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CN-224223239-U - Irregular hard and brittle material surface polishing equipment

CN224223239UCN 224223239 UCN224223239 UCN 224223239UCN-224223239-U

Abstract

The utility model belongs to the technical field of hard and brittle material polishing, and particularly relates to irregular hard and brittle material surface polishing equipment. The irregular hard and brittle material surface polishing device comprises a laser processing displacement platform, a laser processing device, a measuring station objective table, a height measuring device and a mechanical polishing device, wherein the laser processing displacement platform and the laser processing device are used for carrying out laser processing on a product, the measuring station objective table and the height measuring device are used for obtaining the surface height of the product on the measuring station objective table, and the mechanical polishing device is used for carrying out mechanical polishing on the product after laser processing. The laser polishing and the mechanical polishing are combined into a set of equipment, the laser polishing device has the characteristics of high laser polishing efficiency and high mechanical polishing precision, the risk of breakage in the polishing process of the hard and brittle samples with irregular surfaces can be reduced, the height measuring device can be used for obtaining the surface height of the products on the object stage of the measuring station, and the high points can be polished through laser repetition so as to meet the requirement of mechanical polishing.

Inventors

  • YUAN GAN
  • HU CHEN
  • LEI ZHIHUI
  • ZHAO XIAOJIE

Assignees

  • 英诺激光科技股份有限公司
  • 深圳西可实业有限公司

Dates

Publication Date
20260512
Application Date
20250506

Claims (7)

  1. 1. An apparatus for polishing the surface of an irregularly hard and brittle material, comprising: A laser processing displacement platform (1) for placing a product (100); the laser processing device (2) is arranged above the laser processing displacement platform (1) and is used for carrying out laser processing on the product (100); the measuring station objective table (3) is arranged on one side of the laser processing displacement platform (1); A height measuring device (4) arranged above the measuring station stage (3) for acquiring the surface height of the product (100) on the measuring station stage (3), and And a mechanical polishing device (5) for mechanically polishing the laser-processed product (100).
  2. 2. The apparatus for polishing the surface of an irregularly hard and brittle material according to claim 1, characterized in that, The laser processing device (2) comprises a laser (21), a plurality of reflecting mirrors (22) and a scanning galvanometer (23).
  3. 3. The apparatus for polishing the surface of an irregularly hard and brittle material according to claim 1, characterized in that, The irregular hard and brittle material surface polishing equipment further comprises a first carrying device (6) and a second carrying device (7); The first conveying device (6) is used for conveying the product (100) between the laser processing displacement platform (1) and the measuring station objective table (3); The second carrying device (7) is used for carrying the product (100) between the measuring station object stage (3) and the mechanical polishing device (5).
  4. 4. An irregular, hard and brittle material surface polishing device according to claim 3, The first conveying device (6) and the second conveying device (7) are mechanical arms.
  5. 5. The apparatus for polishing the surface of an irregularly hard and brittle material according to claim 1, characterized in that, The height measuring device (4) comprises a white light interferometer, a laser altimeter, a confocal microscope or a contact altimeter probe.
  6. 6. The apparatus for polishing the surface of an irregularly hard and brittle material according to claim 1, characterized in that, The product (100) comprises silicon carbide, silicon nitride, diamond or sapphire.
  7. 7. The apparatus for polishing the surface of an irregularly hard and brittle material according to claim 1, characterized in that, The mechanical polishing device (5) comprises a workbench (51), a polishing head (52), a polishing liquid conveying pipe (53) and a grinding head (54).

Description

Irregular hard and brittle material surface polishing equipment Technical Field The utility model belongs to the technical field of hard and brittle material polishing, and particularly relates to irregular hard and brittle material surface polishing equipment. Background Irregular hard brittle materials include those that fracture with little deformation under external forces, and have brittle characteristics. The prior art uses only mechanical polishing or only laser polishing for the surface processing of irregular hard and brittle materials (e.g., diamond, etc.). However, the surface roughness of the simple laser polishing is difficult to achieve a satisfactory effect, and for the surface of an irregular and hard and brittle material, the simple mechanical polishing has the risk of sample breakage due to the problems of large irregular and uneven surface fluctuation and the like. Disclosure of utility model The utility model aims to provide irregular hard and brittle material surface polishing equipment so as to solve the technical problems. The application provides an irregular hard and brittle material surface polishing device, which comprises: the laser processing displacement platform is used for placing products; The laser processing device is arranged above the laser processing displacement platform and is used for carrying out laser processing on the product; the measuring station objective table is arranged on one side of the laser processing displacement platform; A height measuring device arranged above the measuring station stage for acquiring the surface height of the product on the measuring station stage, and And the mechanical polishing device is used for mechanically polishing the laser processed product. In one embodiment of the application, the laser processing device comprises a laser, a plurality of reflectors and a scanning galvanometer. In an embodiment of the present application, the irregular, hard and brittle material surface polishing apparatus further includes a first carrying device and a second carrying device; the first carrying device is used for carrying the product between the laser processing displacement platform and the measuring station objective table; The second handling device is used for handling products between the measuring station object stage and the mechanical polishing device. In an embodiment of the application, the first handling device and the second handling device are mechanical arms. In one embodiment of the application, the height measurement device comprises a white light interferometer, a laser altimeter, a confocal microscope, or a contact altimeter probe. In one embodiment of the application, the product comprises silicon carbide, silicon nitride, diamond or sapphire. In one embodiment of the application, the mechanical polishing device comprises a workbench, a polishing head, a polishing liquid conveying pipe and a grinding head. The beneficial effects of the utility model are as follows: Unlike the prior art, the present application provides an irregular hard and brittle material surface polishing apparatus. The irregular hard and brittle material surface polishing device comprises a laser processing displacement platform, a laser processing device, a measuring station objective table, a height measuring device and a mechanical polishing device, wherein the laser processing displacement platform and the laser processing device are used for carrying out laser processing on a product, the measuring station objective table and the height measuring device are used for obtaining the surface height of the product on the measuring station objective table, and the mechanical polishing device is used for carrying out mechanical polishing on the product after laser processing. The laser polishing and the mechanical polishing are combined into a set of equipment, the laser polishing device has the characteristics of high laser polishing efficiency and high mechanical polishing precision, the risk of breakage in the polishing process of the hard and brittle samples with irregular surfaces can be reduced, the height measuring device can be used for obtaining the surface height of the product on the object stage of the measuring station, and the high points can be removed by polishing through laser repetition so as to meet the requirement of mechanical polishing. Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and drawings. In order to make the above objects, features and advantages of the present utility model more comprehensible, preferred embodiments accompanied with figures are described in detail below. Drawings In order to more clearly ill