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CN-224223563-U - Surface treatment polishing machine for bonding copper wires

CN224223563UCN 224223563 UCN224223563 UCN 224223563UCN-224223563-U

Abstract

The utility model discloses a surface treatment polishing machine for bonding copper wires, which comprises a base, wherein two movable plates are arranged at the top of the base, the movable plates are connected with the base through a driving assembly, the distance between the two movable plates can be adjusted by the driving assembly, and a driving motor is fixedly arranged at the top of the movable plates. According to the embodiment of the disclosure, through setting up fly leaf, driving motor, polishing roller and drive assembly, during the use, when need adjust the interval of two polishing rollers in order to polish the bonding copper wire of different diameter sizes, the staff can make two fly leaf drive two driving motor move in opposite directions or dorsad through drive assembly to can make two polishing rollers be close to or keep away from, and then adjust the interval of two polishing rollers, thereby be convenient for polish the work to the bonding copper wire of different diameter sizes, avoid polishing effect bad or the problem that the broken line appears in the bonding copper wire, promoted the suitability of device.

Inventors

  • LI SHENGWEI
  • LI YANQIONG

Assignees

  • 深圳中宝新材科技有限公司

Dates

Publication Date
20260512
Application Date
20250520

Claims (6)

  1. 1. The surface treatment polishing machine for bonding copper wires comprises a base (1) and is characterized in that two movable plates (2) are arranged at the top of the base (1), the movable plates (2) are connected with the base (1) through a driving assembly, the distance between the two movable plates (2) can be adjusted by the driving assembly, a driving motor (3) is fixedly arranged at the top of the movable plates (2), a rotating shaft (4) is fixedly sleeved on an output shaft of the driving motor (3), polishing rollers (5) are fixedly connected to the top of the rotating shaft (4), upright posts (6) are fixedly arranged on two sides of the top of the base (1), and guide rollers (7) are rotatably connected to the upright posts (6).
  2. 2. The surface treatment polisher of bonding copper wires according to claim 1, wherein the driving assembly comprises a hydraulic cylinder (8), the hydraulic cylinder (8) is fixedly installed at the bottom of the base (1), a push-pull rod (9) is fixedly connected to the telescopic end of the hydraulic cylinder (8), a through hole (10) located below the movable plate (2) is formed in the base (1), a vertical rod (11) is fixedly connected to the bottom of the movable plate (2), the bottom of the vertical rod (11) penetrates through the through hole (10) and extends to the bottom of the base (1), a diagonal rod (12) is fixedly installed on the push-pull rod (9), and the other end of the diagonal rod (12) penetrates through the vertical rod (11).
  3. 3. The surface treatment polisher for bonding copper wires according to claim 1, wherein the top of the base (1) is fixedly provided with guide rails (13) positioned at two sides of the through hole (10), and the movable plate (2) is slidably connected to the guide rails (13).
  4. 4. The surface treatment polisher for bonding copper wires according to claim 1, wherein a frame (14) positioned on the left side of the movable plate (2) is fixedly arranged at the top of the base (1), round rollers (15) are arranged on the upper side and the lower side of the inner wall of the frame (14), and the round rollers (15) are connected with the frame (14) through buffer components.
  5. 5. The surface treatment polisher of bonding copper wires according to claim 4, wherein the buffer assembly comprises a damping rod (16), the damping rod (16) is fixedly installed on the frame (14), the other end of the damping rod (16) is fixedly connected with a mounting frame (17), the round roller (15) is rotatably connected to the mounting frame (17), a spring (18) is movably sleeved on the outer surface of the damping rod (16), and two ends of the spring (18) are fixedly connected to the frame (14) and the mounting frame (17) respectively.
  6. 6. A surface treatment polisher for bonding copper wires according to claim 2 wherein the inclined rod (12) is cylindrical in appearance and the outer surface of the inclined rod (12) is coated with a lubricating layer.

Description

Surface treatment polishing machine for bonding copper wires Technical Field The utility model relates to the technical field of polishing equipment, in particular to a surface treatment polishing machine for bonding copper wires. Background At present, the connection between a semiconductor electronic chip in an integrated circuit and an external lead frame is mostly finished by means of bonding wires, namely the so-called lead bonding, the bonding wires are fixed on bonding equipment through special ceramic nozzles, the tail parts of the bonding wires are kept to be a certain length of bonding wires, the tail parts of the bonding wires are melted into balls through external arc discharge, then the ball-shaped bonding wires are extruded and connected to electrodes of the electronic chip through the ceramic nozzles, finally the other ends of the bonding wires are connected to the external lead frame in a friction mode through movement of the bonding equipment, the bonding wires are finished after being packaged by plastic resin, copper wires are good raw materials of the bonding wires, and polishing treatment is needed to be carried out on the bonding copper wires by using a polishing machine in order to improve the quality of bonding copper wire products. However, the prior art has some problems that when the bonding copper wire is polished by the existing polishing machine, two polishing rollers usually rotate at two sides of the bonding copper wire to carry out polishing work, however, the polishing rollers on the existing polishing machine are often limited by a fixed mechanical architecture design and are difficult to adjust the distance, so that the polishing machine does not have the function of adjusting the bonding copper wire according to different sizes, the polishing effect is poor due to the fact that the polishing power is too small, and the problem that the bonding copper wire is broken due to the fact that the polishing power is too large is solved. Disclosure of utility model The utility model aims to provide a novel technical scheme of a surface treatment polishing machine for bonding copper wires. According to a first aspect of the utility model, there is provided a surface treatment polisher for bonding copper wires, comprising a base, wherein two movable plates are arranged at the top of the base, the movable plates are connected with the base through a driving assembly, the distance between the two movable plates can be adjusted by the driving assembly, a driving motor is fixedly arranged at the top of the movable plates, a rotating shaft is fixedly sleeved on an output shaft of the driving motor, a polishing roller is fixedly connected at the top of the rotating shaft, upright posts are fixedly arranged at two sides of the top of the base, and guide rollers are rotatably connected on the upright posts. Optionally, the drive assembly includes the pneumatic cylinder, pneumatic cylinder fixed mounting is in the bottom of base, the telescopic link fixedly connected with push-and-pull rod of pneumatic cylinder, set up the through-hole that is located the fly leaf below on the base, the bottom fixedly connected with montant of fly leaf, the bottom of montant passes the through-hole and extends to the bottom of base, fixed mounting has the diagonal bar on the push-and-pull rod, the other end of diagonal bar runs through the montant. Optionally, a guide rail is fixedly installed at the top of the base and positioned at two sides of the through hole, and the movable plate is slidably connected to the guide rail. Optionally, the top fixed mounting of base has the frame that is located the fly leaf left, the upper and lower both sides of frame inner wall all are provided with the roller, be connected through buffer unit between roller and the frame. Optionally, the buffer assembly includes the damping pole, damping pole fixed mounting is on the frame, the other end fixedly connected with mounting bracket of damping pole, the circle roller rotates to be connected on the mounting bracket, the surface activity of damping pole has cup jointed the spring, the both ends of spring are fixed connection respectively on frame and mounting bracket. Optionally, the appearance of the inclined rod is cylindrical, and the outer surface of the inclined rod is coated with a lubricating layer. According to the embodiment of the disclosure, through setting up fly leaf, driving motor, polishing roller and drive assembly, during the use, when need adjust the interval of two polishing rollers in order to polish the bonding copper wire of different diameter sizes, the staff can make two fly leaf drive two driving motor move in opposite directions or dorsad through drive assembly to can make two polishing rollers be close to or keep away from, and then adjust the interval of two polishing rollers, thereby be convenient for polish the work to the bonding copper wire of different diameter sizes, avoid polishing effect ba