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CN-224224217-U - Semiconductor diamond cutting disc structure capable of rapidly cooling

CN224224217UCN 224224217 UCN224224217 UCN 224224217UCN-224224217-U

Abstract

The application provides a but quick cooling's semiconductor diamond cutting dish structure relates to diamond cutting dish technical field, including the connection pad, one side of connection pad is provided with diamond cutting dish main part, a plurality of heat conduction grooves have been seted up to diamond cutting dish main part's top, install diamond cutting dish main part and heat dissipation dish in the top of connection pad through fixing bolt, and fix the connection pad in the driving motor top, for realizing quick cooling, unique heat conduction groove has been seted up to diamond cutting dish main part's top, the heat conduction groove is radial evenly distributed, extend to the edge from the disk body center, quantity is according to disk body size setting, the heat conduction groove can guarantee efficient heat conduction, can not influence the structural strength of disk body again, the cell wall is through meticulously polishing, in order to reduce the thermal resistance, make the heat that produces in the cutting process can be rapidly along the heat conduction groove to the disk body surface, create the advantage for follow-up heat dissipation.

Inventors

  • FENG CANJUN
  • Wan Anwa

Assignees

  • 佳睿福钻石(河南)有限公司

Dates

Publication Date
20260512
Application Date
20250321

Claims (8)

  1. 1. But rapid cooling's semiconductor diamond cutting dish structure, its characterized in that includes: Connection pad (1), one side of connection pad (1) is provided with diamond-impregnated disc main part (2), a plurality of heat conduction grooves (3) have been seted up to the top of diamond-impregnated disc main part (2), one side of diamond-impregnated disc main part (2) is provided with cooling plate (4), one side inner wall fixed mounting of cooling plate (4) has bearing (5), the inboard fixed mounting of bearing (5) has loose axle (6), the outside fixed mounting of loose axle (6) has a plurality of heat dissipation impeller (7), the front side fixed mounting of diamond-impregnated disc main part (2) has a plurality of heat conduction post (8), the one end fixed connection of heat conduction post (8) is in the outside of cooling plate (4).
  2. 2. The rapid cooling semiconductor diamond cutting disc structure according to claim 1, wherein a plurality of connecting threaded holes (9) are formed in the upper parts of the connecting disc (1), the diamond cutting disc main body (2) and the radiating disc (4), and the diamond cutting disc main body (2) and the radiating disc (4) are mounted above the connecting disc (1) through bolts.
  3. 3. The rapid cooling semiconductor diamond cutting disc structure according to claim 1, wherein the diamond cutting disc body (2) comprises a carbon fiber reinforced layer (10), a tungsten steel alloy lining layer (11), a boron fiber reinforced composite material layer (12), a high-strength alloy steel inner layer (13) and a copper-molybdenum alloy heat conducting layer (14), the tungsten steel alloy lining layer (11) is fixedly connected to one side of the diamond cutting disc body (2), the tungsten steel alloy lining layer (11) is fixedly connected to one side of the carbon fiber reinforced layer (10), the boron fiber reinforced composite material layer (12) is fixedly connected to one side of the tungsten steel alloy lining layer (11), the high-strength alloy steel inner layer (13) is fixedly connected to one side of the boron fiber reinforced composite material layer (12), and the copper-molybdenum alloy heat conducting layer (14) is fixedly connected to one side of the high-strength alloy steel inner layer (13).
  4. 4. The rapid cooling semiconductor diamond cutting disc structure according to claim 1, wherein the heat dissipation disc (4) comprises a nano silver coating (15), and the nano silver coating (15) is fixedly connected to the inner side of the heat dissipation disc (4).
  5. 5. A rapid cooling semiconductor diamond cutting disc structure according to claim 3, wherein the carbon fiber reinforcement layer (10) is made of carbon fiber, and the tungsten steel alloy lining layer (11) is made of tungsten steel alloy.
  6. 6. A rapid cooling semiconductor diamond cutting disc structure according to claim 3, wherein the material of the boron fiber reinforced composite material layer (12) is boron fiber, the material of the high strength alloy steel inner layer (13) is alloy steel, and the material of the copper-molybdenum alloy heat conduction layer (14) is copper-molybdenum alloy.
  7. 7. The rapid cooling semiconductor diamond cutting disk structure as set forth in claim 4, wherein the nano silver coating (15) is made of silver.
  8. 8. The rapid cooling semiconductor diamond cutting disc structure according to claim 1, wherein the heat dissipation impeller (7) is made of aluminum alloy, and the heat dissipation impeller (7) is streamline.

Description

Semiconductor diamond cutting disc structure capable of rapidly cooling Technical Field The utility model relates to the technical field of diamond cutting discs, in particular to a semiconductor diamond cutting disc structure capable of rapidly cooling. Background In semiconductor manufacturing, diamond cutting disks are a common cutting tool used to cut semiconductor wafers and the like into specific sizes and shapes. However, during dicing, a large amount of heat is generated due to high-speed friction between the dicing disc and the semiconductor material. If the heat cannot be timely dissipated, the temperature of the cutting disc is increased sharply, and a series of problems are caused. On one hand, the high temperature can aggravate the abrasion of the diamond cutting disc, reduce the service life of the diamond cutting disc and increase the production cost. On the other hand, the excessively high temperature is transferred to the semiconductor material, which may cause thermal deformation of the semiconductor material, affect the crystal structure and electrical properties inside the semiconductor material, and result in degradation of the quality and yield of the semiconductor device after dicing. The traditional diamond cutting disc has obvious defects in heat dissipation design, is low in heat dissipation efficiency by means of natural air cooling or simple water cooling, cannot meet strict requirements on rapid cooling in the semiconductor cutting process, so that research and development of the semiconductor diamond cutting disc structure with the efficient heat dissipation function and capable of rapidly cooling has important practical significance, and therefore the semiconductor diamond cutting disc structure capable of rapidly cooling is provided. Disclosure of utility model In view of the above, the present application provides a semiconductor diamond cutting disc structure capable of rapidly cooling down, which solves the above technical problems to a certain extent. In order to achieve the above purpose, the present utility model adopts the following technical scheme: The utility model provides a but quick cooling's semiconductor diamond cutting dish structure, includes the connection pad, one side of connection pad is provided with the diamond cutting dish main part, a plurality of heat conduction grooves have been seted up to the top of diamond cutting dish main part, one side of diamond cutting dish main part is provided with the heat dissipation dish, one side inner wall fixed mounting of heat dissipation dish has the bearing, the inboard fixed mounting of bearing has the loose axle, the outside fixed mounting of loose axle has a plurality of heat dissipation impellers, the front side fixed mounting of diamond cutting dish main part has a plurality of heat conduction posts, the one end fixed connection of heat conduction post is in the outside of heat dissipation dish. Preferably, a plurality of connecting threaded holes are formed in the upper parts of the connecting disc, the diamond cutting disc main body and the radiating disc, and the diamond cutting disc main body and the radiating disc are mounted above the connecting disc through bolts. Preferably, the diamond cutting disc main body comprises a carbon fiber reinforced layer, a tungsten steel alloy lining layer, a boron fiber reinforced composite material layer, a high-strength alloy steel inner layer and a copper-molybdenum alloy heat conduction layer, wherein the tungsten steel alloy lining layer is fixedly connected to one side of the diamond cutting disc main body, the tungsten steel alloy lining layer is fixedly connected to one side of the carbon fiber reinforced layer, the boron fiber reinforced composite material layer is fixedly connected to one side of the tungsten steel alloy lining layer, the high-strength alloy steel inner layer is fixedly connected to one side of the boron fiber reinforced composite material layer, and the copper-molybdenum alloy heat conduction layer is fixedly connected to one side of the high-strength alloy steel inner layer. Preferably, the heat dissipation plate comprises a nano silver coating, and the nano silver coating is fixedly connected to the inner side of the heat dissipation plate. Preferably, the carbon fiber reinforced layer is made of carbon fiber, and the tungsten steel alloy lining layer is made of tungsten steel alloy. Preferably, the material of the boron fiber reinforced composite material layer is boron fiber, the material of the high-strength alloy steel inner layer is alloy steel, and the material of the copper-molybdenum alloy heat conduction layer is copper-molybdenum alloy. Preferably, the nano silver coating is made of silver. Preferably, the heat dissipation impeller is made of aluminum alloy, and the heat dissipation impeller is streamline. Compared with the prior art, the utility model has the beneficial effects that: (1) The utility model relates to a semiconduct