CN-224222973-U - Laser welding device and display device repair system

CN224222973UCN 224222973 UCN224222973 UCN 224222973UCN-224222973-U

Abstract

The application relates to a laser welding device and a display device repairing system, which comprises a laser, a pressing assembly and a pressing driving assembly, wherein the laser is used for emitting laser which is directly irradiated on the surface of a chip, the pressing assembly comprises a light-transmitting plate, the laser emitted by the laser is suitable for penetrating through the light-transmitting plate, and the pressing driving assembly is in driving connection with the pressing assembly so as to drive the pressing assembly to move along the emitting direction of the laser and press the light-transmitting plate on the surface of the chip. According to the application, the chip is tightly pressed on the bonding pad by the light-transmitting plate, and the laser is directly irradiated towards the surface of the chip by the laser, so that the laser penetrates through the light-transmitting plate to heat the chip, the heating effect and the heating uniformity of the chip are optimized, and the welding quality of the chip is improved.

Inventors

LI YONG
WANG DING
ZHANG LIJUN
TANG WEI

Assignees

武汉国创科光电装备有限公司

Dates

Publication Date: 20260512
Application Date: 20250506

Claims (10)

1. A laser welding apparatus, comprising: The laser is used for emitting laser directly irradiating the surface of the chip; The pressing assembly comprises a light-transmitting plate, and laser emitted by the laser is suitable for penetrating through the light-transmitting plate; And the pressing driving assembly is in driving connection with the pressing assembly so as to drive the pressing assembly to move along the emitting direction of the laser and press the light-transmitting plate on the surface of the chip.
2. The laser welding apparatus according to claim 1, wherein the press-fit driving member includes: The first driving piece is in driving connection with the pressing assembly so as to drive the pressing assembly to move along the emitting direction of the laser; The second driving piece is in driving connection with the pressing assembly, so that the pressing assembly is driven to move away from a light path of laser emitted by the laser, or a light-transmitting plate of the pressing assembly is arranged on the light path of the laser emitted by the laser.
3. The laser welding apparatus according to claim 2, wherein the driving form of the second driving member includes a linear driving or a curved driving.
4. The laser welding device of claim 1, wherein the press-fit assembly further comprises a connecting plate, the connecting plate is provided with a mounting groove, the light-transmitting plate is embedded in the mounting groove to be connected to the connecting plate, and the press-fit driving assembly is connected to the connecting plate.
5. The laser welding apparatus according to claim 4, wherein the bottom of the light-transmitting plate protrudes from the bottom surface of the connection plate.
6. The laser welding device of claim 1, further comprising a pressure sensing member for measuring a pressure of the bonding assembly against the die.
7. The laser welding device according to any one of claims 1-6, wherein the emitting direction of the laser is arranged vertically to act on the chip placed horizontally.
8. A display device repair system comprising the laser welding apparatus according to any one of claims 1 to 7.
9. The display device repair system of claim 8, further comprising a repair assembly comprising: the repairing table is used for bearing the substrate to be repaired; And the repair driving assembly is in driving connection with the repair table so as to drive the defect points on the substrate to be repaired to sequentially move to the irradiation position of the laser.
10. The display device repair system of claim 8, further comprising a transfer assembly comprising: A transfer rack; a pick-up head adapted to pick up the chip; And the transfer driving assembly is arranged on the transfer frame and is in driving connection with the pick-up head so as to drive the pick-up head to move in the front-back, left-right and up-down directions.

Description

Laser welding device and display device repair system Technical Field The application relates to the technical field of chip welding, in particular to a laser welding device and a display device repairing system. Background MicroLED (micro light emitting diode) display devices are widely used due to their small size, low power consumption, high brightness, high color saturation, fast response, long life, etc. In order to improve the yield of the Micro LED display device, in the preparation process of the existing MicroLED display device, after the LED chip is transferred, the LED chip is subjected to accurate addressing detection and repair, the luminous chip which cannot be displayed is eliminated, and the yield of the display device is improved. The chips to be transferred are generally arranged on the standby substrate in batches, and when the defect points of the substrate to be repaired need to be repaired, the chips are picked up from the standby substrate and then transferred to the defect points of the substrate to be repaired. In general, the chip is picked up by means of adhesion, adsorption, magnetic force, or the like. After picking up the chip, the chip is placed at the defect point and is fixed at the defect point. In the related art, a chip is irradiated with laser light, and the chip is heated to solder-fix the chip on a pad at a defective point. Generally, when the chip is irradiated by laser to fix the chip, the chip is required to be pressed on the bonding pad, so that the welding quality of the chip is ensured, and the condition of cold joint is avoided. Because the size of the chip is smaller, after the chip surface is pressed, the range of the shielded chip surface is too large, and the heating effect of the chip is adversely affected. In addition, because the space above the chip is occupied by the pressing piece, the laser can only irradiate laser to the surface of the chip obliquely to cause uneven energy of light spots generated on the surface of the chip, and the surface of the chip is heated unevenly, so that poor welding defects such as cold welding and the like are easy to occur. Disclosure of utility model The embodiment of the application provides a laser welding device and a display device repairing system, which are used for solving the technical problems that the chip heating effect is poor, the chip surface is heated unevenly, and the defects such as cold joint and the like are easy to occur in the related technology. In a first aspect, there is provided a laser welding apparatus comprising: The laser is used for emitting laser directly irradiating the surface of the chip; The pressing assembly comprises a light-transmitting plate, and laser emitted by the laser is suitable for penetrating through the light-transmitting plate; And the pressing driving assembly is in driving connection with the pressing assembly so as to drive the pressing assembly to move along the emitting direction of the laser and press the light-transmitting plate on the surface of the chip. In some embodiments, the nip drive includes: The first driving piece is in driving connection with the pressing assembly so as to drive the pressing assembly to move along the emitting direction of the laser; The second driving piece is in driving connection with the pressing assembly, so that the pressing assembly is driven to move away from a light path of laser emitted by the laser, or a light-transmitting plate of the pressing assembly is arranged on the light path of the laser emitted by the laser. In some embodiments, the driving pattern of the second driving member includes a linear driving or a curved driving. In some embodiments, the pressing assembly further includes a connecting plate, the connecting plate is provided with a mounting groove, the light-transmitting plate is embedded in the mounting groove to be connected with the connecting plate, and the pressing driving assembly is connected with the connecting plate. In some embodiments, the bottom of the light-transmitting plate protrudes from the bottom surface of the connecting plate. In some embodiments, the laser welding apparatus further includes a pressure sensor for measuring a pressure of the pressing assembly acting on the chip. In some embodiments, the emission direction of the lasers is arranged vertically to act on the chips placed horizontally. The technical scheme provided by the application has the beneficial effects that: The embodiment of the application provides a laser welding device, which is characterized in that when a chip is welded and fixed, a pressing driving assembly drives a pressing assembly to press the chip on a bonding pad at the defect point of a substrate to be repaired, and a light-transmitting plate of the pressing assembly is used for pressing the chip, so that on one hand, the chip is not easy to shift in the welding process, the welding precision of the chip is ensured, the chip is ensured to be closely attached