CN-224223455-U - Semiconductor silicon wafer grinding device

CN224223455UCN 224223455 UCN224223455 UCN 224223455UCN-224223455-U

Abstract

The utility model relates to the technical field of semiconductor silicon wafer processing devices and discloses a semiconductor silicon wafer grinding device which comprises a linear motor, a collecting tank, a dust suction box and a supply box, wherein the linear motor, the collecting tank, the dust suction box and the supply box are arranged in a processing area, a mechanical arm is movably arranged on the linear motor, a grinding mechanism is arranged at the end part of the mechanical arm, a supply mechanism and a dust suction mechanism are respectively arranged at the two ends of the grinding mechanism, a grinding table is arranged in the collecting tank, and a negative pressure mechanism is arranged in the grinding table. The utility model can adsorb the semiconductor silicon wafer by starting the negative pressure mechanism by arranging the grinding table and arranging the negative pressure mechanism in the grinding table, thereby being convenient for grinding the semiconductor silicon wafer, and is convenient for grinding by arranging the grinding mechanism and feeding the grinding liquid according to the requirement by arranging the feeding mechanism.

Inventors

FU ZHI
ZOU JIE

Assignees

联合光科(重庆)精密科技有限公司

Dates

Publication Date: 20260512
Application Date: 20250427

Claims (3)

1. The semiconductor silicon wafer grinding device comprises a linear motor (1), a collecting tank (6), a dust suction box (9) and a supply box (11) which are arranged in a processing area, and is characterized in that a mechanical arm (2) is movably arranged on the linear motor (1), a grinding mechanism is arranged at the end part of the mechanical arm (2), a supply mechanism and a dust suction mechanism are respectively arranged at two ends of the grinding mechanism, a grinding table (7) is arranged in the collecting tank (6), and a negative pressure mechanism is arranged inside the grinding table (7); the grinding mechanism comprises a protective shell (3), a grinding motor (4) and a grinding roller (14), wherein the protective shell (3) is arranged at the end part of the mechanical arm (2), the grinding motor (4) is arranged on the side surface of the protective shell (3), the grinding roller (14) is rotatably arranged in the protective shell (3), and the output end of the grinding motor (4) is in driving connection with the grinding roller (14); The feeding mechanism comprises a feeding pipe (10), a mounting frame (12) and an adjustable nozzle (13), wherein the mounting frame (12) is fixed on the side face of a protective shell (3), one end of the feeding pipe (10) is connected into a feeding box (11), the other end of the feeding pipe is connected with the mounting frame (12) in a penetrating way, the adjustable nozzle (13) is provided with a plurality of nozzles, the nozzles are uniformly arranged in the mounting frame (12), a regulating valve (15) is arranged on the feeding pipe (10), a connecting rod is externally connected with the regulating valve (15), the connecting rod is fixed on the protective shell (3), and the feeding pipe (10) is a corrugated hose; The dust collection mechanism comprises a dust collection cover (5) and a dust collection pipe (8), one end of the dust collection pipe (8) is connected into a dust collection box (9), the other end of the dust collection pipe is communicated with the dust collection cover (5), the dust collection cover (5) is fixed on the side face of the protective shell (3), and the dust collection pipe (8) is a corrugated hose.
2. The semiconductor silicon wafer grinding device according to claim 1, wherein the linear motor (1) is provided with a sliding seat (101), the bottom of the mechanical arm (2) is arranged on the sliding seat (101), and the mechanical arm (2) is a five-axis mechanical arm.
3. The semiconductor wafer polishing apparatus as set forth in claim 1, wherein the polishing platen (7) has a high middle and a low periphery, the negative pressure mechanism comprises a through hole (701), a cover (702) and a negative pressure motor (703), the through hole (701) is uniformly formed in the polishing platen (7), the cover (702) is mounted in the polishing platen (7) and is communicated with the through hole (701), the negative pressure motor (703) is mounted in the polishing platen (7), a negative pressure end of the negative pressure motor (703) is communicated with the bottom of the cover (702), and a groove is formed between the polishing platen (7) and the collecting tank (6) for collecting polishing liquid.

Description

Semiconductor silicon wafer grinding device Technical Field The utility model relates to the technical field of semiconductor silicon wafer processing devices, in particular to a semiconductor silicon wafer grinding device. Background Semiconductor silicon wafers, also known as silicon wafers, are important base materials for the fabrication of integrated circuits and semiconductor devices. The chip is a chip object made of silicon and is widely applied to electronic equipment such as mobile phones, computers, televisions and the like. In the process of processing the semiconductor silicon wafer, a grinding device is needed to remove the damaged layer on the surface of the silicon wafer so as to achieve a flat and smooth state. For some semiconductor silicon wafers which need to be matched with grinding liquid for grinding, the grinding liquid is difficult to contact with the semiconductor silicon wafers effectively, so that the grinding effect is poor, and for some semiconductor silicon wafers which do not need to be matched with the grinding liquid, powder is generated in the grinding process, and if the semiconductor silicon wafers are not processed timely, the follow-up grinding is easy to influence. Disclosure of Invention The utility model aims to provide a semiconductor silicon wafer grinding device which can be matched with grinding liquid to perform grinding work according to requirements, and can adsorb powder generated during grinding of the surface of a semiconductor silicon wafer when the grinding liquid is not matched to perform grinding work. In order to achieve the above purpose, the present utility model provides the following technical solutions: The utility model provides a semiconductor silicon chip grinder, includes linear electric motor, collecting vat, suction box and the supply box of placing in the processing region, the last activity of linear electric motor is provided with the arm, and the tip of arm is provided with grinding mechanism, and grinding mechanism's both ends are equipped with supply mechanism and dust absorption mechanism respectively, install the grinding table in the collecting vat, the inside of grinding table is provided with negative pressure mechanism. Further, a sliding seat is arranged on the linear motor, the bottom of the mechanical arm is arranged on the sliding seat, and the mechanical arm is a five-axis mechanical arm. Further, grinding mechanism includes the protecting crust, grinds motor and grinding roller, and the protecting crust is installed at the tip of arm, grinds the motor and installs in the protecting crust side, and the grinding roller rotates and sets up inside the protecting crust, grinds the output and the grinding roller drive of motor and be connected. Further, the feed mechanism includes supply pipe, mounting bracket and adjustable shower nozzle, and the mounting bracket is fixed in the side of protecting crust, the one end of supply pipe inserts in the supply tank, and the other end and mounting bracket through connection, and adjustable shower nozzle is equipped with a plurality ofly, evenly sets up in the mounting bracket, installs the governing valve on the supply pipe, and the governing valve is external to have the connecting rod, and the connecting rod is fixed on the protecting crust, the supply pipe is corrugated hose. Further, the dust collection mechanism comprises a dust collection cover and a dust collection pipe, one end of the dust collection pipe is connected into the dust collection box, the other end of the dust collection pipe is communicated with the dust collection cover, the dust collection cover is fixed on the side face of the protective shell, and the dust collection pipe is a corrugated hose. Further, the grinding table is high in the middle and low in the periphery, the negative pressure mechanism comprises a through hole, a cover body and a negative pressure motor, the through hole is uniformly formed in the grinding table, the cover body is arranged in the grinding table and communicated with the through hole, the negative pressure motor is arranged in the grinding table, the negative pressure end of the negative pressure motor is communicated with the bottom of the cover body, and a groove is formed between the grinding table and the collecting groove and used for collecting grinding liquid. Compared with the prior art, the utility model has the beneficial effects that: The utility model is provided with the grinding table and the negative pressure mechanism inside the grinding table, so that the grinding operation of the semiconductor silicon wafer can be conveniently carried out by starting the negative pressure mechanism, the grinding operation is convenient to carry out by arranging the grinding mechanism, the grinding liquid is convenient to convey according to the requirement by arranging the supply mechanism, the grinding liquid is effectively ground, and the dust suction mechanism is convenient to