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CN-224223022-U - Feeding mechanism and ceramic substrate laser drilling machine

CN224223022UCN 224223022 UCN224223022 UCN 224223022UCN-224223022-U

Abstract

The utility model discloses a feeding mechanism and a ceramic substrate laser drilling machine, wherein the feeding mechanism comprises a frame, a translation module arranged on the frame, an installation platform arranged on the translation module, an installation plate arranged on the installation platform, a stock bin detachably connected to the installation plate, and a first material taking manipulator arranged on the frame, the translation module is used for driving the installation platform to linearly translate, the installation plate is provided with a plurality of positioning pins, the stock bin comprises a bottom plate and a plurality of limiting columns arranged on the bottom plate, the limiting columns are used for limiting the periphery of a ceramic substrate, a plurality of positioning holes are formed in the bottom plate, the positioning holes are respectively matched with the positioning pins in a one-to-one mode, and the first material taking manipulator is used for grabbing the ceramic substrate in the stock bin to the next station. The utility model can reduce the downtime caused by the change of the mould and improve the production efficiency.

Inventors

  • ZHOU JIANHONG
  • ZHANG WEI
  • ZHANG LI
  • DENG CHAO
  • Ye Zonghui
  • WANG CHONG
  • MO XIAOHUI
  • Fang Yanyang

Assignees

  • 深圳市圭华智能科技有限公司

Dates

Publication Date
20260512
Application Date
20260407

Claims (10)

  1. 1. The utility model provides a feed mechanism, its characterized in that, is in including frame, setting translation module in the frame, setting are in mounting platform on the translation module, set up mounting panel on the mounting platform, detachable connection are in feed bin on the mounting panel and set up first material taking manipulator in the frame, the translation module is used for the drive mounting platform is along sharp translation, be provided with a plurality of locating pins on the mounting panel, the feed bin includes the bottom plate, sets up a plurality of spacing posts on the bottom plate, spacing post is used for spacing ceramic substrate all around, a plurality of locating holes have been seted up on the bottom plate, a plurality of locating holes respectively with a plurality of locating pin one-to-one cooperation, first material taking manipulator be used for with ceramic substrate in the feed bin snatchs to next station.
  2. 2. The feeding mechanism of claim 1, wherein the mounting plate is provided with a jacking component, the jacking component comprises a jacking block and a driving piece for driving the jacking block to lift, the driving piece is mounted at the bottom of the mounting plate, the jacking block is located above the mounting plate, the output end of the driving piece passes through the mounting plate and is connected with the jacking block, the mounting platform is provided with a first avoidance opening for avoiding the driving piece, and the bottom plate is provided with a second avoidance opening for avoiding the jacking block.
  3. 3. The feeding mechanism of claim 2, wherein at least one side of the mounting plate is provided with a mounting rod, and a photoelectric sensor is mounted on the mounting rod and is used for sensing the height position of the ceramic substrate.
  4. 4. The feeding mechanism according to claim 2, wherein a plurality of sliding rods are fixedly connected to the bottom of the jacking block, the sliding rods are vertically arranged, a plurality of linear bearings are mounted on the mounting plate, the sliding rods are respectively in one-to-one sliding fit with the linear bearings, and a stop block is arranged at the bottom of each sliding rod.
  5. 5. A feeding mechanism according to claim 2, wherein a support plate is stacked on top of the base plate, the support plate being for supporting the ceramic substrate.
  6. 6. The feeding mechanism of claim 1, wherein handles are provided on both sides of the top of the base plate.
  7. 7. The feeding mechanism of claim 1, wherein the first material taking manipulator comprises a support, a first lifting module arranged on the support, a second lifting module arranged at the output end of the first lifting module, and an adsorption module arranged at the output end of the second lifting module, wherein the support is arranged on the frame, and the adsorption module is used for adsorbing or releasing the ceramic substrate.
  8. 8. The feeding mechanism of claim 7, wherein the first lifting module comprises a first vertical plate and a first sliding table cylinder arranged on the first vertical plate, the first vertical plate is arranged on the bracket, the second lifting module comprises a second vertical plate and a second sliding table cylinder arranged on the second vertical plate, the second vertical plate is arranged at the output end of the first sliding table cylinder, and the adsorption module is arranged at the output end of the second sliding table cylinder.
  9. 9. The feeding mechanism of claim 7, wherein the adsorption module comprises a mounting frame, a first mounting bar, a second mounting bar, a third sliding table cylinder and four vacuum chucks, wherein the first mounting bar and the third sliding table cylinder are mounted on the mounting frame, the second mounting bar is mounted at the telescopic end of the third sliding table cylinder, the first mounting bar and the second mounting bar are parallel to each other, the first mounting bar is provided with a waist-shaped hole, two of the vacuum chucks are adjustably mounted on the waist-shaped hole through a first support, the second mounting bar is provided with a plurality of mounting holes, and the other two of the vacuum chucks are adjustably mounted on the mounting holes through a second support.
  10. 10. A ceramic substrate laser drilling machine, characterized by comprising a feeding mechanism, a pre-shaping mechanism, a second material taking manipulator, a laser drilling mechanism and a discharging mechanism according to any one of claims 1 to 9.

Description

Feeding mechanism and ceramic substrate laser drilling machine Technical Field The utility model relates to the technical field of ceramic substrate processing, in particular to a feeding mechanism and a ceramic substrate laser drilling machine. Background Ceramic substrates are widely used as package substrates and heat dissipation substrates for electronic components because of their excellent insulation, heat resistance, thermal conductivity, and coefficient of thermal expansion matching with chips. With the development of miniaturization and high-density integration of electronic components, a large number of tiny through holes or blind holes need to be processed on a ceramic substrate to realize interlayer electrical interconnection. Because the ceramic material has the characteristics of high hardness and high brittleness, the traditional mechanical drilling mode is adopted, so that the cutter is seriously worn, the machining efficiency is low, the defects of edge breakage, cracks and the like of the substrate are extremely easy to cause, and the precision requirement of micropore machining is difficult to meet. As a non-contact processing method, laser processing has the advantages of high processing precision, small heat affected zone, no limitation of material hardness, and the like, and has become a mainstream technology for ceramic substrate micropore processing. In an automatic laser drilling production line, the ceramic substrates are generally stacked in a bin in a feeding manner, and then are grabbed to a processing station one by a manipulator. However, when processing ceramic substrates of different specifications, it is necessary to stop the machine to disassemble the old stock bin and replace the new stock bin, the disassembly and assembly operation space is narrow and the disassembly and assembly are complicated, thereby reducing the continuous operation time of the equipment and affecting the production efficiency. Disclosure of utility model In order to overcome the defects in the prior art, the utility model provides the feeding mechanism and the ceramic substrate laser drilling machine, which can reduce the downtime caused by the change of the shape and improve the production efficiency. The technical scheme adopted for solving the technical problems is as follows: The utility model provides a feed mechanism, includes the frame, sets up translation module in the frame, set up mounting platform on the translation module, set up mounting panel on the mounting platform, detachable connection be in feed bin on the mounting panel and set up first material taking manipulator in the frame, the translation module is used for the drive mounting platform is along sharp translation, be provided with a plurality of locating pins on the mounting panel, the feed bin includes the bottom plate, sets up a plurality of spacing posts on the bottom plate, spacing posts are used for spacing ceramic substrate all around, a plurality of locating holes have been seted up on the bottom plate, a plurality of the locating hole respectively with a plurality of locating pin one-to-one cooperation, first material taking manipulator is used for with ceramic substrate in the feed bin snatchs to next station. As a further improvement of the technical scheme, the lifting assembly is arranged on the mounting plate and comprises a lifting block and a driving piece used for driving the lifting block to lift, the driving piece is arranged at the bottom of the mounting plate, the lifting block is positioned above the mounting plate, the output end of the driving piece penetrates through the mounting plate and is connected with the lifting block, a first avoidance opening used for avoiding the driving piece is formed in the mounting platform, and a second avoidance opening used for avoiding the lifting block is formed in the bottom plate. As a further improvement of the technical scheme, at least one side of the mounting plate is provided with a mounting rod, and a photoelectric sensor is mounted on the mounting rod and used for sensing the height position of the ceramic substrate. As a further improvement of the technical scheme, the bottom of the jacking block is fixedly connected with a plurality of sliding rods, the sliding rods are vertically arranged, a plurality of linear bearings are arranged on the mounting plate, a plurality of sliding rods are respectively in one-to-one sliding fit with a plurality of linear bearings, and a stop block is arranged at the bottom of each sliding rod. As a further improvement of the above technical solution, a supporting plate is stacked on top of the bottom plate, and the supporting plate is used for supporting the ceramic substrate. As a further improvement of the technical scheme, handles are arranged on two sides of the top of the bottom plate. As a further improvement of the technical scheme, the first material taking manipulator comprises a support, a first lifting module arra