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CN-224223557-U - Aluminum wafer polishing machine

CN224223557UCN 224223557 UCN224223557 UCN 224223557UCN-224223557-U

Abstract

The utility model discloses an aluminum wafer polishing machine which comprises a base and a polishing mechanism, wherein the middle of the upper end of the base is provided with a mounting frame, the lower end of the mounting frame is provided with a movable frame capable of moving up and down, the polishing mechanism comprises a deflection block, polishing discs, limiting plates, a placing hole and a driving assembly, the deflection block is respectively connected with the front side and the rear side of the middle of the inside of the movable frame in a rotating mode, the polishing discs are respectively connected with one side, close to the middle of the base, of the middle of the inside of the deflection block in a rotating mode, the upper end of the base is provided with a rotatable limiting plate, the placing hole is uniformly formed in the upper end of the limiting plate, the aluminum wafer polishing machine is provided with the polishing mechanism, aluminum wafers with different specifications are driven to move through the detachable limiting plates, and the deflectable polishing discs are matched, so that continuous and uniform polishing of the aluminum wafers is realized, and the polishing mechanism also has rough polishing and fine polishing functions, polishing efficiency of the aluminum wafers is improved, and production efficiency of the aluminum wafers is further improved.

Inventors

  • ZHOU PENGFEI
  • LIU JIANFENG

Assignees

  • 河南协诚铝业有限公司

Dates

Publication Date
20260512
Application Date
20250623

Claims (8)

  1. 1. An aluminum wafer polishing machine is characterized by comprising a base (1) and a polishing mechanism (4); the middle part of the upper end of the base (1) is provided with a mounting frame (2), and the lower end of the mounting frame (2) is provided with a movable frame (3) which can move up and down; The polishing mechanism (4) comprises a deflection block (41), a polishing disc (42), a limiting plate (43), a placement hole (44) and a driving component (47), wherein the deflection block (41) is respectively connected to the front side and the rear side in the middle of the interior of the movable frame (3) in a rotating mode, the polishing disc (42) is respectively connected to one side, close to the middle of the base (1), of the interior of the deflection block (41 in a rotating mode, the upper end of the base (1) is provided with the rotatable limiting plate (43), the placement hole (44) is uniformly formed in the upper end of the limiting plate (43), the axes of the deflection block (41) are overlapped with the axes of the vertically adjacent placement holes (44), and the driving component (47) is arranged in the middle of the interior of the base (1).
  2. 2. The aluminum wafer polishing machine of claim 1, further comprising a single-chip microcomputer (10), wherein the single-chip microcomputer (10) is arranged on the front side of the mounting frame (2), and the input end of the single-chip microcomputer (10) is electrically connected with an external power supply.
  3. 3. The aluminum wafer polishing machine as claimed in claim 2, wherein the polishing mechanism (4) further comprises a first motor (45) and a second motor (46), the first motor (45) is respectively arranged in the middle of the front side and the rear side of the upper end of the movable frame (3), the second motor (46) is arranged on one side, close to the middle of the base (1), of the upper end of the deflection block (41), the input ends of the first motor (45) and the second motor (46) are electrically connected with the output end of the single chip microcomputer (10), the lower end of an output shaft of the first motor (45) is fixedly connected with the upper end of the vertically adjacent deflection block (41), and the lower end of an output shaft of the second motor (46) is fixedly connected with the upper end of the vertically adjacent polishing disc (42).
  4. 4. The aluminum wafer polishing machine as recited in claim 2, wherein the driving assembly (47) comprises a rotating block (471), a cross slot (472) and a fixing plate (473), the rotating block (471) is rotatably connected to the middle of the upper end of the base (1), the cross slot (472) is arranged at the upper end of the rotating block (471) and is arranged in the middle of the inside of the limiting plate (43), the limiting plate (43) is inserted and connected with the outer surface of the cross slot (472) on the rotating block (471) through the cross slot (472), the fixing plate (473) is arranged in the middle of the upper end of the rotating block (471), a threaded column is arranged in the middle of the lower end of the fixing plate (473), and the outer surface of the threaded column is in threaded connection with the middle of the inside of the rotating block (471).
  5. 5. The aluminum wafer polishing machine as recited in claim 4, wherein the driving assembly (47) further comprises a reduction gearbox (474) and a motor III (475), the reduction gearbox (474) is arranged in the middle of the top wall of the base (1), the motor III (475) is arranged at the lower end of the reduction gearbox (474), the input end of the motor III (475) is electrically connected with the output end of the single chip microcomputer (10), the upper end of an output shaft of the reduction gearbox (474) is fixedly connected with the lower end of the rotary block (471), and the upper end of the output shaft of the motor III (475) is fixedly connected with the lower end of a reduction shaft of the reduction gearbox (474).
  6. 6. The aluminum wafer polishing machine of claim 2, further comprising an electric push rod (5) and guide posts (6), wherein the electric push rod (5) is arranged in the middle of the inside of the mounting frame (2), the input end of the electric push rod (5) is electrically connected with the output end of the single chip microcomputer (10), the lower end of the telescopic end of the electric push rod (5) is fixedly connected with the middle part of the upper end of the movable frame (3), guide holes are formed in the front side and the rear side of the middle of the inside of the mounting frame (2), the guide posts (6) are respectively arranged on the front side and the rear side of the middle of the upper end of the movable frame (3), and the outer surfaces of the guide posts (6) are in sliding connection with the inner walls of the vertically adjacent guide holes.
  7. 7. The aluminum wafer polishing machine as claimed in claim 1, further comprising a limiting frame (7) and a discharging barrel (8), wherein the limiting frame (7) is arranged in the middle of the left side of the upper end of the base (1), the discharging barrel (8) is connected to the right side of the limiting frame (7) in a sliding mode, the lower ends of the right sides of the outer surfaces of the discharging barrel (8) are fixedly connected with the middle of the left side of the movable frame (3) through bolts, and the axes of the discharging barrel (8) are vertically adjacent to the axes of vertically adjacent placing holes (44).
  8. 8. The aluminum wafer polishing machine as set forth in claim 1, further comprising a spray pipe (9), wherein the spray pipe (9) is disposed in the middle of the right side of the upper end of the base (1), and the spray pipe (9) is vertically adjacent to the rightmost placement hole (44).

Description

Aluminum wafer polishing machine Technical Field The utility model relates to the technical field of aluminum wafer production, in particular to an aluminum wafer polishing machine. Background The aluminum wafer is a metal material, is mainly used for manufacturing various aluminum products and parts, is widely applied to the fields of electronics, daily chemicals, medicines, religions, auto parts and the like, such as industries of electric appliances, heat preservation, mechanical manufacturing, automobiles, aerospace, military industry, molds, construction, printing and the like, and after the aluminum wafer is stamped and formed, the surface of the aluminum wafer is polished for facilitating the subsequent production flow, an aluminum wafer polishing machine is needed, the existing aluminum wafer polishing machine is mostly composed of polishing belts and conveying belts, the polishing belts are arranged at different angles in a plurality of groups, when the polishing work is carried out, an operator stacks the aluminum wafer above the conveying belts, the conveying belts move along with the aluminum wafer, when the aluminum wafer contacts the polishing belts, the aluminum wafer is continuously rubbed on the surface of the aluminum wafer by rotating the polishing belts at a high speed, to aluminium disk surface formation polishing effect, in order to reach better polishing effect, current aluminium disk burnishing machine has coarse polishing machine and fine polishing machine, the aluminium disk is firstly in the inside coarse polishing machine of coarse polishing, then be sent into the inside fine polishing of fine polishing machine, traditional aluminium disk burnishing machine is in order to make polishing more even, the multiunit is different angles and lays the polishing area inside, complicated structure and be inconvenient for maintaining, still need scribble polishing paste when carrying out the fine polishing work of aluminium disk, so need two equipment to carry out coarse polishing respectively with the fine polishing work, it carries out the fine polishing work again to scribble polishing paste after accomplishing the coarse polishing work, the continuity is poor, lead to the polishing efficiency of aluminium disk poor, and then influenced the production efficiency of aluminium disk, for this reason, we propose an aluminium disk burnishing machine. Disclosure of utility model The utility model aims to overcome the existing defects, and provides an aluminum wafer polishing machine, which is provided with a polishing mechanism, wherein aluminum wafers with different specifications are driven to move through a detachable limiting plate, and a deflectable polishing disk is matched, so that continuous and uniform polishing of the aluminum wafers is realized, and the polishing machine also has the functions of rough polishing and fine polishing, so that the polishing efficiency of the aluminum wafers is improved, the production efficiency of the aluminum wafers is further improved, and the problems in the background art can be effectively solved. In order to achieve the aim, the utility model provides the technical scheme that the aluminum wafer polishing machine comprises a base and a polishing mechanism; the base is provided with a mounting frame in the middle of the upper end, and a movable frame capable of moving up and down is arranged at the lower end of the mounting frame; The polishing mechanism comprises a deflection block, a polishing disc, a limiting plate, a placement hole and a driving component, wherein the deflection block is respectively connected to the front side and the rear side of the middle of the inside of the movable frame in a rotating mode, the polishing disc is respectively connected to one side of the middle of the inside of the deflection block, which is close to the middle of the base, the upper end of the base is provided with the rotatable limiting plate, the placement hole is uniformly formed in the upper end of the limiting plate, the axis of the deflection block is coincident with the axis of the vertically adjacent placement hole, a foundation is provided for uniform polishing of an aluminum wafer, the driving component is arranged in the middle of the inside of the base and is provided with the polishing mechanism, and aluminum wafers with different specifications are driven to move through the detachable limiting plate and are matched with the deflectable polishing disc. Further, polishing mechanism still includes motor one and motor two, motor one sets up respectively in the front and back both sides middle part of removing the frame upper end, and motor two sets up in the middle one side that is close to the base middle part in the middle of the deflection piece upper end, and motor one and motor two's input all are connected with the output electricity of singlechip, and motor one's output shaft lower extreme all is with the upper end fixed connection of v