CN-224223577-U - Grinding pad and grinding system

Abstract

The embodiment of the application provides a polishing pad and a polishing system, wherein the polishing pad comprises an upper surface and a lower surface which are opposite, the upper surface is used for polishing a device to be polished, the lower surface is used for fixing the polishing pad to a preset position, a plurality of polishing grooves are formed in the upper surface, an infrared sensor is arranged in at least one polishing groove and surrounds an effective polishing area of the polishing pad, the infrared sensor comprises an infrared emitting unit and an infrared receiving unit which are alternately arranged, the infrared emitting unit is used for emitting infrared rays, the infrared receiving unit is used for receiving the reflected infrared rays, and a processing unit which is electrically connected with the infrared sensor is used for receiving sensing signals of the infrared sensor and determining whether a polishing liquid residual liquid exists on the upper surface or not based on the sensing signals. The embodiment of the application can improve the polishing effect of the polishing pad.

Inventors

• SUN YONGKANG
• XIA HUIZHE
• ZANG ZHICHENG
• WANG BINCHAO
• ZHANG JUNKAI

Assignees

• 浙江创芯集成电路有限公司

Dates

Publication Date

20260512

Application Date

20250610

Claims (10)

1. 1. A polishing pad, which comprises a polishing pad, characterized by comprising the following steps: The upper surface is used for grinding a device to be ground, and the lower surface is used for fixing the grinding pad to a preset position, wherein a plurality of grinding grooves are formed in the upper surface; The infrared sensor is arranged in at least one grinding groove, surrounds an effective grinding area of the grinding pad, and comprises an infrared emission unit and an infrared receiving unit which are alternately arranged, wherein the infrared emission unit is used for emitting infrared rays, and the infrared receiving unit is used for receiving the reflected infrared rays; And the processing unit is electrically connected with the infrared sensor and is used for receiving the induction signal of the infrared sensor and determining whether the grinding liquid residual liquid exists on the upper surface or not based on the induction signal.
2. 2. The polishing pad of claim 1, wherein a distance between adjacent infrared emitting units and infrared receiving units is 0.1mm to 5mm, and a wavelength range of infrared rays emitted from the infrared emitting units is 850nm to 1550nm.
3. 3. The polishing pad according to claim 1, wherein the polishing grooves have a depth of 5mm to 10mm and a width of 1mm to 10mm, and wherein the polishing grooves provided with the infrared sensor have a width larger than the polishing grooves not provided with the infrared sensor.
4. 4. A polishing pad according to claim 3, wherein the infrared sensor has a height less than the depth of the polishing grooves.
5. 5. The polishing pad of claim 1, wherein the polishing pad is a circular polishing pad.
6. 6. The polishing pad of claim 1, wherein the infrared sensor is encapsulated with a water and corrosion resistant material and has a surface coated with a wear resistant coating.
7. 7. The polishing pad of claim 1, wherein the infrared sensor is disposed in a polishing groove remote from a center of the polishing pad.
8. 8. The polishing pad of claim 1, further comprising: and the feedback control unit is used for triggering the cleaning operation of the grinding pad according to the determination result of the processing unit.
9. 9. A polishing system comprising a polishing pad according to claim 1 to 8.
10. 10. The grinding system of claim 9, further comprising: the bearing table is used for bearing the grinding pad; the grinding head is used for fixing the device to be ground; The surface to be ground of the device to be ground is contacted with the upper surface of the grinding pad, so that the surface to be ground of the device to be ground is ground when the grinding pad rotates.

Description

Grinding pad and grinding system Technical Field The embodiment of the application relates to the technical field of semiconductors, in particular to a polishing pad and a polishing system. Background With the continuous development of industry, planarization processes are becoming popular in the production of various devices, and chemical mechanical polishing processes are often used in industry in planarization processes. The Chemical Mechanical Polishing (CMP) process is specifically performed by attaching a Polishing pad to a Polishing platen, supplying a Polishing liquid with a chemical to the Polishing pad, applying pressure to a Polishing article (e.g., a semiconductor wafer) to be tightly attached to the Polishing pad, and driving the Polishing article and the Polishing pad to move relative to each other. Under the combined influence of mechanical friction caused by relative motion and the chemical action of the grinding fluid, part of surface layer materials of the grinding object are removed, so that the surface of the grinding object tends to be flat, and the purpose of planarization is achieved. However, the polishing effect of the polishing pad is still to be improved. Disclosure of utility model In view of the above, embodiments of the present application provide a polishing pad and a polishing system for improving polishing effect of the polishing pad. In order to achieve the above purpose, the embodiment of the present application provides the following technical solutions. In a first aspect, an embodiment of the present application provides a polishing pad, including: The upper surface is used for grinding a device to be ground, and the lower surface is used for fixing the grinding pad to a preset position, wherein a plurality of grinding grooves are formed in the upper surface; The infrared sensor is arranged in at least one grinding groove, surrounds an effective grinding area of the grinding pad, and comprises an infrared emission unit and an infrared receiving unit which are alternately arranged, wherein the infrared emission unit is used for emitting infrared rays, and the infrared receiving unit is used for receiving the reflected infrared rays; And the processing unit is electrically connected with the infrared sensor and is used for receiving the induction signal of the infrared sensor and determining whether the grinding liquid residual liquid exists on the upper surface or not based on the induction signal. Optionally, the distance between the adjacent infrared emission units and the infrared receiving unit is 0.1mm to 5mm, and the wavelength range of the infrared emitted by the infrared emission units is 850nm to 1550nm. Optionally, the depth of the grinding groove is 5mm to 10mm, and the width of the grinding groove is 1mm to 10mm, wherein the width of the grinding groove provided with the infrared sensor is larger than the width of the grinding groove not provided with the infrared sensor. Optionally, the infrared sensor has a height less than the depth of the grinding groove. Optionally, the polishing pad is a circular polishing pad. Optionally, the infrared sensor is encapsulated by waterproof and anti-corrosion materials, and the surface of the infrared sensor is coated with an abrasion-resistant coating. Optionally, the infrared sensor is disposed in a polishing groove away from a center of the polishing pad. Optionally, the method further comprises: and the feedback control unit is used for triggering the cleaning operation of the grinding pad according to the determination result of the processing unit. In a second aspect, embodiments of the present application provide a polishing system comprising a polishing pad as described above. Optionally, the method further comprises: the bearing table is used for bearing the grinding pad; the grinding head is used for fixing the device to be ground; The surface to be ground of the device to be ground is contacted with the upper surface of the grinding pad, so that the surface to be ground of the device to be ground is ground when the grinding pad rotates. Compared with the prior art, the technical scheme of the embodiment of the application has the following advantages: The embodiment of the application provides a polishing pad and a polishing system, wherein the polishing pad comprises an upper surface and a lower surface which are opposite, the upper surface is used for polishing a device to be polished, the lower surface is used for fixing the polishing pad to a preset position, a plurality of polishing grooves are formed in the upper surface, an infrared sensor is arranged in at least one polishing groove and surrounds an effective polishing area of the polishing pad, the infrared sensor comprises an infrared emitting unit and an infrared receiving unit which are alternately arranged, the infrared emitting unit is used for emitting infrared rays, the infrared receiving unit is used for receiving the reflected infrared rays, an