CN-224223013-U - Wafer clamp for micropore machining
Abstract
The utility model belongs to the technical field of wafer production, in particular to a wafer clamp for micropore machining, which comprises a fixed seat, a positioning table, a turnover arm, a driving mechanism and a pressing plate, wherein the fixed seat is fixed on a machine table of machining equipment, the positioning table is fixed on the top surface of the fixed seat, the turnover arms are distributed at equal intervals along the circumferential direction and are rotatably arranged on the positioning table by a first pivot, the driving mechanism is in driving connection with the turnover arm and is used for driving the turnover arm to turn over, and the pressing plate is arranged on the turnover arm.
Inventors
- Ou jilin
Assignees
- 深圳市软艺科技有限公司
Dates
- Publication Date
- 20260512
- Application Date
- 20250508
Claims (8)
- 1. The utility model provides a wafer anchor clamps for micropore processing, includes fixing base (1), fixing base (1) are fixed in on the board of processing equipment, its characterized in that still includes: The positioning table (4) is fixed on the top surface of the fixed seat (1); The overturning arms (5) are distributed at equal intervals along the circumferential direction, and are rotatably mounted on the positioning table (4) by a first pivot (10); the driving mechanism is drivably connected with the overturning arm (5) and is used for driving the overturning arm (5) to overturn; And the pressure plate (6) is arranged on the overturning arm (5).
- 2. The wafer chuck for use with micro-machining as set forth in claim 1, wherein said drive mechanism comprises: The lifting seat (2) is positioned between the fixed seat (1) and a machine table of processing equipment and has a degree of freedom of movement along the vertical direction; The vertical air cylinder (3), the vertical air cylinder (3) is fixed on the bottom surface of the machine table of the processing equipment, and a piston rod of the vertical air cylinder (3) penetrates through the machine table of the processing equipment and is fixedly connected with the lifting seat (2); The first threaded column (7) is fixed on the lifting seat (2); The U-shaped frame (8) is fixed at the top end of the first threaded column (7); The second pivot (11), the second pivot (11) is fixed on the U-shaped frame (8), and the turnover arm (5) is provided with a second waist hole (52) for the second pivot (11) to penetrate.
- 3. A wafer chuck for micro-hole machining according to claim 2, characterized in that the outer wall of the second pivot (11) abuts against the inner wall of the second waist hole (52).
- 4. The wafer chuck for use with micro-machining as set forth in claim 2, further comprising: the first threaded column (7) penetrates through the fixed seat (1) and the lifting seat (2), and the locking nuts (15) installed on the first threaded column (7) in a threaded screwing mode are distributed on the upper portion and the lower portion of the lifting seat (2).
- 5. The wafer chuck for use with micro-machining as set forth in claim 1, further comprising: The second threaded column (12), the second threaded column (12) is fixed on the top surface of the pressure plate (6), and a first waist hole (51) for the second threaded column (12) to penetrate is formed in the overturning arm (5); The butterfly nuts (13) are distributed on the upper part and the lower part of the overturning arm (5) respectively, and the butterfly nuts (13) are installed on the second threaded column (12) in a threaded screwing mode.
- 6. The wafer chuck for use with micro-machining as set forth in claim 1, further comprising: and the rubber gasket (14) is adhered and fixed on the bottom surface of the pressure plate (6).
- 7. The wafer chuck for micro-hole machining according to claim 1, further comprising a positioning mechanism (9), wherein a plurality of sets of the positioning mechanisms (9) are fixed to a top surface of the positioning table (4) at equal intervals in a circumferential direction, and wherein the positioning mechanism (9) comprises: an arc-shaped positioning substrate (91); The fixing block (92), the fixing block (92) is fixed on the outer wall of the arc-shaped positioning substrate (91), and a third waist hole (921) is processed on the fixing block (92); the locking bolt (93) penetrates through the third waist hole (921) and is fixedly connected with the positioning table (4) in a threaded screwing mode.
- 8. A wafer chuck for micro-hole machining according to claim 1, characterized in that a impurity collecting groove (41) is formed at the top end of the positioning table (4).
Description
Wafer clamp for micropore machining Technical Field The utility model belongs to the technical field of wafer production, and particularly relates to a wafer clamp for micropore machining. Background At present, the processing method of the three-dimensional packaging chip micro-hole is mainly divided into dry etching, wet etching, laser drilling etching and other modes, the laser micro-hole is processed into non-contact drilling, and the characteristics of high equipment portability and the like are widely paid attention to. In the aspect of micro-hole processing of three-dimensional chip packaging, the three-dimensional micro-hole processing of a material chip is often required, and the micro-hole is required to have higher diameter-depth ratio, good roundness, almost no recast layer, extremely small heat affected zone, smooth hole wall, no taper and the like. When carrying out laser micropore processing to the wafer, in order to guarantee processingquality, generally need use anchor clamps to carry out the centre gripping to the wafer fixedly, avoid the wafer to produce the skew and influence the precision of processing. For example, in the prior art, the chinese patent application publication No. CN210498875U discloses a "wafer clamp for micro-hole processing", which comprises a placing plate, an electric telescopic rod, a clamping mechanism, a limiting bar, a moving mechanism, a pressing mechanism and a cleaning mechanism, wherein rubber supporting blocks are distributed in the middle of the upper surface of the placing plate, two symmetrically arranged fixing plates are arranged on the upper surface of the placing plate, a gooseneck is arranged on the upper surface of the placing plate, a clamping block is arranged at the end of the gooseneck, and a mounting block is arranged in the middle of the lower surface of the placing plate. The wafer clamp in the prior art including the above-mentioned one can meet the general use requirement, but the horizontal translation of the clamping mechanism requires a large moving space, is not suitable for a work scene with a small space, and the pressing mechanism is easy to cause unnecessary obstruction to the laser micro-hole processing. In order to solve the above problems, the present utility model provides a wafer chuck for micro-hole processing. Disclosure of utility model In order to solve the problems in the prior art, the utility model provides a wafer clamp for micropore processing, which has the characteristics of convenient use and high safety performance. In order to achieve the above purpose, the utility model provides a wafer clamp for micropore processing, which comprises a fixing seat, wherein the fixing seat is fixed on a machine table of processing equipment, and the wafer clamp further comprises: the positioning table is fixed on the top surface of the fixed seat; the overturning arms are distributed at equal intervals along the circumferential direction and are rotatably mounted on the positioning table by a first pivot; The driving mechanism is drivably connected to the overturning arm and used for driving the overturning arm to overturn; and the pressure plate is arranged on the turning arm. As a preferred embodiment of the present utility model, the driving mechanism includes: The lifting seat is positioned between the fixed seat and a machine table of the processing equipment and has a degree of freedom of movement along the vertical direction; The vertical cylinder is fixed on the bottom surface of the machine table of the processing equipment, and a piston rod of the vertical cylinder penetrates through the machine table of the processing equipment and is fixedly connected with the lifting seat; the first thread column is fixed on the lifting seat; the U-shaped frame is fixed at the top end of the first threaded column; The second pivot is fixed on the U-shaped frame, and a second waist hole for the second pivot to penetrate is formed in the turning arm. As a preferable technical scheme of the utility model, the outer wall of the second pivot abuts against the inner wall of the second waist hole. As a preferred technical solution of the present utility model, the present utility model further includes: The first threaded column penetrates through the fixing seat and the lifting seat, and locking nuts installed on the first threaded column in a threaded screwing mode are distributed on the upper portion and the lower portion of the lifting seat. As a preferred technical solution of the present utility model, the present utility model further includes: The second threaded column is fixed on the top surface of the pressure plate, and a first waist hole for the second threaded column to penetrate is formed in the turning arm; The butterfly nuts are arranged on the upper part and the lower part of the turning arm respectively, and are arranged on the second threaded column in a threaded screwing mode. As a preferred technical solution of the pr