arranged in an upper limit guide strip (5) on the side wall of the cavity (1) in a matching manner, a lower limit guide strip (6) is arranged on the outer side of the upper limit guide strip (5), a mounting block (17) is arranged in the lower limit guide strip (6) in a matching manner, the mounting block (17) is fixedly arranged on the gate (4), and the space between the lower limit guide strip (6) and the upper limit guide strip (5) is gradually reduced from bottom to top, so that the gate (4) can compress the sealing ring (8) when being closed.
  2. 2. The inlet and outlet oxygen concentration control device for reflow soldering and vacuum reflow soldering according to claim 1, wherein the top of the cavity (1) is movably provided with a sealing cover (2), one end of the sealing cover (2) is hinged on the cavity (1), and the other end of the sealing cover (2) can be manually clamped on the cavity (1) to facilitate the opening of the sealing cover (2).
  3. 3. The inlet and outlet oxygen concentration control device for reflow soldering and vacuum reflow soldering according to claim 1, wherein a guide polish rod (10) and an amplitude modulation screw rod (11) are movably arranged in the cavity (1) in the direction parallel to the driving rod (9), two ends of the guide polish rod (10) and the amplitude modulation screw rod (11) are respectively provided with a vertical plate (14), the chain (12) and the chain wheel (13) are respectively positioned between the two vertical plates (14), the chain wheel (13) can slide along the driving rod (9), two ends of the guide polish rod (10) are movably arranged on the vertical plates (14), the amplitude modulation screw rod (11) is movably arranged on the vertical plates (14) through a thread structure, one end of the amplitude modulation screw rod (11) penetrates through the vertical plates (14) and the cavity (1) and then is connected with an amplitude modulation power structure power fixedly arranged on the outer side of the cavity (1), and the distance between the two vertical plates (14) is adjusted by driving the amplitude modulation screw rod (11) to rotate.
  4. 4. The inlet and outlet oxygen concentration control device for reflow soldering and vacuum reflow soldering according to claim 1, wherein a bracket (18) is arranged at the bottom of the cavity (1), the cylinder body of the cylinder (7) is movably arranged on the bracket (18), and the piston rod of the cylinder (7) is movably arranged on the gate (4).
  5. 5. The inlet and outlet oxygen concentration control device for reflow soldering and vacuum reflow soldering according to claim 1, wherein the gate (4) and the mounting block (17) are respectively arranged outside the upper limit guide strip (5) through pulleys (19) and are provided with a lower limit guide strip (6).
  6. 6. The inlet and outlet oxygen concentration control device for reflow soldering and vacuum reflow soldering of claim 5, wherein the upper and lower ends of the upper limit guide bar (5) outside the lower limit guide bar (6) are provided with radians.
  7. 7. The inlet and outlet oxygen concentration control device for reflow soldering and vacuum reflow soldering in accordance with claim 1, wherein a tray (16) is hung on the upper side of a conveyor structure formed by two chains (12), and the tray (16) is driven by the conveyor structure to move from one end inlet to the other end outlet of the cavity (1).

Description

Inlet and outlet oxygen concentration controller for reflow soldering and vacuum reflow soldering Technical Field The utility model relates to an inlet and outlet oxygen concentration control device for reflow soldering and vacuum reflow soldering, and belongs to the technical field of SMT and semiconductor chip soldering. Background With the development of SMT and semiconductor technology, electronic technology is developing towards high power, high density and integration, and a higher and more comprehensive reliability requirement is being put forward for package soldering of high-power devices. The existing reflow soldering and vacuum reflow soldering are imperfect in oxygen concentration control of an inlet and an outlet, and a large amount of oxygen can be brought in when products enter and exit the furnace body, or the oxygen entering of the inlet and the outlet damages the oxygen content atmosphere in the furnace due to unbalanced pressure of the gas in the furnace, so that the oxygen concentration in the furnace body changes, and the stability of the products can be influenced by oxidation. A large amount of nitrogen or other gas not containing oxygen needs to be introduced into the furnace body, which can require the use of a large amount of gas to stabilize the oxygen concentration inside the furnace body. Disclosure of utility model The utility model overcomes the defects of the prior art, and provides the inlet and outlet oxygen concentration control device for reflow soldering and vacuum reflow soldering, which is arranged at the inlet and outlet of equipment products for sealing, and controls the conveying part of the inlet and outlet products of the reflow soldering and vacuum reflow soldering equipment, thereby preventing and isolating the oxygen content change of the reflow soldering and vacuum reflow soldering equipment caused by the product conveying, and simultaneously effectively reducing the using amount of protective gas of the whole equipment. In order to solve the technical problems, the inlet and outlet oxygen concentration control device for reflow soldering and vacuum reflow soldering comprises a cavity, flange openings and a gate, wherein the cavity is of a structure with two through openings at two ends, the gates are movably arranged at the two opening sides of the cavity, the openings at two ends are respectively an inlet and an outlet, a driving rod is arranged in the cavity in the direction vertical to the through openings, two ends of the driving rod are movably arranged on the side wall of the cavity, two ends of the driving rod are respectively provided with a chain wheel, the chain wheels are provided with chains, two chains form a parallel and upper horizontal conveyor belt structure on the cavity through auxiliary rods and auxiliary chain wheels, and a tray is hung at the upper side of the conveyor belt structure formed by the two chains, and is driven by the conveyor belt structure to move from an inlet at one end of the cavity to an outlet at the other end; The cavity is provided with a flange port communicated with the outer side of the cavity, and the flange port is used for being communicated with the air distribution disc or the pump body so as to extract or discharge air in the cavity; The sealing ring is arranged on the side face of the cavity wall corresponding to the gate, an air cylinder is movably arranged between the lower end of the gate and the cavity, the air cylinder is used for driving the gate to open and close, two ends of the gate are movably arranged in an upper limit guide bar on the side wall of the cavity in a matched mode, a lower limit guide bar is arranged on the outer side of the upper limit guide bar, a mounting block is arranged in the lower limit guide bar in a matched mode, the mounting block is fixedly arranged on the gate, and the space between the lower limit guide bar and the upper limit guide bar is gradually reduced from bottom to top, so that the sealing ring can be compressed when the gate is closed. Further, the top of cavity activity is provided with sealed lid, sealed lid's one end articulates on the cavity, sealed lid's the other end can manual joint on the cavity, makes things convenient for sealed lid's opening. Further, the direction that is on a parallel with the actuating lever in the cavity is gone up the activity and is provided with direction polished rod and amplitude modulation lead screw, the both ends of direction polished rod and amplitude modulation lead screw all are provided with the riser, chain and sprocket all are located between two risers, just the sprocket can slide along the actuating lever, the both ends activity of direction polished rod set up at the riser, amplitude modulation lead screw passes through the helicitic texture activity and sets up at the riser, the one end of amplitude modulation lead screw runs through riser and cavity back and is in the same place with the amplitude modulation pow