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CN-224223575-U - Double-sided grinding equipment for semiconductor silicon wafer

CN224223575UCN 224223575 UCN224223575 UCN 224223575UCN-224223575-U

Abstract

The utility model discloses double-sided grinding equipment for a semiconductor silicon wafer, which comprises a bottom plate, wherein the upper surface of the bottom plate is fixedly connected with a fixing frame, a grinding mechanism is arranged in the fixing frame and comprises a through hole, an air cylinder is arranged on the upper surface of the fixing frame, a pressure sensor is arranged at the output end of the air cylinder, the bottom surface of the pressure sensor is fixedly connected with a fixing plate, buffer springs which are arranged at equal intervals are fixedly connected with the bottom surface of the fixing plate, a damper is fixedly connected with the bottom surface of the fixing plate, a first grinding motor is fixedly connected with the bottom end of each buffer spring, and an upper grinding disc is arranged at the output end of each first grinding motor. The device can buffer the upper grinding disc through the cooperation of the buffer spring and the damper, and can monitor the grinding pressure in real time by utilizing the pressure sensor, so that excessive grinding of the silicon wafer is avoided, and the processing quality of the semiconductor silicon wafer is improved.

Inventors

  • ZHANG XINGBO

Assignees

  • 成都隽晖自动化设备有限公司

Dates

Publication Date
20260512
Application Date
20250613

Claims (6)

  1. 1. The double-sided grinding equipment for the semiconductor silicon wafers is characterized by comprising a bottom plate (1), wherein the upper surface of the bottom plate (1) is fixedly connected with a fixing frame (3), a grinding mechanism (2) is installed in the fixing frame (3), the grinding mechanism (2) comprises a through hole (201), an air cylinder (202) is installed on the upper surface of the fixing frame (3), a pressure sensor (203) is installed at the output end of the air cylinder (202), a fixing plate (204) is fixedly connected to the bottom surface of the pressure sensor (203), buffer springs (205) which are arranged at equal intervals are fixedly connected to the bottom surface of the fixing plate (204), a damper (208) is fixedly connected to the bottom end of each buffer spring (205), a first grinding motor (206) is fixedly connected to the bottom end of each buffer spring, and an upper grinding disc (207) is installed at the output end of each first grinding motor (206).
  2. 2. The double-sided grinding equipment for semiconductor silicon wafers according to claim 1, wherein a second grinding motor (4) is arranged on the upper surface of the bottom plate (1), and a lower grinding disc (5) is arranged at the output end of the second grinding motor (4).
  3. 3. The double-sided grinding equipment for semiconductor silicon wafers according to claim 1, wherein the upper surface of the bottom plate (1) is fixedly connected with support rods (12) which are arranged at equal intervals, the top end of each support rod (12) is fixedly connected with a limiting frame (13) together, and the upper surface of each limiting frame (13) is provided with grooves (14) which are arranged at equal intervals.
  4. 4. The double-sided grinding equipment for semiconductor silicon wafers according to claim 1, wherein a controller (6) is arranged on the front surface of the fixing frame (3), and a display screen (7) is arranged on the front surface of the controller (6).
  5. 5. The double-sided grinding equipment for semiconductor silicon wafers according to claim 1, wherein the bottom surface of the bottom plate (1) is fixedly connected with symmetrical supporting legs (8), and the bottom surface of each supporting leg (8) is fixedly connected with an anti-slip seat (9).
  6. 6. The double-sided lapping apparatus for semiconductor silicon wafers according to claim 1, wherein a stationary cover (10) is fixedly connected to the bottom surface of the bottom plate (1), and a storage battery (11) is installed inside the stationary cover (10).

Description

Double-sided grinding equipment for semiconductor silicon wafer Technical Field The utility model relates to the field of semiconductor silicon wafer processing, in particular to double-sided grinding equipment for a semiconductor silicon wafer. Background Silicon materials with the quality meeting the requirements of semiconductor devices are called semiconductor silicon wafers, the semiconductor silicon wafers comprise polycrystalline silicon, monocrystalline silicon, silicon wafers, epitaxial wafers, amorphous silicon films, microcrystalline silicon films and the like, and silicon wafer grinding equipment is widely used for grinding and polishing one side of various materials such as silicon wafer grinding, silicon wafer polishing, zinc alloy grinding and polishing, optical skewing joints, stainless steel plane polishing, LED sapphire substrates, optical glass wafers, quartz wafers, dies, light guide plates and the like. The Chinese patent with the publication number of CN217071952U discloses a double-sided grinding device for a semiconductor silicon wafer, which comprises a base, the base upper surface is fixed with down the mill, and the silicon wafer has been placed to the mill upper surface down, base outer wall through-connection has first adjusting screw, and first adjusting screw outer wall threaded connection has the slider, the spout has been seted up to the base surface, slider sliding connection in inside the spout, and slider upper end is fixed with lead screw slip table, but the double-sided grinding device of semiconductor silicon wafer in the above-mentioned patent, the operation is comparatively troublesome, and unable control is ground pressure, leads to the fact excessively to the silicon wafer easily, influences the processingquality of semiconductor silicon wafer, and for this reason, we propose a double-sided grinding device of semiconductor silicon wafer to solve above-mentioned problem. Disclosure of utility model The utility model aims to provide double-sided grinding equipment for a semiconductor silicon wafer, which solves the problems in the background technology. In order to achieve the above purpose, the present utility model provides the following technical solutions: The utility model provides a double-sided grinding equipment of semiconductor silicon chip, includes the bottom plate, the last fixed surface of bottom plate is connected with the mount, the internally mounted of mount has grinding machanism, grinding machanism includes the through-hole, the last surface mounting of mount has the cylinder, pressure sensor is installed to the output of cylinder, pressure sensor's bottom surface fixedly connected with fixed plate, the buffer spring that the bottom surface fixedly connected with equidistance was arranged of fixed plate, the bottom surface fixedly connected with attenuator of fixed plate, every the first grinding motor of common fixedly connected with in bottom of buffer spring, the last grinding disc is installed to the output of first grinding motor. In a further embodiment, a second grinding motor is mounted on the upper surface of the bottom plate, and a lower grinding disc is mounted at the output end of the second grinding motor. In a further embodiment, the upper surface of the bottom plate is fixedly connected with supporting rods which are arranged at equal intervals, the top ends of the supporting rods are fixedly connected with limiting frames together, and grooves which are arranged at equal intervals are formed in the upper surface of each limiting frame. In a further embodiment, a controller is mounted on the front surface of the fixing frame, and a display screen is arranged on the front surface of the controller. In a further embodiment, the bottom surface of the bottom plate is fixedly connected with symmetrical supporting legs, and the bottom surface of each supporting leg is fixedly connected with an anti-slip seat. In a further embodiment, a fixed cover is fixedly connected to the bottom surface of the bottom plate, and a storage battery is installed in the fixed cover. Compared with the prior art, the utility model has the beneficial effects that: The device can drive the upper grinding disc to move up and down through the cylinder, the upper grinding disc can be buffered through the cooperation of the buffer spring and the damper, the pressure sensor can be utilized to monitor the grinding pressure in real time, excessive grinding of the silicon wafer is avoided, the processing quality of the semiconductor silicon wafer is improved, the upper surface of the silicon wafer can be ground through the cooperation of the first grinding motor and the upper grinding disc, the bottom surface of the semiconductor silicon wafer can be ground through the cooperation of the second grinding motor and the lower grinding disc, meanwhile, the rotation directions of the first grinding motor and the second grinding motor are opposite, the effect of grinding the