CN-224223003-U - Glass substrate cutting system and glass substrate cutting device

CN224223003UCN 224223003 UCN224223003 UCN 224223003UCN-224223003-U

Abstract

The present application relates to a glass substrate cutting system and a glass substrate cutting apparatus, the glass substrate cutting system comprises a first laser and a second laser, and the glass substrate comprises a laminated layer structure and a glass core plate. The first laser is used for emitting a first laser beam, the first laser beam is used for grooving the laminated structure of the glass substrate to form a cutting channel, and the second laser is used for emitting a second laser beam, and the second laser beam is used for modifying the glass core plate at the position of the cutting channel. Through using the grooving processing of the layer-adding structure of the first laser to the glass substrate, the modified processing of the glass core plate is matched with the second laser, so that the glass core plate is easy to break, the cutting of the glass substrate can be efficiently realized, and the problem that the glass substrate cannot be efficiently cut in high quality by the existing cutting technology is solved.

Inventors

CHEN GUODONG
LV HONGJIE
WU HONGXIN
HUANG XINGSHENG
WANG KAI
YANG CHAOHUI

Assignees

深圳市大族微电子科技有限公司

Dates

Publication Date: 20260512
Application Date: 20250610

Claims (10)

1. The glass substrate cutting system is applied to cutting the glass substrate and is characterized by comprising a first laser and a second laser, wherein the glass substrate comprises a laminated layer structure and a glass core plate; The first laser is used for emitting a first laser beam, the first laser beam is used for grooving the laminated structure of the glass substrate to form a cutting channel, and the second laser is used for emitting a second laser beam, and the second laser beam is used for modifying the glass core plate where the cutting channel is located.
2. The glass substrate cutting system of claim 1, further comprising a breaking mechanism for breaking the glass substrate along the modified glass core panel region.
3. The glass substrate cutting system of claim 2, wherein the breaking mechanism comprises a mechanical breaking mechanism or a laser breaking mechanism, the mechanical breaking mechanism breaking the glass substrate along the modified glass core plate region by mechanical force to complete breaking, the laser breaking mechanism reducing the connection strength of the glass substrate along the modified glass core plate region by laser energy to complete breaking.
4. The glass substrate cutting system of claim 1, wherein the wavelength of the first laser beam comprises an ultraviolet to green wavelength band and the second laser beam output by the second laser is an ultrafast laser beam.
5. The glass substrate cutting system of claim 4, wherein the first laser beam is an ultrafast laser beam and/or the second laser beam has a wavelength of infrared light or green light.
6. The glass substrate cutting system of claim 1, further comprising a beam adjustment mechanism comprising a first beam adjustment mechanism and a second beam adjustment mechanism; The first beam adjusting mechanism comprises a beam deflection device and is used for adjusting and controlling the first laser beam emitted by the first laser, and the second beam adjusting mechanism comprises a Bessel cutting head and is used for adjusting and controlling the second laser beam emitted by the second laser.
7. The glass substrate cutting system is applied to cutting a glass substrate and is characterized by comprising a first laser processing device and a second laser processing device, wherein the first laser processing device is used for grooving the glass substrate, and the second laser processing device is used for modifying the grooved glass substrate; The first laser processing device comprises a first laser, a first light beam adjusting mechanism and a first processing platform, wherein the first light beam adjusting mechanism comprises a light beam deflection device and is used for regulating and controlling a first laser beam emitted by the first laser and grooving a glass substrate to be processed, which is placed on the first processing platform; The second laser processing device comprises a second laser, a second light beam adjusting mechanism and a second processing platform, wherein the second light beam adjusting mechanism comprises a Bessel cutting head and is used for adjusting and controlling a second laser beam emitted by the second laser and modifying the glass substrate after grooving processing, which is placed on the second processing platform.
8. The glass substrate cutting device is applied to cutting of glass substrates and is characterized by comprising a controller, a first laser, a second laser, a beam adjusting mechanism and a processing platform, wherein the processing platform is used for bearing the glass substrates to be processed, the controller is connected with the first laser and the second laser and used for controlling the first laser to conduct grooving processing and controlling the second laser to conduct modification processing, and the beam adjusting mechanism is used for adjusting and controlling the first laser beam emitted by the first laser and the second laser beam emitted by the second laser.
9. The glass substrate cutting apparatus according to claim 8, further comprising a breaking mechanism, wherein the controller is connected to the breaking mechanism, and wherein the controller is configured to control the breaking mechanism to break the modified glass substrate.
10. The glass substrate cutting apparatus according to claim 8, wherein the beam adjustment mechanism comprises a first beam adjustment mechanism comprising a beam deflection device for adjusting the first laser beam emitted by the first laser, and a second beam adjustment mechanism comprising a bessel cutting head for adjusting the second laser beam emitted by the second laser.

Description

Glass substrate cutting system and glass substrate cutting device Technical Field The application relates to the technical field of laser cutting, in particular to a glass substrate cutting system and a glass substrate cutting device. Background With the development of high-performance chips, conventional organic material substrates (such as BT substrates and ABF substrates) have presented certain limitations in high-performance packaging applications, and application to glass substrate technologies for realizing high-density interconnection between chips has been developed. The glass packaging substrate consists of a sandwich glass core plate and an outer layer, and when the glass substrate is cut, the cutting effect is poor when the glass substrate is faced by the cutting technology applied to the traditional organic material substrate due to the difference of the substrate composition materials and physical properties. Disclosure of utility model In view of the above, it is desirable to provide a glass substrate cutting system and a glass substrate cutting device that can efficiently and highly accurately cut a glass substrate. In a first aspect, the application provides a glass substrate cutting system applied to cutting a glass substrate, wherein the glass substrate cutting system comprises a first laser and a second laser; The first laser is used for emitting a first laser beam, the first laser beam is used for grooving the laminated structure of the glass substrate to form a cutting channel, and the second laser is used for emitting a second laser beam, and the second laser beam is used for modifying the glass core plate where the cutting channel is located. In one embodiment, the glass substrate cutting system further comprises a breaking mechanism for breaking the glass substrate along the modified glass core pane region. In one embodiment, the breaking mechanism comprises a mechanical breaking mechanism or a laser breaking mechanism, wherein the mechanical breaking mechanism enables the glass substrate to generate a crack along the modified glass core plate area through mechanical force so as to complete breaking, and the laser breaking mechanism enables the glass substrate to reduce the connection strength along the modified glass core plate area through laser energy so as to complete breaking. In one embodiment, the wavelength of the first laser beam includes ultraviolet light to green light wave band, and the second laser beam output by the second laser is an ultrafast laser beam. In one embodiment, the first laser beam is an ultrafast laser beam and/or the second laser beam has a wavelength of infrared light or green light. In one embodiment, the glass substrate cutting system further comprises a beam adjustment mechanism comprising a first beam adjustment mechanism and a second beam adjustment mechanism; The first beam adjusting mechanism comprises a beam deflection device and is used for adjusting and controlling the first laser beam emitted by the first laser, and the second beam adjusting mechanism comprises a Bessel cutting head and is used for adjusting and controlling the second laser beam emitted by the second laser. In a second aspect, the application further provides a glass substrate cutting system, which is applied to cutting a glass substrate and comprises a first laser processing device and a second laser processing device, wherein the first laser processing device is used for grooving the glass substrate, and the second laser processing device is used for modifying the grooved glass substrate; The first laser processing device comprises a first laser, a first light beam adjusting mechanism and a first processing platform, wherein the first light beam adjusting mechanism comprises a light beam deflection device and is used for regulating and controlling a first laser beam emitted by the first laser and grooving a glass substrate to be processed, which is placed on the first processing platform; The second laser processing device comprises a second laser, a second light beam adjusting mechanism and a second processing platform, wherein the second light beam adjusting mechanism comprises a Bessel cutting head and is used for adjusting and controlling a second laser beam emitted by the second laser and modifying the glass substrate after grooving processing, which is placed on the second processing platform. The application further provides a glass substrate cutting device which is applied to cutting of glass substrates and comprises a controller, a first laser, a second laser, a beam adjusting mechanism and a processing platform, wherein the processing platform is used for bearing the glass substrates to be processed, the controller is connected with the first laser and the second laser and used for controlling the first laser to conduct grooving processing and controlling the second laser to conduct modification processing, and the beam adjusting mechanism is used for adjusting an