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CN-224224216-U - Wafer cutting device

CN224224216UCN 224224216 UCN224224216 UCN 224224216UCN-224224216-U

Abstract

The application discloses a wafer cutting device. The wafer cutting device comprises a processing table, a cutting tool and a lens assembly. The processing table is provided with a bearing part for bearing a piece to be cut and a moving part arranged above the bearing part, the cutting tool is arranged on the moving part and moves under the drive of the moving part to at least cut the piece to be cut, the lens component is arranged on the moving part and is positioned on the side edge of the cutting tool, and the lens component comprises at least two lenses which are arranged side by side, and the magnification of one of the at least two lenses is larger than that of the other lens. The wafer cutting device provided by the application at least can solve the problems of low cutting precision and low cutting efficiency of the wafer caused by the fact that a lens in the wafer cutting device in the prior art cannot normally identify a processed object.

Inventors

  • MO WENLIANG
  • ZHOU CHUNQIANG
  • HUANG YEHUA
  • WEI ZIFENG

Assignees

  • 中机(泉州)精密装备有限公司

Dates

Publication Date
20260512
Application Date
20250526

Claims (10)

  1. 1. A wafer dicing apparatus, comprising: A processing table (51), wherein a bearing component (511) for bearing a piece to be cut and a moving component (512) arranged above the bearing component (511) are arranged on the processing table (51); A cutting tool (52), wherein the cutting tool (52) is arranged on the moving component (512) and is driven by the moving component (512) to move so as to at least cut the workpiece to be cut; The lens assembly (53), the lens assembly (53) install in moving part (512) and be located the side of cutting tool (52), the lens assembly (53) include at least two lenses that set up side by side, at least two the magnification of one of them lens is greater than the magnification of another.
  2. 2. The wafer cutting device according to claim 1, wherein the lens assembly (53) comprises a first lens (531), a second lens (532), a first connecting member (533), a second connecting member (534), a first air supply structure (535) and a second air supply structure (536), wherein a first through hole (5331) is provided in the first connecting member (533), a second through hole (5341) is provided in the second connecting member (534), the first lens (531) is mounted in the first through hole (5331), the second lens (532) is mounted in the second through hole (5341), the first air supply structure (535) is arranged on the first connecting member (533) away from the second lens (532), and the second air supply structure (536) is arranged on the second connecting member (534) away from the first lens (531).
  3. 3. The wafer cutting apparatus of claim 2, wherein the first air supply structure (535) comprises a first air supply line (5351) and a second air supply line (5352), the first air supply line (5351) being disposed in the first connection member (533) and extending into the first through hole (5331), the second air supply line (5352) being disposed in the first connection member (533) and extending to the bottom of the first lens (531), and/or, The second air supply structure (536) comprises a third air supply pipeline (5361) and a fourth air supply pipeline (5362), wherein the third air supply pipeline (5361) is arranged in the second connecting piece (534) and extends to the inside of the second through hole (5341), and the fourth air supply pipeline (5362) is arranged in the second connecting piece (534) and extends to the bottom of the second lens (532).
  4. 4. The wafer cutting device according to claim 3, wherein the lens assembly (53) further comprises a first annular light source (537) and a second annular light source (538), wherein the first annular light source (537) is disposed at the bottom of the first connection member (533) coaxially with the first connection member (533), the first air supply line (5351) being tangent to the peripheral side wall of the first lens (531) near the center line of the port of the first through hole (5331), and/or, The second annular light source (538) is arranged at the bottom of the second connecting piece (534) and is coaxially arranged with the second annular light source (538), and the center line of the third air supply pipeline (5361) close to the port of the second through hole (5341) is tangential with the peripheral side wall of the second lens (532).
  5. 5. The wafer cutting device according to claim 4, wherein the first annular light source (537) has a first tapered hole (5371) inside, the first tapered hole (5371) communicates with the first through hole (5331), and a cross-sectional area of the first tapered hole (5371) gradually increases in a direction away from the first lens (531), the second air supply line (5352) includes a first connection section (5352 a), a second connection section (5352 b), and a third connection section (5352 c), the first connection section (5352 a) extends to a bottom of the first annular light source (537) in a height direction of the first connection member (533), the second connection section (5352 b) is connected perpendicularly to the first connection section (5352 a) and extends to an outer edge of the bottom of the first tapered hole (5371), the third connection section (5352 c) is connected to the second connection section (5352 b) and extends toward the first tapered lens (531) or toward the first tapered hole (537), The second annular light source (538) is internally provided with a second conical hole (5381), the second conical hole (5381) is communicated with the second through hole (5341), the cross-sectional area of the second conical hole (5381) is gradually increased along the direction away from the second lens (532), the fourth air supply pipeline (5362) comprises a fourth connecting section (5362 a), a fifth connecting section (5362 b) and a sixth connecting section (5362 c), the fourth connecting section (5362 a) extends to the bottom of the second annular light source (538) along the height direction of the second connecting piece (534), the fifth connecting section (5362 b) is vertically connected with the fourth connecting section (5362 a) and extends to the outer edge of the bottom of the second conical hole (5381), and the sixth connecting section (5362 c) is connected with the fifth connecting section (5362 b) and extends towards the direction away from the second lens (532) and is close to the axis of the sixth conical section (5362 c).
  6. 6. The wafer dicing apparatus according to claim 1, further comprising a first rail member (54) extending in a first direction, the processing table (51) being provided to the first rail member (54) and movable in the first direction; The moving part (512) comprises a mounting frame (5121), a first positioning part (5122), a second positioning part (5123), a first driving part (5124) and a second driving part (5125), at least two lenses are mounted on the first positioning part (5122) and are sequentially distributed along a first direction, the first driving part (5124) is mounted on the second positioning part (5123) and is in driving connection with the first positioning part (5122) so as to drive the first positioning part (5122) to move along the height direction of the wafer cutting device, and the second driving part (5125) is mounted on the mounting frame (5121) and is in driving connection with the second positioning part (5123) so as to drive the second positioning part (5123) to move along a second direction perpendicular to the first direction, and the first direction, the second direction and the height direction are perpendicular to each other.
  7. 7. The wafer dicing apparatus according to claim 6, wherein the first driving means (5124) comprises: A first driving member (5124 a), the first driving member (5124 a) being mounted to the second positioning portion (5123); And the first transmission mechanism (5124 b), the first transmission mechanism (5124 b) is connected with the first driving piece (5124 a) and extends along the height direction, and the first positioning part (5122) is installed on the first transmission mechanism (5124 b) and moves along the length direction of the first transmission mechanism (5124 b) under the driving of the first driving piece (5124 a).
  8. 8. The wafer cutting device according to claim 7, wherein the first driving member (5124 a) comprises a first driving motor or a first driving cylinder, and the first transmission mechanism (5124 b) comprises a first screw mechanism or a first slider mechanism.
  9. 9. The wafer dicing apparatus according to claim 6, wherein the second driving means (5125) comprises: A second driving member (5125 a), the second driving member (5125 a) being mounted to the mounting bracket (5121); And the second transmission mechanism (5125 b), the second transmission mechanism (5125 b) is connected with the second driving piece (5125 a) and extends along the second direction, and the second positioning part (5123) is installed on the second transmission mechanism (5125 b) and moves along the length direction of the second transmission mechanism (5125 b) under the driving of the second driving piece (5125 a).
  10. 10. The wafer cutting device according to claim 9, wherein the second driving member (5125 a) comprises a second driving motor or a second driving cylinder, and the second transmission mechanism (5125 b) comprises a second screw mechanism or a second slider mechanism.

Description

Wafer cutting device Technical Field The application relates to the technical field of ultra-precise machining, in particular to a wafer cutting device. Background The wafer cutting machine is generally provided with a lens module for accurate position positioning of the processed object and quality inspection of the processed object during processing. When the cutting machine is used for processing, more water mist and dust are generated at the processing part, so that the lens on the lens module is easily polluted by the water mist and the dust, the lens module cannot normally identify the processed object, and the processing precision of the cutting machine is finally affected. In addition, in the related art, only a low power mirror or only a high power mirror is provided for observation in a part of the wafer dicing apparatus. However, in the actual operation process, the accuracy is obviously insufficient when the low-power lens is used for observation, the visual field range is very narrow when the high-power lens is used for observation, and the target cutting area is difficult to find, so that the cutting accuracy and efficiency are reduced. Disclosure of utility model The present application is directed to a wafer dicing apparatus, and at least to solve the problem that the lens in the wafer dicing apparatus in the prior art cannot normally identify the processed object, resulting in low dicing accuracy and dicing efficiency of the wafer. According to an aspect of the present application, there is provided a wafer cutting apparatus including: The processing table is provided with a bearing part for bearing a piece to be cut and a moving part arranged above the bearing part; The cutting tool is arranged on the moving component and moves under the drive of the moving component so as to at least cut the piece to be cut; The lens assembly is arranged on the movable part and positioned on the side edge of the cutting tool, and comprises at least two lenses which are arranged side by side, wherein the magnification of one of the at least two lenses is larger than that of the other lens. Further, the lens assembly comprises a first lens, a second lens, a first connecting piece, a second connecting piece, a first air supply structure and a second air supply structure, wherein a first through hole is formed in the first connecting piece, a second through hole is formed in the second connecting piece, the first lens is installed in the first through hole, the second lens is installed in the second through hole, the first air supply structure is deviated from the second lens and is arranged on the first connecting piece, and the second air supply structure is deviated from the first lens and is arranged on the second connecting piece. Further, the first air supply structure comprises a first air supply pipeline and a second air supply pipeline, wherein the first air supply pipeline is arranged on the first connecting piece and extends into the first through hole, the second air supply pipeline is arranged on the first connecting piece and extends to the bottom of the first lens, and/or, The second air supply structure comprises a third air supply pipeline and a fourth air supply pipeline, the third air supply pipeline is arranged on the second connecting piece and extends to the second through hole, and the fourth air supply pipeline is arranged on the second connecting piece and extends to the bottom of the second lens. Further, the lens assembly further comprises a first annular light source and a second annular light source, wherein the first annular light source is arranged at the bottom of the first connecting piece and is coaxially arranged with the first connecting piece, the central line of the first air supply pipeline, which is close to the port of the first through hole, is tangential to the peripheral side wall of the first lens, and/or, The second annular light source is arranged at the bottom of the second connecting piece and is coaxial with the second annular light source, and the center line of the third air supply pipeline, which is close to the port of the second through hole, is tangential to the peripheral side wall of the second lens. Further, the first annular light source is internally provided with a first taper hole which is communicated with the first through hole, the cross section area of the first taper hole is gradually increased along the direction deviating from the first lens, the second air supply pipeline comprises a first connecting section, a second connecting section and a third connecting section, the first connecting section extends to the bottom of the first annular light source along the height direction of the first connecting piece, the second connecting section is vertically connected with the first connecting section and extends to the outer edge of the bottom of the first taper hole, the third connecting section is connected with the second connecting section a