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CN-224223601-U - Semiconductor wafer thinning device convenient for replacing grinding wheel

CN224223601UCN 224223601 UCN224223601 UCN 224223601UCN-224223601-U

Abstract

The utility model discloses a semiconductor wafer thinning device convenient for replacing grinding wheels, which comprises a flange plate body, wherein the lower end of the flange plate body is connected with a transmission shaft, the upper end of the flange plate body is provided with a metal ceramic gradient composite filling layer, a plurality of positive pole magnetic blocks are buried in the metal ceramic gradient composite filling layer, the upper end of the flange plate body is provided with a grinding wheel body, the lower end of the grinding wheel body is provided with a positioning mechanism, the positioning mechanism is clamped on the flange plate body, and the grinding wheel body is provided with a modified epoxy resin composite filling layer. The utility model not only can realize quick assembly and disassembly, but also can ensure the stability and the firmness of the assembly, and can improve the uniformity of magnetic force distribution, ensure the uniform distribution of the assembly locking force and the balance between the flange plate and the grinding wheel body, realize the working conditions of high temperature resistance and high speed resistance, and greatly improve the service life of the grinding wheel.

Inventors

  • FENG SHUANGYONG

Assignees

  • 河南省聚创磨具有限公司

Dates

Publication Date
20260512
Application Date
20250413

Claims (6)

  1. 1. The utility model provides a semiconductor wafer attenuate device convenient to change emery wheel, includes ring flange body (9), its characterized in that, the lower extreme of ring flange body (9) is connected with transmission shaft (10), the upper end of ring flange body (9) is equipped with metal ceramic gradient composite filling layer (7), a plurality of anodal magnetic path (8) have been buried in metal ceramic gradient composite filling layer (7), the upper end of ring flange body (9) is equipped with emery wheel body (1), the lower extreme of emery wheel body (1) is equipped with positioning mechanism, the positioning mechanism joint is on ring flange body (9), be equipped with modified epoxy composite filling layer (3) on emery wheel body (1), equidistant a plurality of magnetism adsorption structures that are equipped with in modified epoxy composite filling layer (3), and magnetism adsorption structure corresponds with anodal magnetic path (8).
  2. 2. The semiconductor wafer thinning device convenient for replacing grinding wheels according to claim 1, wherein the positioning mechanism comprises a positioning column (4) fixed at the lower end of the grinding wheel body (1), four clamping plates (6) are fixed at equal intervals on one circle of the positioning column (4), positioning grooves (11) are formed in the upper end of the flange plate body (9), four clamping grooves (12) are formed at equal intervals on one circle of the positioning grooves (11), the positioning column (4) is clamped in the positioning grooves (11), and one clamping plate (6) on the same side is clamped in one clamping groove (12) on the same side.
  3. 3. The semiconductor wafer thinning device convenient for replacing grinding wheels according to claim 2, wherein the lower end bottom of the positioning column (4) is provided with a quantum dot fluorescent mark (5).
  4. 4. The semiconductor wafer thinning device convenient for replacing grinding wheels according to claim 1, wherein the magnetic adsorption structure comprises 8-12 negative pole magnetic blocks (2) which are arranged in the modified epoxy resin composite filling layer (3) at equal intervals, the negative pole magnetic blocks (2) and the positive pole magnetic blocks (8) are mutually adsorbed, a second mounting groove is formed in the lower end of the grinding wheel body (1), and the modified epoxy resin composite filling layer (3) is arranged in the second mounting groove.
  5. 5. The semiconductor wafer thinning device convenient for replacing grinding wheels according to claim 1, wherein the flange plate body (9) is provided with a first mounting groove (13), and the metal ceramic gradient composite filling layer (7) is arranged in the first mounting groove (13).
  6. 6. The semiconductor wafer thinning device convenient for replacing grinding wheels according to claim 1, wherein 5-8 small magnetic blocks (14) are arranged on the flange plate body (9) at equal intervals.

Description

Semiconductor wafer thinning device convenient for replacing grinding wheel Technical Field The utility model relates to the technical field of semiconductor wafer thinning machines, in particular to a semiconductor wafer thinning device convenient for replacing grinding wheels. Background The operation of the grinding wheel of the wafer thinning machine depends on ‌ multi-stage grinding parameter regulation ‌ and ‌ precise mechanical design ‌, and the thickness of the wafer is thinned from the initial 775 mu m to below 50 mu m through layering processing of rough grinding (efficient material removal), fine grinding (damage reduction) and polishing (surface quality improvement), and meanwhile, the structural integrity and packaging suitability ‌ are ensured. At present, when rough grinding, the grinding wheel and the flange plate are mounted on the main shaft by using the traditional bolts and the mechanical locking structure, in order to ensure the mounting stability, the grinding wheel and the flange plate are usually fixed by adopting a locking nut in a left-handed thread mode, but the mode is very inconvenient when the grinding wheel is periodically replaced for maintenance and repair, the grinding wheel is easy to be damaged unnecessarily due to collision of a spanner, meanwhile, the labor cost is increased, and therefore, the semiconductor wafer thinning device convenient for replacing the grinding wheel is provided to solve the problems. Disclosure of utility model The utility model aims to solve the defects in the prior art, and provides a semiconductor wafer thinning device convenient for replacing grinding wheels. In order to achieve the above purpose, the present utility model adopts the following technical scheme: The utility model provides a semiconductor wafer attenuate device convenient to change emery wheel, includes the ring flange body, the lower extreme of ring flange body is connected with the transmission shaft, the upper end of ring flange body is equipped with the compound filling layer of cermet gradient, a plurality of positive pole magnetic path have been buried underground in the compound filling layer of cermet gradient, the upper end of ring flange body is equipped with the emery wheel body, the lower extreme of emery wheel body is equipped with positioning mechanism, positioning mechanism joint is on the ring flange body, be equipped with the compound filling layer of modified epoxy on the emery wheel body, equidistant a plurality of magnetism adsorption structures that are equipped with in the compound filling layer of modified epoxy, and magnetism adsorption structure and positive pole magnetic path correspond. Preferably, the positioning mechanism comprises a positioning column fixed at the lower end of the grinding wheel body, four clamping plates are fixed at equal intervals on one circle of the positioning column, positioning grooves are formed in the upper end of the flange plate body, four clamping grooves are formed at equal intervals on one circle of the positioning grooves, the positioning column is clamped in the positioning grooves, and one clamping plate on the same side is clamped in one clamping groove on the same side. Preferably, quantum dot fluorescent markers are arranged at the bottom of the lower end of the positioning column. Preferably, the magnetic adsorption structure comprises 8-12 negative pole magnetic blocks which are arranged in the modified epoxy resin composite filling layer at equal intervals, the negative pole magnetic blocks and the positive pole magnetic blocks are mutually adsorbed, a second mounting groove is formed in the lower end of the grinding wheel body, and the modified epoxy resin composite filling layer is arranged in the second mounting groove. Preferably, a first mounting groove is formed in the flange plate body, and the metal ceramic gradient composite filling layer is arranged in the first mounting groove. Preferably, the modified epoxy resin composite filling layer is formed by combining bi-component high-temperature-resistant epoxy resin, boron nitride nano-sheets and carbon fiber chopped filaments. Preferably, the metal ceramic gradient composite filling layer is composed of a contact layer, a transition layer and an outer layer, wherein the contact layer is sintered by copper powder and silver paste, the transition layer is compounded by aluminum oxide ceramic particles and epoxy resin, and the outer layer is a silicon nitride coating. Preferably, 5-8 small magnetic blocks are arranged on the flange plate body at equal intervals. In the utility model, the modified epoxy resin composite filling layer is composed of a matrix material and a reinforcing filler, wherein the matrix material is bi-component high-temperature-resistant epoxy resin and is resistant to temperature of 280 ℃, the reinforcing filler is boron nitride nano-sheets (15-20wt%) and is used for improving the heat conductivity coefficient to 6.8W/m.K, reducing