CN-224223009-U - Adsorption device, bearing platform and laser processing equipment

CN224223009UCN 224223009 UCN224223009 UCN 224223009UCN-224223009-U

Abstract

The application relates to an adsorption device, a bearing platform and laser processing equipment, wherein the adsorption device is used for adsorbing a circuit board and comprises an adsorption mechanism, the adsorption mechanism comprises a base, a bearing plate and an adsorption plate, the bearing plate is arranged on the base, a vacuum cavity is formed by the bearing plate and the base, a plurality of vacuum holes communicated with the vacuum cavity are formed in the bearing plate, the adsorption plate is arranged on the bearing plate, a plurality of adsorption holes communicated with the vacuum holes and used for adsorbing the circuit board are formed in the adsorption plate, the aperture of the adsorption holes is smaller than that of the vacuum holes, and the distribution density of the adsorption holes is higher than that of the vacuum holes. When the circuit board with thinner thickness is adsorbed on the adsorption plate, the stress on each part of the circuit board is uniform, so that the circuit board is effectively prevented from warping and concave-convex deformation, and the flatness of the circuit board is improved. Therefore, in the process of processing the circuit board by adopting the processing equipment, the processing precision of the circuit board is greatly improved.

Inventors

Xing Weimao
CHEN GUISHUN
CHEN GUODONG
LV HONGJIE
YANG CHAOHUI

Assignees

深圳市大族数控科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250421

Claims (11)

1. An adsorption device for adsorb circuit board, its characterized in that, adsorption device includes adsorption mechanism, adsorption mechanism includes: A base; The bearing plate is arranged on the base, the bearing plate and the base enclose a vacuum cavity, a plurality of vacuum holes communicated with the vacuum cavity are formed in the bearing plate, and The adsorption plate is arranged on the bearing plate, a plurality of adsorption holes which are communicated with the vacuum holes and used for adsorbing the circuit board are formed in the adsorption plate, the aperture of each adsorption hole is smaller than that of each vacuum hole, and the distribution density of each adsorption hole is higher than that of each vacuum hole.
2. The suction device according to claim 1, wherein the suction plate has a mounting surface and a suction surface which are disposed opposite to each other in a thickness direction, the mounting surface is in contact with the carrier plate, the suction surface is used for being in contact with the circuit board, a plurality of first grooves disposed at intervals are concavely formed on the mounting surface, the first grooves are disposed at a set distance from the suction surface, and the suction holes are formed on a bottom wall surface of the first grooves.
3. The adsorption device according to claim 2, wherein a plurality of second grooves are formed in the mounting surface in a recessed manner at intervals, the second grooves and the second grooves are arranged in a crossing manner and communicated, the second grooves and the adsorption surface are spaced at a set distance, and the adsorption holes are formed in the bottom wall surface of the second grooves.
4. The suction apparatus of claim 1, wherein the area of the suction plate covered by the circuit board is denoted as a covered area, and suction holes located at the outermost edges of the covered area are denoted as edge holes, and the aperture of the edge holes is larger than the aperture of the suction holes at other positions within the covered area.
5. The adsorption device of claim 1, wherein the adsorption mechanism further comprises a pressing unit connected to the carrier plate and configured to press the wiring board against the adsorption plate in a thickness direction of the adsorption plate.
6. The adsorption device of claim 5, wherein the adsorption mechanism comprises at least two compression units, the two compression units are arranged at intervals, and the two compression units are used for pressing two ends of the circuit board, which are oppositely arranged, against the adsorption plate along the thickness direction of the adsorption plate.
7. The adsorption device of claim 6, wherein the compression unit comprises a rotating shaft and a compression member, the rotating shaft is rotatably connected with the bearing plate, and the compression member is fixedly arranged on the rotating shaft and is used for pressing against the line plate.
8. The adsorption device of claim 7, further comprising at least one of the following: The two pressing units are respectively marked as a first pressing unit and a second pressing unit, the rotating shaft of the first pressing unit is marked as a first rotating shaft, the rotating shaft of the second pressing unit is marked as a second rotating shaft, the first pressing unit further comprises two fixing pieces, the two fixing pieces are fixedly arranged on the bearing plate and are rotationally connected with the first rotating shaft, the second pressing unit further comprises a first moving piece and a second moving piece which are rotationally connected with the second rotating shaft, the first moving piece is in sliding connection with the bearing plate, the bearing plate is provided with a plurality of mounting holes which are arranged at intervals, and the second moving pieces can be fixed through different mounting holes; the compressing unit further comprises a mounting frame, a driving piece, a first connecting piece, a second connecting piece and a swinging piece, wherein the mounting frame is connected with the base, the driving piece is arranged on the mounting frame and connected with the first connecting piece, the first connecting piece is arranged on the mounting frame in a sliding mode along the thickness direction of the adsorption plate, two ends of the second connecting piece are respectively connected with the first connecting piece and the swinging piece in a rotating mode, and the swinging piece is connected with the rotating shaft in a rotating mode.
9. The adsorption device of claim 1, further comprising at least one of the following: The sliding piece is fixedly connected with the surfaces, facing away from the adsorption plates, of the bases on the two adsorption mechanisms; The adsorption mechanism further comprises a first fastening piece, the bearing plate is provided with a first surface and a second surface in the thickness direction, the first surface is in contact with the base, the second surface is in contact with the adsorption plate, a fastening hole which is spaced from the second surface by a set distance is formed in the first surface, and the first fastening piece is arranged in the base in a penetrating mode and is matched with the fastening hole; The adsorption mechanism further comprises a second fastener, a filling piece and a sliding piece, wherein the sliding piece is arranged on the surface of the base, which is opposite to the bearing plate, a position avoiding hole penetrating through the bearing plate is formed in the surface of the bearing plate, the second fastener penetrates through the position avoiding hole and fixedly connects the base with the sliding piece, the filling piece is matched with the position avoiding hole, and the end face of the filling piece is flush with the surface of the bearing plate, which is opposite to the adsorption plate.
10. A load carrying platform comprising a load carrying body and an adsorption device according to any one of claims 1 to 9, the adsorption device being provided on the load carrying body.
11. A laser processing apparatus comprising a processing device for processing a circuit board and the load-bearing platform of claim 10.

Description

Adsorption device, bearing platform and laser processing equipment Technical Field The application relates to the technical field of circuit board processing, in particular to an adsorption device, a bearing platform and laser processing equipment. Background The circuit board has very wide application in the technical field of electronic manufacturing, and along with the development of electronic products to miniaturization and high performance, a thin circuit board is currently appeared. In the process of manufacturing a thin circuit board, an adsorption device is generally required to adsorb and fix the thin circuit board for the purpose of accurate positioning and the like. However, with the conventional adsorption device, when the thin circuit board is in an adsorption state, the thin circuit board is easy to deform, so that the flatness of the thin circuit board is affected, and finally, the processing precision of the thin circuit board is affected. Disclosure of utility model The application solves the technical problem of improving the processing precision of the circuit board. An adsorption device for adsorb the circuit board, adsorption device includes adsorption equipment, adsorption equipment includes: A base; The bearing plate is arranged on the base, the bearing plate and the base enclose a vacuum cavity, a plurality of vacuum holes communicated with the vacuum cavity are formed in the bearing plate, and The adsorption plate is arranged on the bearing plate, a plurality of adsorption holes which are communicated with the vacuum holes and used for adsorbing the circuit board are formed in the adsorption plate, the aperture of each adsorption hole is smaller than that of each vacuum hole, and the distribution density of each adsorption hole is higher than that of each vacuum hole. In one embodiment, the adsorption plate is provided with a mounting surface and an adsorption surface which are oppositely arranged in the thickness direction, the mounting surface is in contact with the bearing plate, the adsorption surface is used for being in contact with the circuit board, a plurality of first grooves which are arranged at intervals are concavely formed on the mounting surface, the first grooves are spaced from the adsorption surface by a set distance, and the bottom wall surface of the first grooves is provided with the adsorption holes. In one embodiment, the mounting surface is further concavely provided with a plurality of second grooves arranged at intervals, the second grooves are mutually crossed and communicated with the second grooves, the second grooves are spaced from the adsorption surface by a set distance, and the bottom wall surface of the second grooves is provided with the adsorption holes. In one embodiment, the area of the adsorption plate covered by the circuit board is denoted as a coverage area, and the adsorption hole located at the edge of the coverage area is denoted as an edge hole, and the aperture of the edge hole is larger than the apertures of the adsorption holes at other positions in the coverage area. In one embodiment, the adsorption mechanism further comprises a pressing unit, wherein the pressing unit is connected with the bearing plate and used for pressing the circuit board against the adsorption plate along the thickness direction of the adsorption plate. In one embodiment, the adsorption mechanism comprises at least two compression units, the two compression units are arranged at intervals, and the two compression units are used for propping two ends of the circuit board, which are oppositely arranged, against the adsorption plate along the thickness direction of the adsorption plate. In one embodiment, the pressing unit comprises a rotating shaft and a pressing piece, the rotating shaft is rotationally connected with the bearing plate, and the pressing piece is fixedly arranged on the rotating shaft and used for pressing the line board. In one embodiment, at least one of the following schemes is further included: The two pressing units are respectively marked as a first pressing unit and a second pressing unit, the rotating shaft of the first pressing unit is marked as a first rotating shaft, the rotating shaft of the second pressing unit is marked as a second rotating shaft, the first pressing unit further comprises two fixing pieces, the two fixing pieces are fixedly arranged on the bearing plate and are rotationally connected with the first rotating shaft, the second pressing unit further comprises a first moving piece and a second moving piece which are rotationally connected with the second rotating shaft, the first moving piece is in sliding connection with the bearing plate, the bearing plate is provided with a plurality of mounting holes which are arranged at intervals, and the second moving pieces can be fixed through different mounting holes; the compressing unit further comprises a mounting frame, a driving piece, a first connecting piece, a seco